In mold manufacturing of an object comprising a functional element

• US 20070069418A1
• Filed: 08/29/2006
• Published: 03/29/2007
• Est. Priority Date: 09/28/2005
• Status: Abandoned Application

• Current Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated)
• Original Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated)
• Inventors: Liao, Chih-Yuan, Ho, Andrew
• Application Number:
  US11/513,333
• Publication Number:
  US 20070069418A1
• Time in Patent Office: Days
• US Class Current: 264/238
• CPC Class Codes: B29C 43/18 incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles B29C43/206 takes precedence
• CPC Class Codes: B29C 43/20 Making multilayered or multicoloured articles B29C43/14 takes precedence
• CPC Class Codes: B29C 45/14778 the article consisting of a material with particular properties, e.g. porous, brittle
• CPC Class Codes: B29C 45/14811 Multilayered articles B29C45/14827 takes precedence
• CPC Class Codes: B29C 45/14827 using a transfer foil detachable from the insert
• CPC Class Codes: B29C 49/20 of articles having inserts or reinforcements ; Handling of inserts or reinforcements
• CPC Class Codes: B29C 51/12 of articles having inserts or reinforcements
• CPC Class Codes: B29K 2033/20 PAN, i.e. polyacrylonitrile
• CPC Class Codes: B29K 2077/10 Aromatic polyamides [polyaramides] or derivatives thereof
• CPC Class Codes: B29K 2715/006 Glues or adhesives, e.g. hot melts or thermofusible adhesives
• CPC Class Codes: B29L 2031/3061 Number plates
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2203/1327 Moulding over PCB locally or completely
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/386 : by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

This invention relates to an object having a functional element embedded in its top surface and processes for its manufacturing. The object is in general formed by molding, stamping, lamination or a combination thereof. The functional element is includes any electrical or mechanical elements that are capable of performing a function.

Claims

1. An object having a functional element embedded in its top surface.

2. The object of claim 1 which is formed by molding, stamping, lamination, or a combination thereof.

3. The object of claim 2 wherein said molding process is injection molding, compression molding, thermoforming, or blow molding.

4. The object of claim 1 which is formed from a material selected from the group consisting of thermoplastic materials, thermoplastic elastomers, thermoset materials and blends, prepregs, or composites thereof.

5. The object of claim 1 wherein said functional element is an optical component, optical device, waveguide, electronic design electronic component, display component, backlight component, speaker, microphone, push button, touch panel, touch pad, or connector.

6. The object of claim 5 wherein said electronic design is conductive or semi-conductive electrical traces.

7. The object of claim 5 wherein electronic component is integrated circuit, printed electrical circuit, transistor, diode, resistor, inductor, capacitor, antenna, RFID transponder, battery, solar cell, light-emitting diode, or organic light-emitting diode.

8. The object of claim 1 further comprising a decorative design, a display panel, or both.

9. The object of claim 8 wherein said functional element and said decorative design overlap, partly overlap, or do not overlap.

10. The object of claim 8 wherein said decorative design or display panel is applied post-molding.

11. The object of claim 8 wherein said decorative design or display panel is applied by an in-mold process.

12. An in-mold display transfer film or foil which comprises a temporary carrier film, a release layer, a functional element, an adhesive or tie layer, and optionally a durable layer.

13. The in-mold display transfer film or foil of claim 12 wherein said temporary carrier layer is a thin film of PET, PEN, or PC.

14. The in-mold display transfer film or foil of claim 12 wherein said release layer is formed from wax, paraffin or silicone or a highly smooth and impermeable coating prepared from a radiation curable multifunctional acrylate, silicone acrylate, epoxide, vinyl ester, vinyl ether, allyl or vinyl, unsaturated polyester, or a blend thereof.

15. The in-mold display transfer film or foil of claim 12 wherein said release layer comprises a condensation polymer, copolymer, blend or composite selected from the group consisting of epoxy, polyurethane, polyimide, polyamide, melamine formaldehyde, urea formaldehyde, and phenol formaldehyde.

16. The in-mold display transfer film or foil of claim 12 wherein said optional durable layer is formed from a radiation curable multifunctional acrylate, epoxide, vinyl ester, diallyl phthalate, vinyl ether, or a blend thereof.

17. The in-mold display transfer film or foil of claim 12 wherein said optional durable layer comprises a condensation polymer or copolymer.

18. The in-mold display transfer film or foil of claim 17 wherein said condensation polymer or copolymer is selected from the group consisting of epoxy, polyurethane, polyamide, polyimide, melamine formaldehyde, urea formaldehyde, and phenol formaldehyde.

19. The in-mold display transfer film or foil of claim 12 wherein said optional durable layer comprises a sol-gel silicate or titanium ester.

20. The in-mold display transfer film or foil of claim 16 wherein said radiation curable multifunctional acrylate is epoxy acrylate, polyurethane acrylate, polyester acrylate, silicone acrylate, or glycidyl acrylate.

21. The in-mold display transfer film or foil of claim 12 wherein said adhesive layer is formed from polyacrylate, polymethacrylate, polystyrene, polycarbonate, polyurethane, polyester, polyamide, epoxy resin, ethylene vinylacetate copolymer, thermoplastic elastomer, a copolymer thereof, a blend thereof, or a composite thereof.

22. The in-mold display transfer film or foil of claim 12 wherein said adhesive layer is a hot melt or heat activated adhesive.

23. The in-mold display transfer film or foil of claim 12 which is in the form of a roll.

24. An in-mold display insertion film or foil which comprises a carrier layer, a functional element and an adhesive layer.

25. The in-mold display insertion film or foil of claim 24 which is in the form of a roll.

26. A process for the manufacture of an object having a functional element embedded in the top surface of the object, which process comprises:

a) forming an in-mold display transfer film or foil which comprises a temporary carrier layer, a release layer, a functional element, an adhesive layer and optionally a durable layer;

b) feeding said in-mold display transfer film or foil into a mold with the temporary carrier film in contact with the inner surface of the mold;

c) injecting a plastic material into the mold for forming said object or thermoforming, blow molding or compression forming said object with a plastic material in said mold;

d) removing the object formed from the mold; and

e) simultaneously removing both temporary carrier layer and release layer.

27. A process for the manufacture of an object having a functional element embedded in the surface of the object, which process comprises:

a) forming an in-mold display insertion film or foil which comprises a carrier layer, a functional element and an adhesive layer;

b) inserting said in-mold display insertion film or foil into a mold with said carrier layer in contact with the inner surface of the mold;

c) injecting a plastic material into said mold for forming said object or thermoforming, blow molding or compression forming said object with a plastic material in said mold; and

d) removing the formed object from the mold.