Marking device and methods

• US 20070071463A1
• Filed: 09/28/2005
• Published: 03/29/2007
• Est. Priority Date: 09/28/2005
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Dougherty, Patrick, Kendall, David
• Granted Patent: US 7,555,229 B2
• Time in Patent Office: Days
• US Class Current: 399/24
• CPC Class Codes: B41J 2/17566 Ink level or ink residue control

Abstract

A portion of a replaceable component of an imaging device is selectively deformed or melted.

Claims

1. A method comprising:

selectively deforming or melting a portion of a replaceable component of an imaging device.

2. The method of claim 1, wherein selectively deforming or melting the portion of a replaceable component occurs upon occurrence of a predetermined state.

3. The method of claim 2, wherein the predetermined state corresponds to a useful, limited and/or operable lifetime of the replaceable component.

4. The method of claim 2 further comprises sensing the predetermined state before deforming the portion of the replaceable component.

5. The method of claim 2, wherein the predetermined state of the replaceable component corresponds to an initial state prior to initial operation of the replaceable component.

6. The method of claim 1, wherein the predetermined state of the replacable component corresponds to the component reaching an end of its warranty period.

7. The method of claim 1, wherein the predetermined state of the replacable component corresponds to a percentage of a condition that occurs at a predetermined final state of the component.

8. The method of claim 1, wherein selectively deforming or melting the portion of the replaceable component is in response to instructions from logic located remotely of the imaging device.

9. The method of claim 1, wherein deforming or melting the portion of the replaceable component comprises forcing a heated plate against the portion of the replaceable component.

10. A method of operating an imaging device, comprising:

forcibly engaging a portion of a replaceable component installed in the imaging device with a marker; and

when the cartridge is at a predetermined state, heating the marker to deform or melt the portion of the replaceable component in engagement with the marker.

11. The method of claim 10, wherein forcibly engaging a portion of a replaceable component installed in the imaging device with a marker comprises forcibly engaging the body with a plate.

12. The method of claim 11, wherein heating the marker comprises dissipating electrical power in a resistor thermally coupled to the plate.

13. The method of claim 10, wherein the predetermined state corresponds to an amount of contents within the replaceable component or an amount of wear of the replaceable component or both.

14. The method of claim 10, wherein heating the marker is in response to a signal indicative of the predetermined state.

15. The method of claim 10, wherein heating the marker is triggered by logic located remotely of the imaging device.

16. A computer-usable medium containing computer-readable instructions for causing an imaging device to perform acts comprising:

selectively deforming or melting a portion of a replaceable component of the imaging device.

17. The computer-usable medium of claim 16, wherein selectively deforming or melting the portion of the replaceable component occurs when the replaceable component reaches a predetermined state.

18. The computer-usable medium of claim 17, wherein the predetermined state of the replaceable component is selected from a group of states comprising a final state, a threshold percentage state, an initial state, a depleted state, and a worn state.

19. An imaging device comprising:

means for deforming or melting a portion of a replaceable component installed in the imaging device; and

means for activating the deforming or melting means when the replaceable component is at a predetermined state.

20. The imaging device of claim 19 further comprises means for maintaining the deforming or melting means in forcible contact with the portion of the replaceable component.

21. The imaging device of claim 19 further comprises means for sensing when the predetermined state occurs.

22. An imaging device comprising:

at least one marker configured to selectively deform or melt a portion of a replaceable component.

23. The imaging device of claim 22, wherein a biasing device causes the marker to forcibly engage the portion of the replaceable component.

24. The imaging device of claim 22, wherein the marker comprises a plate that forcibly engages the portion of the replaceable component.

25. The imaging device of claim 22, wherein the imaging device comprises local logic configured to control the marker.

26. The imaging device of claim 25 further comprises a sensor coupled to the local logic for sensing when the marker is to deform or melt the portion of the replaceable component.

27. The imaging device of claim 25 wherein the local logic is configured to receive information from remote logic located remotely of the imaging device.

28. The imaging device of claim 22 further comprises a plurality of markers, the markers configured to respectively deform or melt respective portions of the replaceable component.