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Heat pipe type cooler

  • US 20070068658A1
  • Filed: 11/28/2006
  • Published: 03/29/2007
  • Est. Priority Date: 10/20/1997
  • Status: Active Grant
First Claim
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1. A heat pipe cooler, comprising:

  • a heat receiving plate having lower and upper opposite surfaces, said lower surface of said heat receiving plate arranged to contact a semiconductor element which generates heat and is to be cooled;

    a plurality of heat pipes fixed to said flat upper surface of said heat receiving plate for thermal conduction, said plurality of heat pipes being upstanding with respect to said heat receiving plate, and said plurality of heat pipes being sealed at opposite end portions thereof;

    a plurality of parallel heat radiating plates fixed to said plurality of heat pipes at positions along said plurality of heat pipes, said parallel heat radiating plates extending substantially parallel to, and having a shape corresponding to said heat receiving plate; and

    a distance between said heat receiving plate and one of said plurality of parallel heat radiating plates which is located adjacent to the heat receiving plate being substantially greater than a distance between two adjacent ones of said parallel heat radiating plates, wherein said heat pipe has a generally U-shaped or V-shaped profile, and wherein said heat receiving plate is arranged entirely outside said ventilation duct to permit cooling of said semiconductor element.

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