Condenser microphone and packaging method for the same
First Claim
1. A silicone based condenser microphone comprising:
- a metal case which includes a sound hole;
a board which is mounted with a Micro Electro Mechanical System (MEMS) microphone chip and an application specific integrated circuit (ASIC) chip having a electric voltage pump and a buffer IC and is formed with a connecting pattern for joining with the metal case;
a fixing means for fixing the metal case to the board; and
an adhesive for applying to the whole part where the metal case fixed to the board by the fixing means is joined with the board to bond the metal case to the board.
1 Assignment
0 Petitions
Accused Products
Abstract
Disclosed is a silicone based condenser microphone comprising: a metal case which includes a sound hole, a board which is mounted with a MEMS microphone chip and an ASIC chip having an electric voltage pump and a buffer IC and is formed with a connecting pattern for joining with the metal case. A fixing material for fixing the metal case to the board, and an adhesive for applying to the whole part where the metal case fixed to the board by the fixing material is joined with the board to bond the metal case to the board. Therefore, the metal case is tack-welded to the board by a laser to fix the case to the board and then the case is bonded to the board with the adhesive, thereby decreasing an inferiority ratio and strengthening a joining force and thus enhancing a mechanical firmness and highly resisting noise from the outside.
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Citations
20 Claims
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1. A silicone based condenser microphone comprising:
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a metal case which includes a sound hole;
a board which is mounted with a Micro Electro Mechanical System (MEMS) microphone chip and an application specific integrated circuit (ASIC) chip having a electric voltage pump and a buffer IC and is formed with a connecting pattern for joining with the metal case;
a fixing means for fixing the metal case to the board; and
an adhesive for applying to the whole part where the metal case fixed to the board by the fixing means is joined with the board to bond the metal case to the board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 12, 13, 14)
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10. A method for packaging a silicone based condenser microphone, the method comprising the steps of:
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inputting a board which is mounted with a Micro Electro Mechanical System (MEMS) chip and an application specific integrated circuit (ASIC) chip and is formed with a connecting pattern;
inputting a metal case;
aligning the metal case on the connecting pattern of the board;
fixing the metal case to the connecting pattern of the board by provisional spot welding;
bonding the metal case to the connecting pattern where the metal case fixed to the board is joined with the board with an adhesive; and
curing the adhesive.
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11. A silicone based condenser microphone comprising:
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a metal case having a bottom surface which is closed;
a board which is formed with a sound hole for collecting an external sound and a sealing terminal for solder-sealing the sound hole to prevent distortion of a sound wave in the space between a main printed circuit board (PCB) and the microphone, the board being mounted with a Micro Electro Mechanical System (MEMS) microphone chip and an application specific integrated circuit (ASIC) chip having an electric voltage pump and a buffer IC, the board being formed with a connecting pattern for joining with the metal case;
a fixing means for fixing the metal case to the board; and
an adhesive for applying to a whole perimeter of the case where the metal case fixed to the board by the fixing means meets the board to bond the metal case to the board.
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15. A directional silicone condenser microphone comprising:
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a metal case which is formed with the first sound inlet hole for collecting the first sound;
a board which is formed with the second sound inlet hole for collecting a second sound, the board being mounted with a Micro Electro Mechanical System (MEMS) microphone chip and an application specific integrated circuit (ASIC) chip having a electric voltage pump and a buffer IC and being formed with a connecting pattern for joining with the metal case;
a phase delayer for delaying the phase of sound collected through the first sound inlet hole or the second sound inlet hole;
a fixing means for fixing the metal case to the board; and
an adhesive for applying to a whole perimeter of the case where the metal case fixed to the board by the fixing means meets the board to bond the metal case to the board. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification