Heatsink

• US 20070068652A1
• Filed: 09/13/2006
• Published: 03/29/2007
• Est. Priority Date: 09/29/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Sun-soo, Park, Hee-sung
• Granted Patent: US 7,441,591 B2
• Time in Patent Office: Days
• US Class Current: 165/80.400
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Provided is a heatsink, including a cooling zone to contact an object to be frozen and having microchannels formed therein to define a plurality of fluid pathways, an inlet through which a working fluid enters, a distributor, interposed between the inlet and the cooling zone, to uniformly distribute the working fluid introduced through the inlet to the microchannels, an outlet through which the working fluid, passing through the cooling zone, exits, and a collector, interposed between the cooling zone and the outlet, to collect the working fluid passing through the microchannels.

Claims

1. A heatsink, comprising:

a cooling zone to contact an object to be frozen and having microchannels formed therein to define a plurality of fluid pathways;

an inlet through which a working fluid enters;

a distributor, interposed between the inlet and the cooling zone, to uniformly distribute the working fluid introduced through the inlet to the microchannels;

an outlet through which the working fluid, passing through the cooling zone, exits; and

a collector, interposed between the cooling zone and the outlet, to collect the working fluid passing through the microchannels.

2. The heatsink according to claim 1, wherein a width of the distributor gradually increases from an end of the inlet to a beginning of the cooling zone.

3. The heatsink according to claim 2, wherein a height of the distributor gradually decreases from an end of the inlet to a beginning of the cooling zone.

4. The heatsink according to claim 2, wherein a length of the distributor is given by the relationship,

where L denotes the length of the distributor, D_e denotes a maximum width of the distributor, D denotes a minimum width of the distributor, and θ

denotes an inclination angle of the distributor relative to longitudinal lengths of the inlet and the outlet.

5. The heatsink according to claim 4, wherein the inclination angle θ

ranges from 0°

to 50°

.

6. The heatsink according to claim 1, wherein a width of the collector gradually decreases from an end of the cooling zone to a beginning of the outlet.

7. The heatsink according to claim 6, wherein a height of the collector gradually increases from an end of the cooling zone to a beginning of the outlet.

8. The heatsink according to claim 7, wherein both the collector and the distributor are each symmetric with respect to a central vertical axis of the heatsink.

9. The heatsink according to claim 7, further comprising a first stabilizer, interposed between the distributor and the cooling zone, to stabilize the flow of the distributed working fluid.

10. The heatsink according to claim 9, wherein a width and a height of the first stabilizer are each substantially similar to a width and a height of the cooling zone.

11. The heatsink according to claim 10, further comprising a second stabilizer, interposed between the cooling zone and the collector, to stabilize the flow of the collected working fluid.

12. The heatsink according to claim 11, wherein a width and a height of the second stabilizer are each substantially similar to the width and the height of the cooling zone.

13. The heatsink according to claim 1, further comprising a first stabilizer, interposed between the distributor and the cooling zone, to stabilize the flow of the distributed working fluid.

14. The heatsink according to claim 13, wherein a width and a height of the first stabilizer are substantially similar to a width and a height of the cooling zone.

15. The heatsink according to claim 14, further comprising a second stabilizer, interposed between the cooling zone and the collector, to stabilize the flow of the collected working fluid.

16. The heatsink according to claim 15, wherein a width and a height of the second stabilizer are substantially similar to the width and the height of the cooling zone.

17. A heatsink to cool a surface of an object to be frozen, comprising:

a cooling zone to contact the object to be frozen, the cooling zone having a plurality of fluid pathways formed therein to substantially cover the object to be frozen;

a distributor to distribute a fluid to the microchannels with a uniform pressure distribution to remove heat from the surface of the object to be frozen; and

a collector to collect the fluid having passed through the microchannels without a substantial change in the pressure distribution thereof.

18. The heatsink according to claim 17, further comprising a first stabilizer, interposed between the distributor and the cooling zone, to stabilize the flow of the distributed fluid.

19. The heatsink according to claim 18, wherein a width and a height of the first stabilizer are each substantially similar to a width and a height of the cooling zone.

20. The heatsink according to claim 19, further comprising a second stabilizer, interposed between the cooling zone and the collector, to stabilize the flow of the collected fluid.

21. The heatsink according to claim 20, wherein a width and a height of the second stabilizer are each substantially similar to the width and the height of the cooling zone.