Method for manufacturing a micro-electro-mechanical device
First Claim
1. A method for manufacturing a micro-electro-mechanical (MEM) device, comprising the steps of:
- providing a first wafer;
removing a portion of the first wafer to provide a cavity including a plurality of spaced support pedestals within the cavity; and
bonding a second wafer to at least a portion of the first wafer, wherein a portion of the second wafer provides a diaphragm over the cavity, and wherein the support pedestals support the diaphragm during processing.
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Accused Products
Abstract
A technique for manufacturing a micro-electro-mechanical (MEM) device includes a number of steps. Initially, a first wafer is provided. Next, a bonding layer is formed on a first surface of the first wafer. Then, a portion of the bonding layer is removed to provide a cavity including a plurality of spaced support pedestals within the cavity. Next, a second wafer is bonded to at least a portion of the bonding layer. A portion of the second wafer provides a diaphragm over the cavity and the support pedestals support the diaphragm during processing. The second wafer is then etched to release the diaphragm from the support pedestals.
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Citations
20 Claims
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1. A method for manufacturing a micro-electro-mechanical (MEM) device, comprising the steps of:
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providing a first wafer;
removing a portion of the first wafer to provide a cavity including a plurality of spaced support pedestals within the cavity; and
bonding a second wafer to at least a portion of the first wafer, wherein a portion of the second wafer provides a diaphragm over the cavity, and wherein the support pedestals support the diaphragm during processing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for manufacturing a micro-electro-mechanical (MEM) device, comprising the steps of:
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providing a first wafer;
forming a bonding layer on a first surface of the first wafer;
removing a portion of the bonding layer to provide a cavity including a plurality of spaced support pedestals within the cavity; and
bonding a second wafer to at least a portion of the bonding layer, wherein a portion of the bonding wafer provides a diaphragm over the cavity, and wherein the support pedestals support the diaphragm during processing. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method for manufacturing a micro-electro-mechanical (MEM) device, comprising the steps of:
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providing a handle wafer;
forming a bonding layer on a first surface of the handle wafer;
removing a portion of the bonding layer to provide a cavity including a plurality of spaced support pedestals within the cavity;
bonding an active wafer to at least a portion of the bonding layer, wherein a portion of the active wafer provides a diaphragm over the cavity, and wherein the support pedestals support the diaphragm;
etching the active wafer to release the diaphragm from the support pedestals; and
etching at least a portion of the diaphragm adjacent a sidewall of the cavity to allow the diaphragm to move. - View Dependent Claims (17, 18, 19, 20)
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Specification