Plastic housing composition for embedding semicondutor devices in a plastic housing and use of the plastic housing composition

• US 20070054530A1
• Filed: 08/29/2006
• Published: 03/08/2007
• Est. Priority Date: 09/02/2005
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Mahler, Joachim, Haimerl, Alfred, Kessler, Angela, Schober, Wolfgang, Bauer, Michael
• Granted Patent: US 7,728,053 B2
• Time in Patent Office: Days
• US Class Current: 439/277
• CPC Class Codes: B29C 45/0001 characterised by the choice of material
• CPC Class Codes: B29C 45/0013 using fillers dispersed in the moulding material, e.g. metal particles
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29K 2101/10 Thermosetting resins
• CPC Class Codes: C08J 3/241 Preventing premature crosslinking by physical separation of components, e.g. encapsulation
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A plastic housing composition for embedding semiconductor devices in a plastic housing includes a multicomponent plastic material, where at least one component is distributed in the plastic material in drop-shaped and/or spherical units. The drop-shaped and/or spherical units are surrounded by dimensionally stable sheaths made from a plastic sheath material. The multicomponent plastic further includes a reactive curing system that cures when the plastic sheaths are torn open. The dimensionally stable plastic sheath material is deformation-sensitive, so that the sheaths tear open under mechanical deformation loading, which initiates and/or accelerates the curing process.

Claims

1. A plastic housing composition for embedding semiconductor devices in a plastic housing, the plastic housing composition comprising a multicomponent plastic material and including at least a first component distributed throughout the multicomponent plastic material as a plurality of drop-shaped and/or spherical units, each of the drop-shaped and/or spherical units being surrounded by a dimensionally stable plastic sheath so as to isolate the first component from other components in the multicomponent plastic material, and wherein the multicomponent plastic material further comprises a reactive curing system including a second component that reacts with the first component so as to cure the multicomponent plastic material upon the plastic sheath being torn open to expose the first component to the second component, the plastic sheath being dissolution-resistant with respect to each component of the multicomponent plastic material and being deformation-sensitive so as to tear open when subjected to a selected amount of mechanical deformation loading of the plastic sheath.

2. The plastic housing composition of claim 1, wherein the reactive curing system comprising an amine-based curing system.

3. The plastic housing composition of claim 1, wherein the first component surrounded by the plastic sheath includes a catalyst material of the reactively curing system.

4. The plastic housing composition of claim 1, wherein the first component surrounded by plastic sheath includes a curing agent of the reactively curing system.

5. The plastic housing composition of claim 1, wherein the first component surrounded by the plastic sheath includes a catalyst and a curing agent of the reactively curing system.

6. The plastic housing composition of claim 1, wherein the first component surrounded by the plastic sheath includes a resin material of the reactively curing system.

7. The plastic housing composition of claim 1, wherein the first component surrounded by the plastic sheath includes a resin material and a catalyst material of the reactively curing system.

8. The plastic housing composition of claim 1, wherein the multicomponent plastic material of the plastic housing composition further comprises filler particles, and a proportion of filler particles is in an amount of up to 80% by volume of the plastic housing composition.

9. An apparatus for forming a molded structure comprising:

the plastic housing composition of claim 1;

a mold for the plastic housing;

components of at least one semiconductor device arranged in the mold; and

a nozzle configured to dispense the plastic housing composition within the mold so as to embed the components of the at least one semiconductor device, wherein the nozzle includes at least one passage through which the plastic housing composition is dispensed, and the at least one passage has a cross-sectional dimension that is smaller than a cross-sectional dimension of the drop-shaped and/or spherical units surrounded by plastic sheaths.

10. The apparatus of claim 9, wherein the at least one passage comprises a mesh of a screen that is arranged upstream a nozzle outlet and through which the drop-shaped and/or spherical units surrounded by plastic sheaths are pressed prior to the plastic housing composition emerging from the nozzle.

11. The apparatus of claim 9, wherein the at least one passage includes a passage hole arranged upstream of a nozzle outlet and through which the drop-shaped and/or spherical units surrounded by plastic sheaths are pressed prior to the plastic housing composition emerging from the nozzle.

12. A method for producing at least one plastic housing using a multicomponent plastic housing composition, the method comprising:

forming the multicomponent plastic housing composition by mixing a plurality of components together, the plurality of components including a first component distributed throughout the multicomponent plastic material as a plurality of drop-shaped and/or spherical units, each of the drop-shaped and/or spherical units being surrounded by a plastic sheath so as to isolate the first component from other components in the multicomponent plastic material, and a reactive curing system including a second component that reacts with the first component so as to cure the multicomponent plastic material upon the plastic sheath material being torn open to expose the first component to the second component;

pressing the plastic housing composition through at least one passage of a dispensing nozzle, wherein a cross-sectional area of the at least one passage is smaller than cross-sectional areas of the drop-shaped and/or spherical units surrounded by plastic sheaths, such that the plastic sheaths tear open under mechanical deformation loading as the plastic housing composition is pressed through the at least one passage;

dispensing the multicomponent plastic composition from the dispensing nozzle into a mold, wherein the mold includes contours of the plastic housing and components of at least one semiconductor device to be embedded within the multicomponent plastic composition; and

curing the plastic housing composition via reaction of at least the first component with the second component in the mold to form the plastic housing for at least one semiconductor device.

13. The method of claim 12, wherein filler particles are added during the formation of the multicomponent plastic housing composition.

14. The method of claim 12, wherein at least some of the plurality of components of the multicomponent plastic housing composition are cooled prior to mixing and/or during mixing together to from the multicomponent plastic housing composition.

15. The method of claim 12, wherein the mold is cooled during curing of the plastic housing composition to maintain the plastic housing composition at a temperature that is no greater than room temperature.