Semiconductor device

• US 20070063920A1
• Filed: 09/11/2006
• Published: 03/22/2007
• Est. Priority Date: 09/13/2005
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Shionoiri, Yutaka, Kato, Kiyoshi, Yamazaki, Shunpei
• Granted Patent: US 7,545,276 B2
• Time in Patent Office: Days
• US Class Current: 343/895
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 9/27 Spiral antennas

Abstract

The present invention provides a semiconductor device including an antenna, and at least a first integrated circuit and a second integrated circuit which are connected to the antenna, wherein the first integrated circuit includes a memory circuit which memorizes a first identification code and a first program for controlling an operation of the first integrated circuit, and wherein the second integrated circuit includes a memory circuit which memorizes a second identification code and a second program for controlling an operation of the second integrated circuit.

Claims

1. A semiconductor device comprising:

an antenna; and

at least a first integrated circuit and a second integrated circuit which are connected to the antenna,

wherein;

the first integrated circuit includes a memory circuit which memorizes a first identification code and a first program for controlling an operation of the first integrated circuit,

the second integrated circuit includes a memory circuit which memorizes a second identification code and a second program for controlling an operation of the second integrated circuit,

the first identification code is different from the second identification code, and

the first program is different from the second program.

2. The semiconductor device according to claim 1, wherein the antenna is formed over a different substrate from the first integrated circuit and the second integrated circuit.

3. The semiconductor device according to claim 1, wherein the antenna is a loop antenna or a spiral antenna.

4. The semiconductor device according to claim 1, wherein the first integrated circuit and the second integrated circuit are disposed to be overlapped with the antenna.

5. The semiconductor device according to claim 1, wherein the first integrated circuit and the second integrated circuit are disposed not to be overlapped with the antenna.

6. The semiconductor device according to claim 1, wherein the first integrated circuit and the second integrated circuit are not overlapped with the antenna and disposed inside a space surrounded by the antenna.

7. The semiconductor device according to claim 1, wherein each of the first integrated circuit and the second integrated circuit is an IC chip.

8. The semiconductor device according to claim 1, wherein each of the first integrated circuit and the second integrated circuit is formed over different substrates.

9. The semiconductor device according to claim 1, wherein each of the first integrated circuit and the second integrated circuit is connected to the antenna through a connection portion.

10. The semiconductor device according to claim 1, wherein each of the first integrated circuit and the second integrated circuit is connected to the antenna through a connection portion, and wherein the connection portion includes a first terminal which is connected to the antenna and a second terminal which is connected to one of the first integrated circuit and the second integrated circuit.

11. The semiconductor device according to claim 1, wherein one of the first program and the second program is a program regarding an unencrypted communication, and wherein the other of the first program and the second program is a program regarding an encrypted communication.

12. A semiconductor device comprising:

an antenna; and

a plurality of integrated circuits which are connected to the antenna,

wherein;

each of the plurality of integrated circuits includes a memory circuit which memorizes an identification code and a program for controlling an operation of the integrated circuit,

the identification code is different in each of the plurality of integrated circuits, and

the program is different in each of the plurality of integrated circuits.

13. The semiconductor device according to claim 12, wherein the antenna is formed over a different substrate from the plurality of integrated circuits.

14. The semiconductor device according to claim 12, wherein the antenna is a loop antenna or a spiral antenna.

15. The semiconductor device according to claim 12, wherein the plurality of integrated circuits are disposed to be overlapped with the antenna.

16. The semiconductor device according to claim 12, wherein the plurality of integrated circuits are disposed not to be overlapped with the antenna.

17. The semiconductor device according to claim 12, wherein the plurality of integrated circuits are not overlapped with the antenna and disposed inside a space surrounded by the antenna.

18. The semiconductor device according to claim 12, wherein each of the plurality of integrated circuits is an IC chip.

19. The semiconductor device according to claim 12, wherein each of the plurality of integrated circuits is formed over different substrates.

20. The semiconductor device according to claim 12, wherein each of the plurality of integrated circuits is connected to the antenna through a connection portion.

21. The semiconductor device according to claim 12, wherein each of the plurality of integrated circuits is connected to the antenna through a connection portion, and wherein the connection portion includes a first terminal which is connected to the antenna and a second terminal which is connected to one of the plurality of integrated circuits.

22. The semiconductor device according to claim 12, wherein one of the plurality of integrated circuits includes a memory circuit which memorizes a program regarding an unencrypted communication, and wherein the other of the plurality of integrated circuits includes a memory circuit which memorizes a program regarding an encrypted communication.

23. A semiconductor device comprising:

an antenna; and

at least a first integrated circuit and a second integrated circuit which are connected to the antenna,

wherein;

the first integrated circuit includes a memory circuit which memorizes a first identification code and a first program for controlling an operation of the first integrated circuit,

the second integrated circuit includes a memory circuit which memorizes a second identification code and a second program for controlling an operation of the second integrated circuit,

the first identification code is same as the second identification code, and

the first program is same as the second program.

24. The semiconductor device according to claim 23, wherein the antenna is formed over a different substrate from the first integrated circuit and the second integrated circuit.

25. The semiconductor device according to claim 23, wherein the antenna is a loop antenna or a spiral antenna.

26. The semiconductor device according to claim 23, wherein the first integrated circuit and the second integrated circuit are disposed to be overlapped with the antenna.

27. The semiconductor device according to claim 23, wherein the first integrated circuit and the second integrated circuit are disposed not to be overlapped with the antenna.

28. The semiconductor device according to claim 23, wherein the first integrated circuit and the second integrated circuit are not overlapped with the antenna and disposed inside a space surrounded by the antenna.

29. The semiconductor device according to claim 23, wherein each of the first integrated circuit and the second integrated circuit is an IC chip.

30. The semiconductor device according to claim 23, wherein each of the first integrated circuit and the second integrated circuit is formed over different substrates.

31. The semiconductor device according to claim 23, wherein each of the first integrated circuit and the second integrated circuit is connected to the antenna through a connection portion.

32. The semiconductor device according to claim 23, wherein each of the first integrated circuit and the second integrated circuit is connected to the antenna through a connection portion, and wherein the connection portion includes a first terminal which is connected to the antenna and a second terminal which is connected to one of the first integrated circuit and the second integrated circuit.

33. A semiconductor device according to claim 23, further comprising a majority circuit which are connected the first integrated circuit and the second integrated circuit, wherein the majority circuit outputs the first identification code or the second identification code, and wherein the antenna outputs a carrier wave modulated in response to the identification code outputted from the majority circuit.

34. A semiconductor device comprising:

an antenna; and

a plurality of integrated circuits which are connected to the antenna,

wherein;

each of the plurality of integrated circuits includes a memory circuit which memorizes an identification code and a program for controlling an operation of the integrated circuit, and

at least two integrated circuits selected from the plurality of integrated circuits have the same identification code and the same program.

35. The semiconductor device according to claim 34, wherein the antenna is formed over a different substrate from the plurality of integrated circuits.

36. The semiconductor device according to claim 34, wherein the antenna is a loop antenna or a spiral antenna.

37. The semiconductor device according to claim 34, wherein the plurality of integrated circuits are disposed to be overlapped with the antenna.

38. The semiconductor device according to claim 34, wherein the plurality of integrated circuits are disposed not to be overlapped with the antenna.

39. The semiconductor device according to claim 34, wherein the plurality of integrated circuits are not overlapped with the antenna and disposed inside a space surrounded by the antenna.

40. The semiconductor device according to claim 34, wherein each of the plurality of integrated circuits is an IC chip.

41. The semiconductor device according to claim 34, wherein each of the plurality of integrated circuits is formed over different substrates.

42. The semiconductor device according to claim 34, wherein each of the plurality of integrated circuits is connected to the antenna through a connection portion.

43. The semiconductor device according to claim 34, wherein each of the plurality of integrated circuits is connected to the antenna through a connection portion, and wherein the connection portion includes a first terminal which is connected to the antenna and a second terminal which is connected to one of the plurality of integrated circuits.

44. A semiconductor device according to claim 34, further comprising a majority circuit which are connected to the plurality of integrated circuits, wherein the majority circuit outputs the identification code which is a majority value of a plurality of identification codes, and wherein the antenna outputs a carrier wave modulated in response to the identification code outputted from the majority circuit.