Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones

• US 20070056843A1
• Filed: 09/13/2005
• Published: 03/15/2007
• Est. Priority Date: 09/13/2005
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Ye, Yan, White, John, Hosokawa, Akihiro, Le, Hienminh
• Application Number:
  US11/225,923
• Publication Number:
  US 20070056843A1
• Time in Patent Office: Days
• US Class Current: 204/192.100
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: C23C 14/352 using more than one target C23C14/56 takes precedence

Abstract

The present invention generally provides a method for processing a surface of a substrate in a physical vapor deposition (PVD) chamber that has a sputtering target that has separately biasable sections, regions or zones to improve the deposition uniformity. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one or more DC or RF power sources. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one power source and one or more resistive, capacitive and/or inductive elements. In one aspect, the processing chamber contains a multizone target assembly that has one or more ports that are adapted deliver a processing gas to the processing region of the PVD chamber. In one aspect, the processing chamber contains a multizone target assembly that has one or more magnetron assemblies positioned adjacent to one or more of the target sections.

Claims

1. A method of depositing a thin film on a large area substrate, comprising:

electrically biasing a first target section of a multizone target assembly at a first bias using a first power supply;

electrically biasing a second target section of the multizone target assembly at a second bias using a second power supply; and

controlling the deposition profile received on a substrate surface by controlling the bias delivered by the first power supply and the second power supply.

2. The method of claim 1, wherein the large area substrate has a processing surface that has surface area that is at least 19,500 cm².

3. The method of claim 1, wherein controlling the deposition profile comprises:

adjusting the magnitude of the first bias as a function of time, wherein the magnitude of first bias at a first time is equal to X; and

adjusting the magnitude of the second bias as a function of time, wherein the magnitude of second bias at a first time is equal to Z, wherein the magnitude of X is greater than Z.

4. The method of claim 1, wherein controlling the deposition profile comprises:

modulating the power delivered to a first target section at a first pulse frequency and at a first bias power level using the first power supply;

modulating the power delivered to a second target section at a second pulse frequency and at a second bias power level using the second power supply; and

synchronizing the modulation of the power to the first target section and the second target section to improve the uniformity of the deposition process completed on the substrate.

5. The method of claim 1, further comprising:

cooling the first target section and the second target section by bringing a heat exchanging fluid in thermal contact with the first target and second target sections.

6. The method of claim 1, further comprising:

providing a process gas to the processing region through a port formed in the first target section, the second target section, or a gap formed between the first target section and the second target section.

7. The method of claim 1, further comprising:

biasing an RF biasable element positioned within a substrate support using a RF power source.

8. A method of depositing a thin film on a substrate, comprising:

electrically biasing a first target section of a multizone target assembly at a first bias using a first power supply;

electrically biasing a second target section of a multizone target assembly at a second bias using a second power supply;

positioning a first magnetron assembly over the first target section using a first actuator, wherein a magnet in the first magnetron is magnetically coupled to a processing region that is adjacent to a surface of the first target section;

positioning a second magnetron assembly over the second target section using a second actuator, wherein a magnet in the second magnetron is magnetically coupled to the processing region that is adjacent to a surface of the second target section; and

controlling the deposition profile received on a substrate surface by controlling the first bias delivered by the first power supply, the second bias delivered by the second power supply, the position of the first magnetron assembly and the position of the second magnetron assembly.

9. The method of claim 8, wherein the magnet in the first magnetron or the magnet in the second magnetron is an electromagnet.

10. The method of claim 8, wherein controlling the deposition profile comprises:

adjusting the magnetic field strength delivered to a processing region that is adjacent to the first target section using a first electromagnet.

11. The method of claim 8, wherein the magnitude of the first bias is greater than the magnitude of the second bias.

12. The method of claim 8, further comprising:

providing a process gas to the processing region through a port formed in the first target section, the second target section, or a gap formed between the first target section and the second target section.

13. A method of depositing a thin film on a substrate, comprising:

providing a process gas to a processing region through a port formed in a multizone target assembly, wherein the processing region is formed between the multizone target assembly and a substrate positioned on a substrate support; and

depositing a layer onto a surface of the substrate positioned on the substrate support by biasing a first target region of the multizone target assembly at a first bias and a second target region of the multizone target assembly at a second bias, wherein the first bias voltage is more cathodic than the second bias voltage.

14. A method of depositing a thin film on a substrate, comprising:

electrically biasing a first target section of a multizone target assembly at a first bias using a first power supply;

electrically biasing a second target section of a multizone target assembly at a second bias using a second power supply; and

positioning a magnetron assembly over the first target section and the second target section using an actuator, wherein a first magnet in the magnetron assembly is magnetically coupled to a processing region that is adjacent to a surface of the first target section and a second magnet in the magnetron assembly is magnetically coupled to a processing region that is adjacent to a surface of the second target section;

controlling the deposition profile received on a substrate surface by controlling the first bias delivered by the first power supply, the second bias delivered by the second power supply, and the position of the magnetron assembly.

15. The method of claim 14, where in controlling the deposition profile comprises:

adjusting the magnetic field strength delivered from the first magnet to the processing region that is adjacent to the first target section, wherein the first magnet is an electromagnet.

16. The method of claim 14, further comprising:

providing a process gas to the processing region through a port formed in the first target section, the second target section, or a gap formed between the first target section and the second target section.