Cooling structure, heatsink and cooling method of heat generator

• US 20070062674A1
• Filed: 09/14/2006
• Published: 03/22/2007
• Est. Priority Date: 03/18/2005
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Yamada, Akira, Ippoushi, Shigetoshi, Yabunaka, Fumiharu, Maekawa, Hirotoshi
• Granted Patent: US 8,061,412 B2
• Time in Patent Office: Days
• US Class Current: 165/80.400
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20272 Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

Abstract

A cooling structure includes a heat dissipation structure 20 having a heat generator 8 and a heatsink 7 that is adhered through an insulating adhesive layer 6 to at least a surface of the heat generator 8 that faces a cooling fluid 9 and made of a metal foil having the flexibility; and a fluid flow path 5 that is disposed outside of the heat dissipation structure 20 so that the cooling fluid 9 flowing inside thereof and the heatsink 7 may directly come into contact. Furthermore, on a surface of the heatsink that directly comes into contact with the cooling fluid 9, a fine recess 15 is disposed.

Claims

1. A cooling structure that cools heat generated from a heat generator with a cooling fluid comprising:

a heat dissipation structure comprising;

a heat generator; and

a heatsink adhered through an insulating adhesive layer to at least a surface of the heat generator that faces a cooling fluid and made of a metal foil having the flexibility; and

a fluid flow path disposed outside of the heat dissipation structure so that the cooling fluid flowing inside thereof and the heatsink directly come into contact.

2. The cooling structure according to claim 1, wherein the heat dissipation structure is disposed inside of the fluid flow path.

3. The cooling structure according to claim 1, wherein the fluid flow path includes:

a cooling fluid intake port;

a cooling fluid flow path vessel provided with a flow path inside thereof and an aperture; and

a cooling fluid output port; and

the heat dissipation structure is disposed so that the heatsink thereof covers the aperture.

4. The cooling structure according to claim 1, wherein the heat dissipation structure includes;

a semiconductor element; and

two heat spreaders each disposed on each of both surfaces of the semiconductor element and on each of surfaces on sides opposite to the semiconductor element of which a heatsink made of a flexible metal foil is adhered through an insulating adhesive layer; and

fluid flow paths disposed outside of the heat spreader, each having a cooling fluid intake port, a cooling fluid flow path vessel provided with a flow path inside thereof and an aperture, and a cooling fluid output port, wherein the heat dissipation structure is disposed so that a heatsink of each of the heat spreaders covers the aperture of each of the fluid flow paths.

5. The cooling structure according to claim 1, wherein a fine recess intersects with a flow direction of the cooling fluid is disposed on a surface of the heatsink that directly comes into contact with the cooling fluid, and

wherein when viewed from a cross section of the fine recess along the flow direction of the cooling fluid, the fine recess is asymmetry.

6. The cooling structure according to claim 1, wherein a fine recess intersects with a flow direction of the cooling fluid is disposed on a surface of the heatsink that directly comes into contact with the cooling fluid, and

wherein the fine recess includes a portion where flowing area of the cooling fluid changes large and a portion where flowing area of the cooling fluid changes small.

7. The cooling structure according to claim 5, wherein a shape of the fine recess in a cross section along a flow direction of the cooling fluid is identical to a shape of the fine recess in a cross section along a direction intersecting with the flow direction of the cooling fluid.

8. The cooling structure according to claim 5, wherein the fine recess is provided to come close along the flow direction of the cooling fluid.

9. The cooling structure according to claim 5, comprising;

a bypass groove disposed along the flow direction of the cooling fluid and connected with the fine recess.

10. A heatsink directly coming into contact with a cooling fluid flowing a fluid flow path and exchanging heat with the cooling fluid, wherein a fine recess extending along a direction intersecting with a flow direction of the cooling fluid is disposed on a contact surface with the cooling fluid on a heat transfer surface of the heatsink.

12. The heatsink according to claim 10, wherein a shape of the fine recess in a cross section along a flow direction of the cooling fluid is identical to a shape of the fine recess in a cross section along a direction intersecting with the flow direction of the cooling fluid.

13. The heatsink according to claim 10, wherein the fine recess is provided to come close along the flow direction of the cooling fluid.

14. The heatsink according to claim 10, comprising;

a bypass groove disposed along the flow direction of the cooling fluid and connected with the fine recess.

15. The heatsink according to claim 10, wherein a substantial center portion of a surface of the heatsink provided with a fine recess faces a cooling fluid intake port therefrom the cooling fluid flows in the fluid flow path.

11. A heatsink directly coming into contact with a cooling fluid flowing a fluid flow path and exchanging heat with the cooling fluid,

wherein a fine recess extending along a direction intersecting with a flow direction of the cooling fluid is disposed on a contact surface with the cooling fluid on a heat transfer surface of the heatsink, and

wherein the fine recess includes a portion where flowing area of the cooling fluid changes large and a portion where flowing area of the cooling fluid changes small.

16. A cooling method of a heat generator, comprising

preparing a heat dissipation structure where a heatsink made of a metal foil having the flexibility is adhered on a surface of the heat generator through an insulating adhesive layer;

disposing the heat dissipation structure in a fluid flow path therethrough a cooling fluid flows so that the heatsink directly comes into contact with the cooling fluid.