INDUCTIVE STRUCTURE

• US 20070062027A1
• Filed: 09/08/2006
• Published: 03/22/2007
• Est. Priority Date: 09/09/2005
• Status: Abandoned Application

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: Pulici, Paolo, Stoppino, Pier, Ripamonti, Giancarlo, Lessio, Tito, Vanalli, Gian
• Application Number:
  US11/530,320
• Publication Number:
  US 20070062027A1
• Time in Patent Office: Days
• US Class Current: 29/602.100
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/4911 the connectors being bonded to at least one common bonding area, e.g. daisy chain
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01028 Nickel [Ni]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: Y10T 29/4902 : Electromagnet, transformer or inductor

Abstract

An inductive structure having at least one winding or at least one coil and developed around a ferromagnetic core. Advantageously, the ferromagnetic core is formed by means of a multilayer ferromagnetic structure and the inductive structure is integrated in an electronic device. An inductor, a transformer, a sensor and a relay can be formed by means of the inductive structure proposed, as well as a method for integrating it in a package of an electronic device.

Claims

1. An inductive structure, comprising at least one winding including at least one coil and developed around a ferromagnetic core, the inductive structure integrated in a package of an electronic device, the ferromagnetic core formed by means of a ferromagnetic structure arranged above a substrate of the package.

2. The inductive structure according to claim 1 wherein said ferromagnetic structure comprises multiple layers.

3. The inductive structure according to claim 2 wherein said multilayer ferromagnetic structure comprises a plurality of layers of flat ferromagnetic material overlapped onto each other.

4. The inductive structure according to claim 3 wherein said multilayer ferromagnetic structure further comprises a plurality of layers of insulating material alternated to said plurality of layers of flat ferromagnetic material.

5. The inductive structure according to claim 4 wherein said layers of insulating material are realized in an adhesive material.

6. The inductive structure according to claim 1 wherein said multilayer ferromagnetic structure has a closed configuration that is substantially ring-like shaped.

7. The inductive structure according to claim 1 wherein said at least one coil comprises a first portion that includes a first portion of a metallization line realized in said package substrate, as well as a second portion, said second portion connecting a first end and a second end of said first portion to form coils of a continuous winding.

8. The inductive structure according to claim 7 wherein said second portion comprises a bonding wire.

9. The inductive structure according to claim 7 wherein said second portion comprises a portion of a further metallization line realized in a layer of said package substrate that is distinct from other layers of said package substrate wherein said metallization line is realized.

10. The inductive structure according to claim 9, comprising contact vias of said metallization line and of said further metallization line.

11. The inductive structure according to claim 1, comprising an insulating coating layer for said multilayer ferromagnetic structure.

12. The inductive structure according to claim 11 wherein said insulating coating layer coats said multilayer ferromagnetic structure in correspondence with a lower face thereof, arranged next to said package substrate, and to an upper face thereof that is opposite to said lower face.

13. The inductive structure according to claim 11 wherein said insulating coating layer coats said multilayer ferromagnetic structure in correspondence with all the faces thereof.

14. The inductive structure according to claim 11 wherein said insulating coating layer comprises an electrically insulating glue layer.

15. The inductive structure according to claim 1 wherein it comprises a transformer that includes a further winding arranged above said multilayer ferromagnetic structure.

16. The inductive structure according to claim 15 wherein said multilayer ferromagnetic structure has a closed configuration that is substantially ring-like in shape.

17. The inductive structure according to claim 1 wherein it comprises a sensor and said multilayer ferromagnetic structure has a substantially bar-like shape.

18. The inductive structure according to claim 1 wherein it comprises a relay that includes a first portion comprising said multilayer ferromagnetic structure whereon said winding is wound and a second triggering portion suitable to realize a switch.

19. The inductive structure according to claim 18 wherein said second triggering portion comprises at least a first wire comprising with a material sensitive to the magnetic field and with a second wire arranged next to this first wire, placed in turn inside a magnetic field generated by said first portion and able to move so as to contact said second wire.

20. The inductive structure according to claim 19 wherein said second wire comprises in a non-ferromagnetic material.

21. The inductive structure according to claim 19 wherein said first wire comprises a bonding wire.

22. The inductive structure according to claim 19 wherein said second wire comprises a bonding wire.

23. The inductive structure according to claim 19 wherein said first wire comprises a strip of ferromagnetic material equipped with a metallic tongue configured to move in a direction towards, and respectively away from, said second conductor.

24. The inductive structure according to claim 23 wherein said first and second wire are glued with a conductive glue or welded on a pad of said package substrate.

25. The inductive structure according to claim 18 wherein said second triggering portion comprises a protective plastic casing.

26. The inductive structure according to claim 25 wherein a void is created in said protective plastic casing.

27. The inductive structure according to claim 1 wherein said electronic device comprises a multichip device.

28. A method for integrating an inductive structure on a package substrate, comprising the steps of:

providing a package substrate;

forming in said package substrate at least one metallization line;

integrating on said package substrate at least one electronic device;

forming on said package substrate, an inductive structure next to said electronic device, further comprising the steps of;

depositing a multilayer ferromagnetic structure on said package substrate next to said electronic device; and

forming at least one coil of a winding of said integrated inductive structure by means of an electric connection of a portion of said metallization line.

29. The method according to claim 28 wherein said electric connection step of a portion of said metallization line comprises a bonding step for electrically connecting a first and a second end of one of said portions of said metallization line, said bonding step carried out above said multilayer ferromagnetic structure.

30. The method according to claim 29 wherein said bonding step is performed simultaneously with at least one bonding step of a process flow suitable for forming said electronic device.

31. The method according to claim 28 wherein said electric connection step of a portion of said metallization line comprises a routing step of at least a further portion of a further metallization line formed in another layer of said package substrate distinct from a first layer of said package substrate wherein said metallization line is formed.

32. The method according to claim 28 wherein said deposition step of said multilayer ferromagnetic structure on said package substrate comprises the step of:

depositing a plurality of layers of flat ferromagnetic material overlapped onto each other.

33. The method according to claim 28 wherein said deposition step of said multilayer ferromagnetic structure on said package substrate comprises the steps of:

depositing a plurality of layers of flat ferromagnetic material and a plurality of layers of adhesive material, overlapped onto each other in an alternated way.

34. The method according to claim 28 wherein said deposition step of said multilayer ferromagnetic structure on said package substrate can be realized simultaneously with at least one realization step of said electronic device.

35. The method according to claim 28 wherein it further comprises a coating step of said multilayer ferromagnetic structure by means of an insulating layer.

36. The method according to claim 35 wherein said coating step involves a lower face of said multilayer ferromagnetic structure arranged next to said package substrate and an upper face thereof that is opposite to said lower face.

37. The method according to claim 35 wherein said coating step involves all the faces of said multilayer ferromagnetic structure.

38. The method according to claim 35 wherein said electronic device is a multichip device.

39. A circuit, comprising:

a ferromagnetic core formed above a substrate of an integrated electronic device from a plurality of ferromagnetic layers disposed between layers of adhesive material in an integrated structure; and

at least one coil of electrically conductive material formed around the ferromagnetic core.

40. The circuit of claim 39 wherein the ferromagnetic core comprises a substantially ring-like closed ferromagnetic structure.

41. The circuit of claim 40, further comprising an insulating coating for the ferromagnetic core.

42. The circuit of claim 39 wherein the coil comprises a first portion having a metallization line formed in a substrate of the package and a second portion connecting first and second ends of the first portion to form a continuous winding of the coil.

43. The circuit of claim 42 wherein the second portion of the metallization line comprises a bonding wire.

44. The circuit of claim 39, further comprising a winding of electrically conductive material associated with the ferromagnetic core, the winding cooperating with the coil to form a transformer.

45. The circuit of claim 39, further comprising a switch comprising a strip of ferromagnetic material equipped with a metallic tongue configured to move in a direction toward, and respectively away from, a second conductor in response to a magnetic field generated by the coil.