CPC Class Codes
H01L 2223/54426
for alignment
H01L 2223/54473
for use after dicing
H01L 2223/5448
Located on chip prior to di...
H01L 2224/02166
Collar structures
H01L 2224/04042
Bonding areas specifically ...
H01L 2224/05556
in side view
H01L 2224/05558
conformal layer on a patter...
H01L 2224/05599
Material
H01L 2224/45099
Material
H01L 2224/48091
Arched
H01L 2224/48455
Details of wedge bonds
H01L 2224/48458
of the interface with the b...
H01L 2224/4847
the connecting portion on t...
H01L 2224/85121
Active alignment, i.e. by a...
H01L 2224/85399
Material
H01L 23/544
Marks applied to semiconduc...
H01L 24/05
of an individual bonding area
H01L 24/48
of an individual wire conne...
H01L 24/85
using a wire connector wire...
H01L 2924/00
Indexing scheme for arrange...
H01L 2924/00014 :
the subject-matter covered ...
H01L 2924/01005 :
Boron [B]
H01L 2924/01014 :
Silicon [Si]
H01L 2924/01015 :
Phosphorus [P]
H01L 2924/01033 :
Arsenic [As]
H01L 2924/13091 :
Metal-Oxide-Semiconductor F...
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