Electronics assembly and heat pipe device

• US 20070064396A1
• Filed: 09/22/2005
• Published: 03/22/2007
• Est. Priority Date: 09/22/2005
• Status: Active Grant

• Current Assignee: Delphi Technologies Ip Limited (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Oman, Todd
• Granted Patent: US 7,324,341 B2
• Time in Patent Office: Days
• US Class Current: 361/700
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]

Abstract

An electronics assembly is provided having a heat pipe device for cooling electronics. The assembly includes a substrate and an electronics package supported on the substrate. The assembly also includes a heat pipe device in thermal communication with an exposed surface of the electronics package. The heat pipe device includes a thermal conductive pipe having an internal volume and an open end. The heat pipe device also includes a thermal conductive end cap positioned to close the open end of the pipe. The end cap has an outer surface for receiving in thermal communication an electronics package. The heat pipe device further includes a cooling fluid disposed in the internal volume of the pipe for transferring thermal energy from the end cap to the outside environment.

Claims

1. A heat pipe device for cooling electronics, said heat pipe device comprising:

a thermal conductive pipe having an internal volume and at least one open end;

a thermal conductive end cap positioned to seal closed the open end of the pipe, said end cap having an outer surface for receiving in thermal communication an electronics device; and

a cooling fluid disposed in the internal volume of the pipe for transferring thermal energy from the end cap to the outside environment.

2. The heat pipe device as defined in claim 1 further comprising a heat exchanger in thermal communication with the pipe for dissipating thermal energy to the outside environment.

3. The heat pipe device as defined in claim 2, wherein the heat exchanger comprises a plurality of thermally conductive fins.

4. The heat pipe device as defined in claim 3 further comprising an ambient fluid flowing in communication with the fins.

5. The heat pipe device as defined in claim 1, wherein the end cap is soldered to the pipe to seal closed the open end.

6. The heat pipe device as defined in claim 1, wherein the end cap has a generally flat surface for interfacing with the electronic device, and wherein the flat surface is substantially perpendicular to a longitudinal axis of the pipe.

7. The heat pipe device as defined in claim 1, wherein the cooling fluid comprises liquid.

8. The heat pipe device as defined in claim 7, wherein the cooling fluid comprises de-ionized water.

9. The heat pipe device as defined in claim 1 further comprising a thermal conductive interface material disposed between the end cap and the electronics device.

10. An electronics assembly comprising:

a substrate;

an electronics package supported on the substrate, said electronics package comprising electrical circuitry and an exposed side surface; and

a heat pipe device in thermal communication with the exposed surface of the electronics package, said heat pipe device comprising;

a thermal conductive pipe having an internal volume and at least one open end;

a thermal conductive end cap positioned to close the open end of the pipe, said end cap having an outer surface in thermal communication with the exposed side surface of the electronics package; and

a cooling fluid disposed in the internal volume of the pipe for transferring thermal energy from the end cap to the outside environment.

11. The electronics assembly as defined in claim 10 further comprising a thermal conductive medium disposed between the exposed side surface of the electronics package and the end cap.

12. The electronics assembly as defined in claim 11, wherein the thermal conductive medium comprises one of a thermal conductive grease and a thermal conductive adhesive.

13. The electronics assembly as defined in claim 10, wherein the substrate comprises a circuit board having electrical circuitry.

14. The electronics assembly as defined in claim 10, wherein the electronics assembly is employed on a vehicle.

15. The electronics assembly as defined in claim 10 further comprising a supporting case for positioning the heat pipe device in thermal communication with the electronics package.

16. The electronics assembly as defined in claim 10 further comprising a heat exchanger in thermal communication with the pipe for dissipating thermal energy to the outside environment.

17. The electronics assembly as defined in claim 16, wherein the heat exchanger comprises a plurality of thermally conductive fins.

18. The heat pipe as defined in claim 10, wherein the cooling fluid comprises liquid.

19. The heat pipe as defined in claim 18, wherein the cooling fluid comprises de-ionized water.