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Wireless IC tag and manufacturing method of the same

  • US 20070075148A1
  • Filed: 06/16/2006
  • Published: 04/05/2007
  • Est. Priority Date: 10/03/2005
  • Status: Active Grant
First Claim
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1. A wireless IC tag comprising a support sheet, an antenna formed on one surface of the support sheet, an IC chip mounted on the support sheet, and a pressure sensor built in the IC chip, wherein the IC chip includes SOI structure having a silicon sheet layer, a silicon device layer, and a silicon oxide layer formed between the silicon sheet layer and the silicon device layer, and wherein the pressure sensor includes a capacitive element comprising a pair of wirings at least one of which contacts the silicon oxide layer, and a gap formed between the pair of wiring, wherein the capacitive element changes capacity of the gap by pressure applied from outside to the IC chip.

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