Solid-state element device and light-emitting apparatus using same

• US 20070064131A1
• Filed: 09/08/2006
• Published: 03/22/2007
• Est. Priority Date: 09/13/2005
• Status: Active Grant

• Current Assignee: Sumita Optical Glass, Inc., Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Sumita Optical Glass, Inc., Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Yamaguchi, Seiji, Tasumi, Koji, Suehiro, Yoshinobu, Ohtsuka, Masaaki, Watanabe, Hiroki, Aida, Kazuya, Sawanobori, Naruhito, Sakaji, Hiroko
• Granted Patent: US 7,825,575 B2
• Time in Patent Office: Days
• US Class Current: 348/294
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A solid-state element device having: a solid-state element; a power receiving/supplying portion for mounting thereto the solid-state element, and receiving/supplying a power from/to the solid-state element; and a wavelength converting portion having a phosphor layer formed inside a sealing glass having the same coefficient of thermal expansion as that of the power receiving/supplying portion for sealing the solid-state element, the phosphor layer being obtained by mixing a glass and a phosphor with each other, and melting the glass.

Claims

1. A solid-state element device, comprising:

a solid-state element;

a power receiving/supplying portion for mounting thereto said solid-state element, and receiving/supplying a power from/to said solid-state element; and

a wavelength converting portion having a phosphor layer formed inside a sealing glass having the same coefficient of thermal expansion as that of said power receiving/supplying portion for sealing said solid-state element, said phosphor layer being obtained by mixing a glass and a phosphor with each other, and melting the glass.

2. A solid-state element device according to claim 1, wherein:

said solid-state element is an LED element comprising a GaN system semiconductor compound.

5. A light-emitting apparatus, wherein a plurality of solid-state element devices according to claim 1 are disposed on a common power receiving/supplying portion so that light radiation directions are identical to one another.

6. A light-emitting apparatus, wherein a plurality of solid-state element devices according to claim 2 are disposed on a common power receiving/supplying portion so that light radiation directions are identical to one another.

7. A light-emitting apparatus, comprising:

a solid-state element device according to claim 1;

a second power receiving/supplying portion for mounting thereto the one or plurality of solid-state element devices, and receiving/supplying a power from/to a first power receiving/supplying portion for said one or plurality of solid-state element devices; and

a main body for accommodating therein said one or plurality of solid-state element devices and said second power receiving/supplying portion.

8. A light-emitting apparatus, comprising:

a solid-state element device according to claim 2;

a second power receiving/supplying portion for mounting thereto the one or plurality of solid-state element devices, and receiving/supplying a power from/to a first power receiving/supplying portion for said one or plurality of solid-state element devices; and

a main body for accommodating therein said one or plurality of solid-state element devices and said second power receiving/supplying portion.

9. A light-emitting apparatus according to claim 7, wherein:

said main body has a recess portion through which said one or plurality of solid-state element devices are exposed.

10. A light-emitting apparatus according to claim 9, wherein:

said recess portion has a phosphor layer or a reflecting film provided in its inner surface.

11. A light-emitting apparatus according to claim 7, wherein:

said main body has a heat radiating portion for radiating heat from said one or plurality of solid-state element devices to an outside of said main body.

12. A light-emitting apparatus according to claim 8, wherein:

said main body has a recess portion through which said one or plurality of solid-state element devices are exposed.

13. A light-emitting apparatus according to claim 12, wherein;

said recess portion has a phosphor layer or a reflecting film provided in its inner surface.

14. A light-emitting apparatus according to claim 8, wherein:

said main body has a heat radiating portion for radiating heat from said one or plurality of solid-state element devices to an outside of said main body.

3. A solid-state element device, comprising:

a solid-state element;

a power receiving/supplying portion for mounting thereto said solid-state element, and receiving/supplying a power from/to said solid-state element; and

a wavelength converting portion having a fluorescent member obtained by mixing a glass and a phosphor with each other, and melting the glass, said fluorescent member being provided so as to divide an inside or outside of a sealing glass for sealing said solid-state element into two parts, or being formed so as to seal the whole sealing glass by itself.

4. A solid-state element device according to claim 3, wherein:

said solid-state element is an LED element comprising a GaN system semiconductor compound.