Method of controlling contact load in electronic component mounting apparatus

• US 20070056157A1
• Filed: 08/31/2005
• Published: 03/15/2007
• Est. Priority Date: 09/01/2004
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Ueno, Yasuharu, Morikawa, Makoto, Yoshida, Hiroyuki, Hirata, Shuichi, Yoshida, Noriaki
• Granted Patent: US 7,513,036 B2
• Time in Patent Office: Days
• US Class Current: 29/593
• CPC Class Codes: B23K 3/087 Soldering or brazing jigs, fixtures or clamping means
• CPC Class Codes: B23K 37/047 moving work to adjust its position between soldering, welding or cutting steps B23K37/053 takes precedence
• CPC Class Codes: H01L 2224/75502 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/49137 Different components
• CPC Class Codes: Y10T 29/53187 Multiple station assembly apparatus

Abstract

A method of controlling contact load in an apparatus for mounting electronic components on a substrate includes moving a head holding an electronic component down by a predetermined distance. Contact load is measured after moving the head down. A determination is made as to whether the measured contact load has reached the target contact load. The moving and measuring are repeated until the measured contact load reaches the predetermined target contact load.

Claims

1-6. -6. (canceled)

7. A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head holding an electronic component is lowered at a first speed to a first position where the electronic component does not contact the substrate, and is lowered at a second speed slower than the first speed from the first position until a predetermined target contact load is detected, the method comprising:

moving the head down by a predetermined distance at the second speed,

measuring contact load after moving the head down, and

determining whether the measured contact load has reached the target contact load, the moving and measuring being repeated until the measured contact load reaches the predetermined target contact load.

8. The method of controlling contact load in an apparatus for mounting electronic components according to claim 7, further comprising:

halting the head for a predetermined period of time after moving the head down and before measuring the contact load.

9. The method of controlling contact load in an apparatus for mounting electronic components according to claim 7, wherein

the predetermined distance is adjustably set in accordance with the target contact load.

10. The method of controlling contact load in an apparatus for mounting electronic components according to claim 7, wherein

the predetermined distance is set at a first predetermined distance when the measured contact load is zero, and is set at a second predetermined distance when the measured contact load exceeds zero, the second predetermined distance being smaller than the first predetermined distance.

11. The method of controlling contact load in an apparatus for mounting electronic components according to claim 10, wherein

the second predetermined distance is adjustably set in accordance with a difference between the measured contact load and the target contact load.

12. The method of controlling contact load in an apparatus for mounting electronic components according to claim 7, wherein

when the measured contact load is the same as the previously measured contact load after the measured contact load exceeds zero, the measuring of the contact load is repeated until a different contact load is measured.