Heat pipe type cooler

• US 20070068658A1
• Filed: 11/28/2006
• Published: 03/29/2007
• Est. Priority Date: 10/20/1997
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Ueda, Akira, Suzuki, Masumi
• Granted Patent: US 7,721,789 B2
• Time in Patent Office: Days
• US Class Current: 165/104.330
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a heat pipe, there is provided a heat pipe type cooler comprising: a heat receiving plate; a heat radiator having a configuration of a plurality of horizontally oriented vertically spaced heat radiation plates; and a heat pipe H having a generally U-shaped or V-shaped profile, the middle portion of which is secured to the heat receiving plate; and wherein each end of the heat pipe H passes through the heat radiation plates.

Claims

1. A heat pipe cooler, comprising:

a heat receiving plate having lower and upper opposite surfaces, said lower surface of said heat receiving plate arranged to contact a semiconductor element which generates heat and is to be cooled;

a plurality of heat pipes fixed to said flat upper surface of said heat receiving plate for thermal conduction, said plurality of heat pipes being upstanding with respect to said heat receiving plate, and said plurality of heat pipes being sealed at opposite end portions thereof;

a plurality of parallel heat radiating plates fixed to said plurality of heat pipes at positions along said plurality of heat pipes, said parallel heat radiating plates extending substantially parallel to, and having a shape corresponding to said heat receiving plate; and

a distance between said heat receiving plate and one of said plurality of parallel heat radiating plates which is located adjacent to the heat receiving plate being substantially greater than a distance between two adjacent ones of said parallel heat radiating plates,

wherein said heat pipe has a generally U-shaped or V-shaped profile, and

wherein said heat receiving plate is arranged entirely outside said ventilation duct to permit cooling of said semiconductor element.

2. The heat pipe cooler according to claim 1, wherein each of said opposite end portions of said at least one heat pipe passes through said plurality of heat pipes passes through said plurality of parallel heat radiating plates.

3. The heat pipe cooler according to claim 1, wherein both said opposite end portions of each of said heat pipes are fixed to each of said plurality of parallel heat radiating plates.

4. The heat pipe cooler according to claim 1, further comprising a ventilation duct surrounding said parallel heat radiating plates and defining a passage for air through a gap between said parallel heat radiating plates.