DECOUPLING CAPACITOR CLOSELY COUPLED WITH INTEGRATED CIRCUIT
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Accused Products
Abstract
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.
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Citations
37 Claims
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1-31. -31. (canceled)
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32. A method of forming an integrated circuit chip module comprising the steps of:
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adhesively securing a decoupling capacitor onto a capacitor carrier to form a decoupling capacitor assembly;
adhesively securing the decoupling capacitor assembly onto an integrated circuit die that had been mounted onto a substrate; and
wire bonding from the decoupling capacitor assembly to the integrated circuit die and from the integrated circuit die onto substrate bonding pads positioned on the substrate. - View Dependent Claims (33, 34, 35, 36, 37)
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Specification