Integrated circuitry production processes, methods, and systems
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Abstract
The invention includes methods of forming capacitor structures and removing organic material. An organic material, such as a photoresist, is disposed on a substrate. The organic material is contacted with a chemical mechanical polishing pad and a polishing fluid to remove the organic material from the substrate. The polishing fluid can be essentially free of particles, and can be water.
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Citations
73 Claims
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1-53. -53. (canceled)
- 54. Removing carbon-comprising material from above a substrate with a pad and a fluid, the fluid comprising a particulate concentration of less than or equal to about 0.1 weight percent at an initiation of the removing.
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60. A carbon-comprising material removal system, comprising:
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a substrate support configured to support a substrate having a carbon-comprising material thereon;
a pad configured to physically contact the carbon-comprising material; and
a fluid source, the fluid source configured to provide a fluid to a location between the pad and the material, the fluid comprising a particulate concentration of less than or equal to about 0.1 weight percent. - View Dependent Claims (61, 62, 63, 64, 65, 66, 67)
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68. An integrated circuitry manufacturing process, comprising:
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applying a mask above a semiconductive substrate;
creating a recess within the substrate using the mask; and
removing at least a portion of the mask with a pad and fluid, the fluid substantially lacking in particulates. - View Dependent Claims (69, 70, 71, 72, 73)
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Specification