High glass transition temperature thermoplastic articles

• US 20070066741A1
• Filed: 12/28/2005
• Published: 03/22/2007
• Est. Priority Date: 09/16/2005
• Status: Abandoned Application

• Current Assignee: Sabic Innovative Plastics IP BV (Government of Saudi Arabia)
• Original Assignee: Sabic Innovative Plastics IP BV (Government of Saudi Arabia)
• Inventors: Donovan, Michael, Sheth, Kapil, Sanner, Mark, Odle, Roy, Singh, Rajendra, Gallucci, Robert
• Application Number:
  US11/320,350
• Publication Number:
  US 20070066741A1
• Time in Patent Office: Days
• US Class Current: 524/430
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08L 2205/02 containing two or more polymers of the same C08L -group
• CPC Class Codes: C08L 2205/03 containing three or more polymers in a blend
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 2666/18 Polyesters or polycarbonates according to C08L67/00 - C08L69/00; Derivatives thereof
• CPC Class Codes: C08L 2666/20 Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
• CPC Class Codes: C08L 67/03 the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/10 Block- or graft-copolymers containing polysiloxane sequences obtained by polymerising a compound having a carbon-to-carbon double bond on to a polysiloxane C08L51/08, C08L53/00
• CPC Class Codes: C08L 83/12 containing polyether sequences
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 1/0353 consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer

Abstract

A composite material comprises an electrically conductive material disposed over at least a portion of a substrate wherein the substrate comprises either: a) an immiscible blend of polymers having more than one glass transition temperature and one of the polymers has a glass transition temperature greater than 180 degrees Celsius; b) a miscible blend of polymers having a single glass transition temperature greater than 217 degrees Celsius; or, c) a single virgin polymer having a glass transition temperature of greater than 247 degrees Celsius.

Claims

1. An electronic part comprising a composite material comprising an electrically conductive material disposed either over or under at least a portion of a substrate or coating respectively, wherein the substrate or coating comprises a material selected from the group consisting of:

a) an immiscible blend of polymers comprising one or more polyetherimides, having more than one glass transition temperature wherein the polyetherimide has a glass transition temperature greater than 217°

Celsius;

b) a miscible blend of polymers, comprising one or more polyetherimides, having a single glass transition temperature greater than 180°

Celsius;

or, c) a single polyetherimide having a glass transition temperature of greater than 247°

Celsius.

2. A composite material according to claim 1 wherein the polyetherimide has a hydrogen atom to carbon atom ratio of between about 0.4 and 0.85.

3. A composite material according to claim 1 wherein the polyetherimide is essentially free of benzylic protons.

4. The composite material according to claim 1 wherein the substrate comprises an immiscible blend of polymers having more than one glass transition temperature and one of the polymers has a glass transition temperature greater than 180°

Celsius.

5. The composite material according to claim 1 wherein the substrate comprises a miscible blend of polymers having a single glass transition temperature greater than 217°

Celsius.

6. The composite material according to claim 1 wherein the substrate comprises a single polymer having a glass transition temperature of greater than 2470 Celsius.

7. The composite material according to claim 1 wherein the substrate comprises a blend of a first resin selected from the group consisting of:

polysulfones, polyether sulfones, polyphenylene ether sulfones, and mixtures thereof, a second resin comprising a silicone copolymer and a third resin comprising a resorcinol based aryl polyester resin wherein greater than or equal to 50 mole % of the aryl polyester linkages are aryl ester linkages derived from resorcinol.

8. The composite material according to claim 5 wherein the silicone copolymer is selected from the group consisting of;

polyimide siloxanes, polyetherimide siloxanes, polyetherimide sulfone siloxanes, polycarbonate siloxanes, polyestercarbonate siloxanes, polysulfone siloxanes, polyether sulfone siloxanes, polyphenylene ether sulfone siloxanes and mixtures thereof.

12. The composite material according to claim 5 further comprising one or more metal oxides at 0.1 to 20% by weight of the polymer blend.

13. The composite material according to claim 5 wherein the resorcinol based aryl polyester has the structure shown below:

14. The composite material according to claim 5 wherein the resorcinol based polyester resin is a copolymer containing carbonate linkages having the structure shown below:

15. The composite material according to claim 12 wherein R⁵ is derived from a bisphenol compound.

16. A composite material according to claim 1 wherein the phase separated polymer blend comprises a mixture of:

a) a first resin component selected from one or more of the group comprising;

polyaryl ether ketones, polyaryl ketones, polyether ketones and polyether ether ketones;

with, b) a second resin component comprising at least one polysulfone etherimide having greater than or equal to 50 mole % of the linkages containing at least one aryl sulfone group.

17. A composite material according to claim 14 wherein the polysulfone etherimide contains aryl sulfone and aryl ether linkages such that at least 50 mole % of the repeat units of the polysulfone etherimide contain at least one aryl ether linkage, at least one aryl sulfone linkage and at least two aryl imide linkages.

18. A composite material according to claim 14 wherein at least 50 mole % of the polysulfone etherimide linkages are derived from oxydiphthalic anhydride or a chemical equivalent thereof.

19. A composite material according to claim 14 wherein less than 30 mole % of polysulfone etherimide linkages are derived from a diamine or dianhydride containing an isoalkylidene group.

20. A composite material according to claim 14 wherein the substrate has a heat distortion temperature (HDT) of greater than or equal to 170°

C., measured as per ASTM method D648 at 66 psi (0.46 Mpa) on a 3.2 mm sample.

21. A composite material according to claim 14 wherein the polysulfone etherimide is present from 30-70 wt % of the substrate.

22. A composite material according to claim 14 wherein the polysulfone etherimide is essentially free of benzylic protons.

23. A composite material according to claim 14 wherein the one or more polyaryl ether ketone, polyaryl ketone, polyether ketone, and polyether ether ketone have a crystalline melting point from 300°

to 380°

C.

24. A composite material according to claim 14 wherein the polysulfone etherimide has a glass transition temperature (Tg), from 250°

to 350°

C.

25. A composite material according to claim 14 wherein the polymer blend has at least two different glass transition temperatures, as measured by ASTM method D5418, wherein the first glass transition temperature is from 120°

-200°

C. and the second glass transition temperature is from 250°

-350°

C.

26. A composite material having improved flame retardance according to claim 1 wherein the substrate comprises a blend of a first resin selected from the group consisting of:

polyimides, polyetherimides, polyetherimide sulfones, and mixtures thereof, a second resin comprising a silicone copolymer and a third resin comprising a resorcinol based aryl polyester resin wherein greater than or equal to 50 mole % of the aryl polyester linkages are aryl ester linkages derived from resorcinol.

27. A composite material according to claim 24 wherein the silicone copolymer is one or more selected from the group consisting of:

polyimide siloxanes, polyetherimide siloxanes, polyetherimide sulfone siloxanes, polycarbonate siloxanes, polyestercarbonate siloxanes, polysulfone siloxanes, polyether sulfone siloxanes, and polyphenylene ether sulfone siloxanes.

28. A composite material according to claim 24 wherein the silicone copolymer content is from 0.1 to 10.0 wt % of the polymer blend.

29. A composite material according to claim 24 wherein the silicone copolymer has from 20-50 wt % siloxane content.

30. A composite material according to claim 24 wherein the polyimides, polyetherimides, polyetherimide sulfones and mixtures thereof, have a hydrogen atom to carbon atom ratio of less than or equal to 0.75.

31. A composite material according to claim 24 further comprising one or more metal oxides at 0.1 to 20% by weight of the polymer blend.

32. A composite material according to claim 24 wherein the resorcinol based aryl polyester has the structure shown below:

33. A composite material according to claim 24 wherein the resorcinol based polyester resin is a copolymer containing carbonate linkages having the structure shown below:

34. A composite material according to claim 31 wherein R⁵ is derived from a bisphenol compound.

35. A composite material according to claim 24 wherein the polyimide, polyetherimide, or polyetherimide sulfone is made from aryl dianhydrides selected from the group consisting of:

bisphenol A dianhydride, oxydiphthalic anhydride, pyromellitic dianhydride, diphthalic anhydride, sulfonyl dianhydride, sulfur dianhydride, benzophenone dianhydride and mixtures thereof; and

, aryl diamines selected from the group consisting of;

meta phenylene diamine, para phenylene diamine, diamino diphenyl sulfone, oxydianiline, bis amino phenoxy benzene, bis aminophenoxy biphenyl, bis aminophenyl phenyl sulfone, diamino diphenyl sulfide and mixtures thereof.

36. A composite material according to claim 1 wherein the substrate comprises a copolyetherimide having a glass transition temperature of at least about 218°

C., said copolyetherimide comprising structural units of the formulas (I) and (II);

37. A composite material according to claim 34 comprising a copolyetherimide having a Tg greater than 225°

C.

38. A composite material according to claim 34 comprising a copolyetherimide comprising structural units of the formula (III).

39. A composite material according to claim 34 wherein R¹ is derived from at least one diamine selected from the group consisting of meta-phenylenediamine;

para-phenylenediamine;

2-methyl-4,6-diethyl-1,3-phenylenediamine;

5-methyl-4,6-diethyl-1,3-phenylenediamine;

bis(4-aminophenyl)-2,2-propane;

bis(2-chloro-4-amino-3,5-diethylphenyl)methane, 4,4′

-diaminodiphenyl, 3,4′

-diaminodiphenyl, 4,4′

-diaminodiphenyl ether, 3,4′

-diaminodiphenyl ether, 4,4′

-diaminodiphenyl sulfone, 3,4′

-diaminodiphenyl sulfone, 4,4′

-diaminodiphenyl ketone, 3,4′

-diaminodiphenyl ketone, 2,4-toluenediamine; and

mixtures thereof.

40. A composite material according to claim 34 wherein R² is derived from at least one dihydroxy-substituted aromatic hydrocarbon of the formula (VI):

HO--D--OH

wherein D has the structure of formula (VII);

41. A composite material according to claim 34 wherein R² structural units in each of formulas (I), (II) and (III) are the same.

42. A composite material according to claim 34 wherein at least a portion of R² structural units in at least two of formulas (I), (II) and (III) are not the same.

43. A composite material according to claim 34 wherein R² is derived from at least one dihydroxy-substituted aromatic hydrocarbon selected from the group consisting of 4,4′

-(cyclopentylidene)diphenol;

4,4′

-(3,3,5-trimethylcyclopentylidene)diphenol;

4,4′

-(cyclohexylidene)diphenol;

4,4′

-(3,3-dimethylcyclohexylidene)diphenol;

4,4′

-(3,3,5-trimethylcyclohexylidene)diphenol;

4,4′

-(methylcyclohexylidene)diphenol;

4,4′

-bis(3,5-dimethyl)diphenol, 1,1-bis(4-hydroxy-3-methylphenyl)cyclohexane;

4,4-bis(4-hydroxyphenyl)heptane;

2,4′

-dihydroxydiphenylmethane;

bis(2-hydroxyphenyl)methane;

bis(4-hydroxyphenyl)methane;

bis(4-hydroxy-5-nitrophenyl)methane;

bis(4-hydroxy-2,6-dimethyl-3-methoxyphenyl)methane;

1,1-bis(4-hydroxyphenyl)ethane;

1,2-bis(4-hydroxyphenyl)ethane;

1,1-bis(4-hydroxy-2-chlorophenyl)ethane;

2,2-bis(4-hydroxyphenyl)propane;

2,2-bis(3-phenyl-4-hydroxyphenyl)propane;

2,2-bis(4-hydroxy-3-methylphenyl)propane;

2,2-bis(4-hydroxy-3-ethylphenyl)propane;

2,2-bis(4-hydroxy-3-isopropylphenyl)propane;

2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane;

3,5,3′

,5′

-tetrachloro-4,4′

-dihydroxyphenyl)propane;

bis(4-hydroxyphenyl)cyclohexylmethane;

2,2-bis(4-hydroxyphenyl)-1-phenylpropane;

2,4′

-dihydroxyphenyl sulfone;

dihydroxy naphthalene, 2,6-dihydroxy naphthalene;

hydroquinone;

resorcinol;

C_1-3 alkyl-substituted resorcinols;

2,2-bis-(4-hydroxyphenyl)butane;

2,2-bis-(4-hydroxyphenyl)-2-methylbutane;

1,1-bis-(4-hydroxyphenyl)cyclohexane;

bis-(4-hydroxyphenyl);

bis-(4-hydroxyphenyl)sulphide;

2-(3-methyl-4-hydroxyphenyl-2-(4-hydroxyphenyl)propane;

2-(3,5-dimethyl-4-hydroxyphenyl)-2-(4-hydroxyphenyl)propane;

2-(3-methyl-4-hydroxyphenyl)-2-(3,5-dimethyl-4-hydroxyphenyl)propane;

bis-(3,5-dimethylphenyl-4-hydroxyphenyl)methane;

1,1-bis-(3,5-dimethylphenyl-4-hydroxyphenyl)ethane;

2,2-bis-(3,5-dimethylphenyl-4-hydroxyphenyl)propane;

2,4-bis-(3,5-dimethylphenyl-4-hydroxyphenyl)-2-methylbutane;

3,3-bis-(3,5-dimethylphenyl-4-hydroxyphenyl)pentane;

1,1-bis-(3,5-dimethylphenyl-4-hydroxyphenyl)cyclopentane;

1,1-bis-(3,5-dimethylphenyl-4-hydroxyphenyl)cyclohexane;

bis-(3,5-dimethylphenyl-4-hydroxyphenyl)sulphide, 3-(4-hydroxyphenyl)-1,1,3-trimethylindan-5-ol, 1-(4-hydroxyphenyl)-1,3,3-trimethylindan-5-ol, and 2,2,2′

,2′

-tetrahydro-3,3,3′

,3′

-tetramethyl-1,1′

-spirobi[1H-indene]-6,6′

-diol.

44. A composite material according to claim 34 wherein R² is derived from at least one dihydroxy-substituted aromatic hydrocarbon selected from the group consisting of those of the formula (IX):

45. A composite material according to claim 42 wherein R² is derived from bisphenol A.

46. A composite material according to claim 34 further comprising structural units derived from at least one chain termination agent.

47. A composite material according to claim 44 wherein the chain termination agent is at least one unsubstituted or substituted member selected from the group consisting of alkyl halides, alkyl chlorides, aryl halides, aryl chlorides, and chlorides of formulas (XVII) and (XVIII):

48. A composite material according to claim 45 wherein the chain termination agent is at least one member selected from the group consisting of monochlorobenzophenone, monochlorodiphenylsulfone;

a monochlorophthalimide;

4-chloro-N-methylphthalimide, 4-chloro-N-butylphthalimide, 4-chloro-N-octadecylphthalimide, 3-chloro-N-methylphthalimide, 3-chloro-N-butylphthalimide, 3-chloro-N-octadecylphthalimide, 4-chloro-N-phenylphthalimide, 3-chloro-N-phenylphthalimide;

a mono-substituted bis-phthalimide;

a monochlorobisphthalimidobenzene;

1-[N-(4-chlorophthalimido)]-3-(N-phthalimido)benzene;

1-[N-(3-chlorophthalimido)]-3-(N-phthalimido)benzene;

monochlorobisphthalimidodiphenyl sulfone, monochlorobisphthalimidodiphenyl ketone, a monochlorobisphthalimidophenyl ether;

4-[N-(4-chlorophthalimido)]phenyl-4′

-(N-phthalimido)phenyl ether;

4-[N-(3-chlorophthalimido)phenyl]-4′

-(N-phthalimido)phenyl ether, and the corresponding isomers of the latter two compounds derived from 3,4′

-diaminodiphenyl ether.

49. A composite material according to claim 34 wherein the weight ratio of units of formula I to those of formula II is in the range of between about 99:

1 and about 25;

75.

50. A composite material according to claim 34 wherein the substrate has a heat distortion temperature at 0.455 mPa of at least 205°

C.

51. A composite material according to claim 34 wherein the substrate has a heat distortion temperature at 0.455 mPa of at least 210°

C.

52. A composite material according to claim 34 wherein the substrate has a temperature of transition between the brittle and ductile states of at most 30°

C. as measured by ASTM method D3763.

53. The composite material according to claim 1 further comprising an adhesive layer disposed between the substrate and the electrically conductive material.

54. The composite material according to claim 1 wherein the electrically conductive material comprises a metal foil.

55. The composite material according to claim 1 wherein the electrically conductive material comprises a metal foil selected from the group consisting of copper, silver and gold.

56. The composite material according to claim 52 wherein the metal foil is copper foil.

57. The composite material according to claim 1 further comprising a cover layer disposed over the electrically conductive material.

9. The composite material according to 6 wherein the silicone copolymer content is from 0.1 to 10.0 wt % of the polymer blend.

10. The composite material according to 6 wherein the silicone copolymer has from 20-50 wt % siloxane content.

11. The composite material according to 5 wherein the polysulfones, polyether sulfones, polyphenylene ether sulfones and mixtures thereof, have a hydrogen atom to carbon atom ratio of less than or equal to 0.85.