Strap/inlay insertion method and apparatus

• US 20070056683A1
• Filed: 09/08/2006
• Published: 03/15/2007
• Est. Priority Date: 09/09/2005
• Status: Abandoned Application

• Current Assignee: Delaware Capital Formation Incorporated (Dover Corporation)
• Original Assignee: Delaware Capital Formation Incorporated (Dover Corporation)
• Inventors: Howard, John, Manes, Kevin
• Application Number:
  US11/517,576
• Publication Number:
  US 20070056683A1
• Time in Patent Office: Days
• US Class Current: 156/264
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: Y10T 156/1075 of plural laminae from single stock and assembling to each other or to additional lamina

Abstract

An apparatus and a method are disclosed for forming an electrical component construction, the method comprising: obtaining a chip webstock containing a plurality of integrated circuit chips; obtaining a label webstock having printed label graphics thereon; cutting the chip webstock into a plurality of chip sections, each of the chip sections including at least one integrated circuit chip; indexing the chip sections from a high density on the chip webstock to a lower density; attaching each of a plurality of the different chip sections on a different label on the label webstock; obtaining an electrical component webstock comprising electrical components on a web; and attaching each of a plurality of the electrical components relative to a different one of the integrated circuit chips on the label webstock to permit an electrical communication therebetween.

Claims

1. A method of forming an electrical component construction, comprising:

obtaining a chip webstock containing a plurality of integrated circuit chips;

obtaining a label webstock having printed label graphics thereon;

cutting the chip webstock into a plurality of chip sections, each of the chip sections including at least one integrated circuit chip;

indexing the chip sections from a high density on the chip webstock to a lower density;

attaching each of a plurality of the different chip sections on a different label on the label webstock;

obtaining an electrical component webstock comprising electrical components on a web; and

attaching each of a plurality of the electrical components relative to a different one of the integrated circuit chips on the label webstock to permit an electrical communication therebetween.

2. The method as defined in claim 1, wherein the electrical component webstock has an component pitch that is consistent with a label pitch of said label webstock;

and

wherein the attaching each of the electrical components step comprises

marrying the electrical component webstock to the label webstock after the chip sections have been attached to the label webstock.

3. The method as defined in claim 2, wherein the attaching each of a plurality of the different chip sections step comprises attaching the different chip sections on a side opposite to the label graphics of the label webstock.

4. The method as defined in claim 1, wherein the attaching each of the electrical components step comprises

cutting the electrical component webstock to obtain component sections, each component section containing at least one electrical component;

indexing the pitch of the component sections to a pitch of the labels on the label webstock; and

attaching the component sections relative to a different one of the integrated circuit chips on the label webstock to permit an electrical communication therebetween.

5. The method as defined in claim 1, wherein the integrated circuit chips are RFID chips and the electrical components are antennas.

6. The method as defined in claim 1, further comprising

after obtaining the chip webstock step, attaching a bonding tape over each of a plurality of the integrated circuit chips.

7. The method as defined in claim 1, further comprising holding the cut chip sections in a continuous relief formed around a circumference of the vacuum drum in at least one of the cutting the chip webstock and indexing the chip sections steps.

8. The method as defined in claim 1, wherein for at least one of the cutting the chip webstock and indexing the chip sections steps comprises holding the cut chip sections on a vacuum drum with a chip side of the chip sections facing a drum surface of the vacuum drum.

9. The method of claim 7, further comprising advancing the chip webstock to the vacuum drum at a velocity slower than a surface speed of the vacuum drum, thereby causing the chip webstock to slide on the vacuum drum.

10. The method as defined in claim 1, wherein the cutting the chip webstock step comprises cutting the chip webstock using a first vaccum drum traveling at a first surface velocity;

and

wherein the indexing the chip sections step comprises transferring the cut chip sections to a second vacuum drum traveling at a different surface velocity relative to the first vacuum drum to index a pitch of the chip sections to a pitch of the labels on the label webstock.

11. The method as defined in claim 1, wherein the cutting the chip webstock step comprises cutting the chip webstock using a knife;

and

wherein the indexing the chip sections step comprises transferring the cut chip sections to a vacuum drum traveling at a surface velocity to index a pitch of the chip sections to a pitch of the labels on the label webstock.

12. The method as defined in claim 1, wherein the obtaining the electrical component webstock step comprises

printing antenna patterns on a substrate, with each antenna pattern having at least one connection pad;

and

dispensing a conductive adhesive onto at least the one connection pad of the antenna patterns.

13. The method as defined in claim 1, further comprising laminating a release liner onto the electrical components on a back of the label webstock.

14. An apparatus for forming an electrical construction, comprising:

a cutting apparatus for cutting a chip webstock containing integrated circuit chips into a plurality of chip sections, each of the chip sections including at least one integrated circuit chip;

a first vacuum drum designed to receive chip sections with a side with the integrated circuit chip facing a surface of the first vacuum drum, the first vacuum drum designed for indexing the chip sections from a high density of the chip webstock to a lower density, and at a nip attaching each of a plurality of the different chip sections adjacent to a different label on the label webstock;

an electrical component attaching device for attaching or forming an electrical component on a substrate to form an electrical component webstock; and

an attaching mechanism for attaching each of a plurality of the electrical components relative to a different one of the integrated circuit chips on the label webstock to permit an electrical communication therebetween.

15. The apparatus as defined in claim 14, wherein the electrical component attaching or forming device comprises an antenna printer for printing antenna patterns on a substrate to form the electrical component webstock;

16. The apparatus as defined in claim 14, wherein the electrical component webstock has a component pitch that is consistent with a label pitch of said label webstock;

and

wherein the attaching mechanism comprises a laminating roll for marrying the electrical component webstock to the label webstock after the chip sections have been attached thereto.

17. The apparatus as defined in claim 14, wherein the attaching mechanism comprises

a cutting mechanism for cutting the electrical component webstock to obtain component sections that are indexed to a pitch of the labels on the label webstock, each component section containing at least one electrical component;

and

a second vacuum drum for attaching the component sections relative to a different one of the chip sections on the label webstock to permit an electrical communication therebetween.

18. The apparatus as defined in claim 17, wherein the cutting mechanism is a cutting roll.

19. The apparatus as defined in claim 17, wherein the cutting mechanism is a knife.

20. The apparatus as defined in claim 14, further comprising at least one printer for printing label graphics on a substrate web to form the label webstock.

21. The apparatus as defined in claim 14, further comprising a servo-controlled chip webstock feed mechanism for advancing the chip webstock to the first vacuum drum for cutting the chip webstock into chip sections and indexing the chip sections, the servo-controlled chip webstock feed mechanism advancing the chip webstock at a velocity slower than a surface speed of the first vacuum drum, thereby causing the chip webstock to slide on the first vacuum drum.

22. The apparatus as defined in claim 14,

wherein the cutting apparatus for cutting the chip webstock comprises a cutting roll and a third vacuum drum traveling at a first surface velocity and designed to function as an anvil for cutting the chip webstock;

and

means for transferring the chip sections that are cut to first vacuum drum traveling at a different surface velocity relative to the third vacuum drum to index a pitch of the chip sections to a pitch of the labels on the label webstock.