Large-area magnetron sputtering chamber with individually controlled sputtering zones

• US 20070056850A1
• Filed: 09/13/2005
• Published: 03/15/2007
• Est. Priority Date: 09/13/2005
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Ye, Yan, White, John, Hosokawa, Akihiro, Le, Hienminh
• Application Number:
  US11/225,922
• Publication Number:
  US 20070056850A1
• Time in Patent Office: Days
• US Class Current: 204/298.120
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: C23C 14/352 using more than one target C23C14/56 takes precedence

Abstract

The present invention generally provides an apparatus for processing a surface of a substrate in a physical vapor deposition (PVD) chamber that has a sputtering target that has separately biasable sections, regions or zones to improve the deposition uniformity. In general, aspects of the present invention can be used for flat panel display processing, semiconductor processing, solar cell processing, or any other substrate processing. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one or more DC or RF power sources. In one aspect, each of the target sections of the multizone target assembly are biased at a different cathodic biases by use of one power source and one or more resistive, capacitive and/or inductive elements. In one aspect, the processing chamber contains a multizone target assembly that has one or more ports that are adapted deliver a processing gas to the processing region of the PVD chamber. In one aspect, the processing chamber contains a multizone target assembly that has one or more magnetron assemblies positioned adjacent to one or more of the target sections.

Claims

1. A plasma processing chamber assembly for depositing a layer on a rectangular large area substrate that has a processing surface surface area of at least 19,500 cm², comprising:

a substrate support having a substrate receiving surface that has a central region and an edge region, wherein the substrate receiving surface is in contact with a processing region;

a target assembly comprising;

a first target section having a processing surface this is in contact with the processing region and is positioned adjacent to the central region of the substrate receiving surface; and

a second target section having a processing surface this is in contact with the processing region and is positioned adjacent to the edge region of the substrate receiving surface; and

a power source assembly that is adapted to electrically bias the first target section at a first cathodic bias and the second target section at a second cathodic bias, wherein the first cathodic bias and the second cathodic bias are formed relative to a anodic surface positioned in the processing region.

2. The plasma processing chamber assembly of claim 1, wherein the power source assembly comprises:

a first power source coupled to the first target section, wherein the first power source is adapted to apply a first cathodic bias to the first target assembly relative to an anode surface positioned in the processing region; and

a second power source coupled to the second target section, wherein the second power source is adapted to apply a second cathodic bias to the second target assembly relative to the anode surface.

3. The plasma processing chamber assembly of claim 2, wherein the first power source or the second power source is an RF power source.

4. The plasma processing chamber assembly of claim 1, wherein the power source assembly comprises:

a power source in electrical communication with the first target section and the second target section, wherein the power source is adapted to electrically bias the first target section and the second target section; and

one ore more power controlling devices that are in electrical communication with the power source and the first target section or the power source and the second target section, wherein the one or more power controlling devices comprise at least one of the following elements;

a resistor, a capacitor or an inductor.

5. The plasma processing chamber assembly of claim 1, wherein the first target section or the second target section comprise a plurality of plates that are in electrical communication with each other.

6. The plasma processing chamber assembly of claim 1, further comprising:

a magnetron assembly that is adapted to provide a magnetic field to the processing region through the first and second target sections.

7. The plasma processing chamber assembly of claim 6, wherein the average magnetic field strength in the processing region near the first target section is stronger than the average magnetic field strength in the processing region near the second target section.

8. The plasma processing chamber assembly of claim 1, further comprising:

a magnetron assembly that comprises;

a first magnet that is magnetically coupled to a first region of the processing region that is adjacent to a surface of the first target section.

9. A physical vapor deposition chamber assembly for depositing a layer on a large area substrate comprising:

a target assembly comprising;

one or more electrically insulating plates;

two or more target sections that each have a first surface that is in contact with a processing region and a second surface that is in thermal contact with the one or more electrically insulating plates; and

one or more gas ports that are in fluid communication with a gas source and the processing region, wherein at least one of the one or more gas ports is formed in at least one of the one or more electrically insulating plates;

a plurality of power sources, each of the power sources coupled to at least one of the two or more target sections; and

a substrate support positioned inside the physical vapor deposition processing chamber and having a substrate receiving surface, wherein a surface of a substrate positioned on the substrate receiving surface can be positioned to contact the processing region.

10. The physical vapor deposition chamber assembly of claim 10, wherein the one or more gas ports are adapted to deliver a gas between two of the two or more target sections or through a passage formed in at least one of the two or more target sections.

11. The physical vapor deposition chamber assembly of claim 10, wherein the gas source is adapted to deliver a processing gas containing at least one of the following gases:

argon, nitrogen, oxygen, hydrogen or helium.

12. The physical vapor deposition chamber assembly of claim 10, wherein at least one of the one or more electrically insulating plates has a channel formed therein that is in fluid communication with a heat exchanging fluid source.

13. A physical vapor deposition chamber assembly for depositing a layer on a large area substrate comprising:

a target assembly comprising;

one or more electrically insulating plates; and

a first target section that has a first surface that is in contact with a processing region and a second surface that is in thermal contact with the one or more electrically insulating plates, wherein a first target section comprises a plurality of plates that are in electrical communication with each other; and

a second target section that has a first surface that is in contact with a processing region and a second surface that is in thermal contact with the one or more electrically insulating plates, wherein a second target section comprises a plurality of plates that are in electrical communication with each other;

a power source assembly that is adapted to electrically bias the first target section at a first cathodic bias and the second target section at a second cathodic bias, wherein the first cathodic bias and the second cathodic bias are formed relative to a anodic surface positioned in the processing region; and

a substrate support positioned inside the plasma processing chamber and having a substrate receiving surface, wherein a surface of a substrate positioned on the substrate receiving surface is in contact with the processing region.

14. The physical vapor deposition chamber assembly of claim 13, wherein the power source assembly uses at least one RF power source or at least one DC power source to create the first cathodic bias and the second cathodic bias.

15. A plasma processing chamber assembly for depositing a layer on a large area substrate comprising:

a substrate support having a substrate receiving surface that has a central region and an edge region, wherein the substrate receiving surface is in contact with a processing region;

a target assembly comprising;

a first target section having a processing surface this is in contact with the processing region and is positioned adjacent to the central region of the substrate receiving surface; and

a second target section having a processing surface this is in contact with the processing region and is positioned adjacent to the edge region of the substrate receiving surface;

a power source assembly that is adapted to electrically bias the first target section at a first cathodic bias and the second target section at a second cathodic bias, wherein the first cathodic bias and the second cathodic bias are formed relative to an anodic surface positioned in the processing region; and

a magnetron assembly having one or more magnets that are positioned proximate to the first target section, wherein the one or more magnets are magnetically coupled to the processing region adjacent to the processing surface of the first target section.

16. The plasma processing chamber assembly of claim 15, wherein the one or more magnets is an electromagnet.

17. The plasma processing chamber assembly of claim 15, wherein the magnetron assembly can be positioned in a plane generally parallel to the processing surface by use of a magnetron actuator.

18. The plasma processing chamber assembly of claim 15, further comprising a second magnetron assembly having one or more magnets that are positioned proximate to the second target section, wherein the one or more magnets are magnetically coupled to the processing region adjacent to the processing surface of the second target section.

19. The plasma processing chamber assembly of claim 18, wherein the second magnetron assembly can be positioned in a plane generally parallel to the processing surface by use of a second magnetron actuator.

20. The plasma processing chamber assembly of claim 15, wherein a first target section is surrounded by a second target section.