Apparatus for downhole fluids analysis utilizing micro electro mechanical system (MEMS) or other sensors
First Claim
Patent Images
1. A MEMS or sensor package, comprising:
- a structural shell;
a ceramic printed circuit board at least partially disposed in the structural shell;
a sensor attached and electrically connected to the ceramic printed circuit board;
a first annular seal disposed between the ceramic printed circuit board and the structural shell.
2 Assignments
0 Petitions
Accused Products
Abstract
The present invention provides packaging for MEMS devices and other sensors for downhole application. The MEMS devices and/or other sensors may aid in characterizing formation fluids in situ. The packaging facilitates high temperature, high pressure use, which is often encountered in downhole environments.
-
Citations
27 Claims
-
1. A MEMS or sensor package, comprising:
-
a structural shell;
a ceramic printed circuit board at least partially disposed in the structural shell;
a sensor attached and electrically connected to the ceramic printed circuit board;
a first annular seal disposed between the ceramic printed circuit board and the structural shell. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. An apparatus for analyzing fluids in a formation surrounding a borehole, comprising:
-
a subterranean fluid analysis tool comprising a fluid analysis module;
a MEMS sensor disposed in the fluid analysis module, wherein the MEMS sensor is contained by a MEMS package;
the MEMS package comprising;
a structural shell;
a ceramic printed circuit board at least partially disposed in the structural shell and electrically connected to the MEMS sensor;
a first annular seal disposed between the ceramic printed circuit board and the structural shell, the first annular seal adapted to isolate a first portion of the ceramic circuit printed circuit board that is attached to the MEMS sensor from a second portion of the ceramic printed circuit board at pressures up to at least ten Kpsi. - View Dependent Claims (18, 19, 20, 21, 22)
-
-
23. A high temperature, high pressure downhole sensor, comprising:
-
a generally cylindrical ceramic circuit board having first and second portions and a first shoulder;
a sensor attached to the first portion for exposure to a high pressure subterranean environment;
an electrical component section attached to the second portion and exposed to atmospheric pressure;
a shell housing the ceramic circuit board and having a second shoulder bearing against the first shoulder of the ceramic circuit board;
a seal isolating the first portion from the second portion;
a cap having a hole covering the sensor. - View Dependent Claims (24, 25, 26, 27)
-
Specification