Integrated process for sputter deposition of a conductive barrier layer, especially an alloy of ruthenium and tantalum, underlying copper or copper alloy seed layer

• US 20070059502A1
• Filed: 08/29/2006
• Published: 03/15/2007
• Est. Priority Date: 05/05/2005
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Wang, Wei, Tanaka, Yoichiro, Chung, Hua, Wang, Rongjun, Tang, Xianmin, Yu, Jick, Gopalraja, Praburam, Wang, Jenn
• Application Number:
  US11/511,869
• Publication Number:
  US 20070059502A1
• Time in Patent Office: Days
• US Class Current: 428/209
• CPC Class Codes: C23C 14/046 Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
• CPC Class Codes: C23C 14/0641 Nitrides C23C14/0617 takes precedence
• CPC Class Codes: C23C 14/165 by cathodic sputtering
• CPC Class Codes: H01L 21/2855 by physical means, e.g. sputtering, evaporation H01L21/28518 - H01L21/28537 and H01L21/28568 take precedence
• CPC Class Codes: H01L 21/76844 Bottomless liners
• CPC Class Codes: H01L 21/76846 Layer combinations
• CPC Class Codes: H01L 21/76858 by diffusing alloying elements
• CPC Class Codes: H01L 21/76873 for electroplating
• CPC Class Codes: H01L 23/485 consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts H01L23/4821, H01L23/4822, H01L23/4824, H01L23/4825 take precedence; materials H01L23/532, bond pads H01L24/02, bump connectors H01L24/10
• CPC Class Codes: H01L 23/53238 Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

A fabrication method and a product for the deposition of a conductive barrier or other liner layer in a vertical electrical interconnect structure. One embodiment includes within a a hole through a dielectric layer a barrier layer of RuTaN, an adhesion layer of RuTa, and a copper seed layer forming a liner for electroplating of copper. The ruthenium content is preferably greater than 50 at % and more preferably at least 80 at % but less than 95 at %. The barrier and adhesion layers may both be sputter deposited. Other platinum-group elements substitute for the ruthenium and other refractory metals substitute for the tantalum. Aluminum alloying into RuTa when annealed presents a moisture barrier. Copper contacts include different alloying fractions of RuTa to shift the work function to the doping type.

Claims

1. A method of forming a liner structure for a copper metallization, comprising:

providing a substrate having a hole formed in a dielectric layer;

a first step of forming a first barrier layer over at least sidewalls of the hole comprising an alloy of at least 5 at % of a refractory metal chosen from Groups IVB, VB, and VIB of the periodic table and at least 5 at % of a platinum-group metal chosen from Group VIIIB of the periodic table except iron; and

a second step of forming a copper seed layer over the adhesion layer which does not fill the hole.

2. The method of claim 1, further comprising a third step of forming a second barrier over at least the sidewalls comprising a nitride of the refractory metal and the platinum-group metal.

3. The method of claim 1, further comprising a third step of forming a second barrier layer between the first barrier layer and the sidewalls comprising tantalum nitride.

4. The method of claim 3, wherein the third step comprises atomic layer deposition of tantalum nitride.

5. The method of claim 1, wherein the first barrier layer contacts the dielectric layer and the copper seed layer.

6. The method of claim 1, wherein the copper seed layer comprises an alloy of copper and at least one of

7. The method of claim 1, wherein the hole is a p-contact hole overlying a p-doped semiconductor region of the substrate, the alloy comprises a first alloy, the first barrier layer forms a first contact layer at a bottom of the p-contact hole and the substrate further comprises an n-contact hole overlying an n-doped semiconductor region of the substrate, the method further comprising forming a second barrier layer over at least sidewalls of the n-contact hole, forming a n-contact layer at a bottom of n-contact hole, and comprising an alloy of at least 5 at % of a refractory metal chosen from Groups IVB, VB, and VIB of the periodic table and at least 5 at % of a platinum-group metal chosen from Group VIIIB of the periodic table except iron, wherein compositions of the first and second barrier layers are different and are chosen to correspond to doping types of the n-doped and p-doped semiconductor regions.

8. The method of claim 7, wherein the first and second barrier layers comprise tantalum and ruthenium, wherein a fraction of ruthenium is greater in the first barrier layer than in the second barrier layer and a fraction of tantalum is greater in the second barrier layer than in the first barrier layer.

9. The method of claim 1, wherein the refractory metal comprises tantalum and the platinum-group metal comprises ruthenium.

10. The method of claim 9, wherein the first and second steps are performed in a single sputter chamber having a target comprising ruthenium and tantalum.

11. The method of claim 9, wherein the barrier layer comprises greater than 50 at % and no more than 95 at % ruthenium.

12. The method of claim 11, wherein the barrier layer comprises between 80 and 95% ruthenium.

13. The method of claim 9, further comprising a subsequent step of filling the hole with copper in an electrochemical plating process.

14. A method of forming a liner structure for a copper metallization, comprising:

providing a substrate having a hole formed in a dielectric layer;

a first step of forming a first layer over at least sidewalls of the hole comprising tantalum and between 80 and 95 at % ruthenium.

15. The method of claim 14, further comprising a prior second step of forming a second layer comprising ruthenium tantalum nitride over at least the sidewalls of the hole.

16. The method of claim 15, further comprising a third step after the first step of forming a copper seed layer over the first layer which does not fill the hole.

17. The method of claim 14, wherein the first and second steps are performed in sputter chamber including a target comprising ruthenium and tantalum.

18. The method of claim 14, further comprising a subsequent step of forming a copper seed layer in the hole which does not fill the hole.

19. A metallization structure, comprising:

a dielectric layer formed over a substrate and including a hole over a conductive feature in the substrate;

a first layer comprising tantalum and between 80 and 95 at % ruthenium formed on at least sidewalls of the hole.

20. The structure of claim 19, further comprising a second layer formed between the first layer and the sidewalls of the hole comprising tantalum ruthenium nitride.

21. The structure of claim 20, further comprising a copper layer formed over the first layer within but not filling the hole.

22. The structure of claim 19, further comprising a copper layer formed over the first layer within but not filling the hole.

23. A metallization structure, comprising:

a dielectric layer formed over a substrate and including a hole over a conductive feature in the substrate;

a first layer formed on at least sidewalls of the hole and comprising an alloy of at least 5 at % of a refractory metal chosen from Groups IVB, VB, and VIB of the periodic table and aat least 5 at % of a platinum-group metal chosen from Group VIIIB of the periodic table except iron; and

a copper layer formed over the first layer within but not filling the hole.

24. The metallization structure of claim 23, wherein the alloy additionally comprises aluminum.

25. The metallization structure of claim 23, wherein the refractory metal comprises tantalum and the platinum-group metal comprises ruthenium.

26. The metallization structure of claim 25, wherein the alloy additionally comprises aluminum.

27. The metallization structure of claim 25, further comprising a second layer comprising ruthenium tantalum nitride formed between the first layer and the sidewalls of the hole.

28. The metallization structure of claim 25, wherein the first layer comprises at least 50 at % and no more than 95 at % of ruthenium.

29. The metallization structure of claim 28, wherein the first layer comprises at least 80 at % of ruthenium.