MICROFABRICATED ELASTOMERIC VALVE AND PUMP SYSTEMS

• US 20070059494A1
• Filed: 10/25/2006
• Published: 03/15/2007
• Est. Priority Date: 06/28/1999
• Status: Abandoned Application

• Current Assignee: California Institute of Technology
• Original Assignee: California Institute of Technology
• Inventors: Unger, Marc, Quake, Stephen, Chou, Hou-Pu, Scherer, Axel, Thorsen, Todd
• Application Number:
  US11/552,644
• Publication Number:
  US 20070059494A1
• Time in Patent Office: Days
• US Class Current: 428/172
• CPC Class Codes: B01J 2219/00355 peristaltic
• CPC Class Codes: B01J 2219/00378 Piezoelectric or ink jet dispensers
• CPC Class Codes: B01J 2219/00396 Membrane valves
• CPC Class Codes: B01J 2219/00398 in multiple arrangements
• CPC Class Codes: B01J 2219/00439 using micromirror arrays
• CPC Class Codes: B01J 2219/005 Beads
• CPC Class Codes: B01J 2219/00527 Sheets
• CPC Class Codes: B01J 2219/00605 the compounds being directly bound or immobilised to solid supports
• CPC Class Codes: B01J 2219/00612 the surface being inorganic
• CPC Class Codes: B01J 2219/00659 Two-dimensional arrays
• CPC Class Codes: B01J 2219/00707 separated from the reactor apparatus
• CPC Class Codes: B01J 2219/00722 Nucleotides
• CPC Class Codes: B01J 2219/00725 Peptides
• CPC Class Codes: B01L 2200/025 Align devices or objects to ensure defined positions relative to each other
• CPC Class Codes: B01L 2200/027 for microfluidic devices
• CPC Class Codes: B01L 2200/0605 Metering of fluids
• CPC Class Codes: B01L 2200/10 Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
• CPC Class Codes: B01L 2300/0681 Filter
• CPC Class Codes: B01L 2300/0861 Configuration of multiple channels and/or chambers in a single devices
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2300/123 : Flexible; Elastomeric
• CPC Class Codes: B01L 2300/14 : Means for pressure control
• CPC Class Codes: B01L 2300/18 : Means for temperature control
• CPC Class Codes: B01L 2400/046 : Chemical or electrochemical formation of bubbles
• CPC Class Codes: B01L 2400/0481 : squeezing of channels or chambers
• CPC Class Codes: B01L 2400/0655 : pinch valves
• CPC Class Codes: B01L 2400/0688 : surface tension valves, capillary stop, capillary break
• CPC Class Codes: B01L 3/502707 : characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/50273 : characterised by the means or forces applied to move the fluids micropumps F04B19/006, of the membrane type F04B43/043
• CPC Class Codes: B01L 3/502738 : characterised by integrated valves microvalves F16K99/0001
• CPC Class Codes: B01L 7/54 : using spatial temperature gradients
• CPC Class Codes: B01L 9/527 : for microfluidic devices, e.g. used for lab-on-a-chip
• CPC Class Codes: B32B 2037/1081 : using a magnetic force
• CPC Class Codes: B32B 3/00 : Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
• CPC Class Codes: B81B 2201/036 : Micropumps
• CPC Class Codes: B81B 2201/054 : Microvalves
• CPC Class Codes: B81B 3/0032 : Structures for transforming energy not provided for in groups B81B3/0021 - B81B3/0029
• CPC Class Codes: B81B 3/0051 : For defining the movement, i.e. structures that guide or limit the movement of an element mechanical arrangements for preventing or damping vibration or shock H01H3/60
• CPC Class Codes: B81C 1/00119 : Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
• CPC Class Codes: B81C 2201/019 : Bonding or gluing multiple substrate layers
• CPC Class Codes: C12Q 1/6874 : involving nucleic acid arrays, e.g. sequencing by hybridisation
• CPC Class Codes: C12Q 2535/125 : Allele specific primer extension
• CPC Class Codes: F04B 43/043 : Micropumps
• CPC Class Codes: F04B 43/14 : having plate-like flexible members
• CPC Class Codes: F15C 5/00 : Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
• CPC Class Codes: F16K 2099/0074 : using photolithography, e.g. etching
• CPC Class Codes: F16K 2099/0076 : using electrical discharge machining [EDM], milling or drilling
• CPC Class Codes: F16K 2099/0078 : using moulding or stamping
• CPC Class Codes: F16K 2099/008 : Multi-layer fabrications
• CPC Class Codes: F16K 2099/0094 : Micropumps
• CPC Class Codes: F16K 99/0001 : Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0015 : Diaphragm or membrane valves
• CPC Class Codes: F16K 99/0046 : using magnets
• CPC Class Codes: F16K 99/0051 : using electrostatic means
• CPC Class Codes: F16K 99/0059 : actuated by a pilot fluid
• CPC Class Codes: Y10T 137/0491 : Valve or valve element assembling, disassembling, or replacing
• CPC Class Codes: Y10T 137/2224 : Structure of body of device
• CPC Class Codes: Y10T 137/87716 : For valve having a flexible diaphragm valving member
• CPC Class Codes: Y10T 137/87804 : Valve or deflector is tubular passageway
• CPC Class Codes: Y10T 137/87812 : Pivoted valve or deflector
• CPC Class Codes: Y10T 137/87893 : With fluid actuator
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1002 : with permanent bending or reshaping or surface deformation of self sustaining lamina
• CPC Class Codes: Y10T 156/1064 : Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 428/24479 : including variation in thickness
• CPC Class Codes: Y10T 428/2457 : Parallel ribs and/or grooves
• CPC Class Codes: Y10T 428/24612 : Composite web or sheet
• CPC Class Codes: Y10T 428/24744 : Longitudinal or transverse tubular cavity or cell

Abstract

A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Claims

1-5. -5. (canceled)

6. A composite structure comprising:

an elastomer component including at least one of a recess and a flexible membrane portion; and

a substantially planar nonelastomer component sealed against the elastomer component, the nonelastomer component including an active device interacting with at least one of the membrane portion and a material present in the recess.

7. The composite structure of claim 6 wherein the active device is an optical structure selected from the group consisting of a photodiode, a fiber optic device, a fiber optic interconnect, a light emitting diode, a laser diode, vertical cavity surface emitting laser (VCSEL), a micromirror, a CMOS imaging array, a CCD camera, a waveguide, and a source or a receiver for visible, infrared, or ultraviolet regions of the electromagnetic spectrum.

8. The composite structure of claim 6 wherein the active device is an electronic structure selected from the group consisting of a resistor, a capacitor, a transistor, a chemical field effect transistor, a amperometric/coulometric electrochemical sensor, an accelerometer, a pressure sensor, a flow sensor, an electronic logic structure, a microprocessor, a chemical sensor, a strain gauge, an inductor, an actuator, a coil, a magnet, an electromagnet, a magnetic sensor, a radio frequency source, a radio frequency receiver, a microwave frequency source, a microwave frequency receiver, a radioactive particle counter, and an electrometer.

9. The composite structure of claim 6 wherein the active device is a thermal structure selected from the group consisting of a thermistor, a Peltier cooler, and a resistive heater.

10. The composite structure of claim 6 wherein the active device is an electrode that electrostatically drives the membrane portion into the recess.

11-30. -30. (canceled)