Laser assisted machining process with distributed lasers

• US 20070062920A1
• Filed: 09/07/2006
• Published: 03/22/2007
• Est. Priority Date: 09/07/2005
• Status: Active Grant

• Current Assignee: Yung Shin
• Original Assignee: Yung Shin
• Inventors: Shin, Yung
• Granted Patent: US 8,053,705 B2
• Time in Patent Office: Days
• US Class Current: 219/121.720
• CPC Class Codes: B23K 26/0823 Devices involving rotation of the workpiece
• CPC Class Codes: B23P 25/006 Heating the workpiece by laser during machining

Abstract

Laser assisted machining process and machine utilizing multiple distributed laser units that are strategically distributed around the workpiece being machined to simultaneously heat the workpiece, creating a desired temperature distribution for laser assisted machining. Sequential incremental heating from different directions and positions are used, resulting in longer tool life and shorter machining time.

Claims

1. A turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, comprising:

cutting material from the rotating workpiece with the cutting tool, thereby creating a chamfer on the rotating workpiece;

providing a first laser unit with independent operational control;

heating said chamfer with said first laser unit at a first point circumferentially ahead of the cutting tool;

providing a second laser unit with independent operational control;

heating the workpiece with said second laser unit at a second point, circumferentially ahead of said first point, sequentially incrementally heating the rotating workpiece; and

controlling temperature gradients within the workpiece with said independent operational controls of said first and second laser units.

2. The turning process of claim 1, wherein said first point is from about 10 to about 13 degrees circumferentially ahead of the cutting tool.

3. The turning process of claim 2, wherein said second point is about 55 degrees circumferentially ahead of the cutting tool.

4. The turning process of claim 1, wherein said heating of the workpiece with said second laser unit increases absorptivity of the rotating workpiece, thereby decreasing power requirements for said heating of the workpiece with said first laser unit.

5. A turning process utilizing multiple distributed lasers to assist a cutting tool in machining a rotating workpiece, comprising:

heating the rotating workpiece with a first laser unit at a first point circumferentially ahead of the cutting tool;

heating the rotating workpiece with a second laser unit at a second point circumferentially ahead of said first point;

independently controlling power output of each of the laser units to control temperature gradients within the workpiece; and

cutting heated material from the rotating workpiece with the cutting tool.

6. The turning process of claim 5, further comprising directing heat from the first laser unit onto a chamfer of the workpiece created by the cutting tool.

7. The turning process of claim 5, wherein said heating of the workpiece with the second laser unit increases absorptivity of the rotating workpiece, thereby decreasing power requirements for said heating of the workpiece with the first laser unit.

8. The turning process of claim 5, wherein said first point is from about 10 to about 13 degrees circumferentially ahead of the cutting tool.

9. The turning process of claim 8, wherein said second point is about 55 degrees circumferentially ahead of the cutting tool.

10. A laser assisted machining apparatus, comprising:

a lathe having a workpiece holder that spins about a rotational axis and a cutting tool holder that moves along a path parallel to said rotational axis of said workpiece holder;

a first laser unit connected to said cutting tool holder;

a second laser unit connected to said cutting tool holder; and

control means for independently controlling output of each of said first and second laser units.