Analysis method, exposure method, and device manufacturing method
First Claim
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1. An analysis method for analyzing an exposure defect of a substrate exposed via a liquid, the method comprising:
- a developing process, which develops the substrate;
a first measuring process, which measures a abnormality of the pre-development substrate;
a second measuring process, which measures a abnormality of the post-development substrate, and an analyzing process, which analyzes an exposure defect of the substrate exposed via the liquid based on a measurement result of the first measuring process and a measurement result of the second measuring process.
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Abstract
An analysis method includes a developing process (SA60), which develops the substrate, a first measuring process (SA50), which measures the abnormalities of the pre-development substrate, a second measuring process (SA70), which measures the abnormalities of the post-development substrate, and an analyzing process (SA80), which analyzes the exposure defects of a substrate exposed via a liquid based on the measurements results of the first measuring process (SA50) and the measurement results of the second measuring process (SA70).
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12 Claims
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1. An analysis method for analyzing an exposure defect of a substrate exposed via a liquid, the method comprising:
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a developing process, which develops the substrate;
a first measuring process, which measures a abnormality of the pre-development substrate;
a second measuring process, which measures a abnormality of the post-development substrate, and an analyzing process, which analyzes an exposure defect of the substrate exposed via the liquid based on a measurement result of the first measuring process and a measurement result of the second measuring process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 12)
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11. An exposure method that exposes a substrate via a liquid, the method comprising:
obtaining a relationship between a receding contact angle of the liquid on a film that forms the uppermost layer of the substrate prior to exposure of the substrate and a defect level of the post-exposure substrate.
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