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Method of forming circuit pattern on printed circuit board

  • US 20070062723A1
  • Filed: 09/01/2006
  • Published: 03/22/2007
  • Est. Priority Date: 09/02/2005
  • Status: Abandoned Application
First Claim
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1. A method of forming circuit patterns on a printed circuit board, the method comprising:

  • (a) applying etchant on portions of an insulation substrate where circuit patterns are to be formed;

    (b) curing the etchant by adjusting curing conditions;

    (c) applying metal ink in the etched circuit patterns; and

    (d) sintering the metal ink.

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