Method and apparatus for heating mold by high frequency current

• US 20070075463A1
• Filed: 10/03/2006
• Published: 04/05/2007
• Est. Priority Date: 10/04/2005
• Status: Abandoned Application

• Current Assignee: Jung-Tang Huang
• Original Assignee: Jung-Tang Huang
• Inventors: Huang, Jung-Tang, Lin, Liang-Tse
• Application Number:
  US11/541,613
• Publication Number:
  US 20070075463A1
• Time in Patent Office: Days
• US Class Current: 264/489
• CPC Class Codes: B29C 2035/0816 using eddy currents
• CPC Class Codes: B29C 33/06 using radiation , e.g. electro-magnetic waves, induction heating
• CPC Class Codes: B29C 35/12 Dielectric heating
• CPC Class Codes: B29C 45/73 of the mould B29C45/2642 and B29C45/2737 take precedence
• CPC Class Codes: B29C 59/02 by mechanical means, e.g. pressing B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627

Abstract

The method and apparatus of the invention is used to heat the surface of the mold insert or cavity by high frequency current. There are holes near the heated surface in the mold and the coils can be installed into the holes. The coils surround the heated surface and are conducted with high frequency current. Due to the directional change of the current, the blocks that are surrounded by the coils will be heated by the hysteresis losses and the eddy-current losses. The surface of the mold insert or cavity will be heated rapidly. There are cooling holes set near the heated surface or beside the coil-pipe. The cooling liquid or air can flow in the holes to carry out extra energy and the temperature of the mold will be decreased. The position of the cooling holes, the flow speed and temperature deviation of the liquid and air will influence the temperature of the mold. The method and apparatus will improve the quality of the thermal-plastic products and elevate the number of the cavity.

Claims

1. A method for heating two mold inserts facing each other through high frequency current having steps of:

two mold inserts having heating surface face each other, at least more than one coil guide hole approaching heating surface of first mold, let coil penetrate coil guide hole, and the penetrated coil will be connected to the coil which penetrates the second mold coil guide hole through a coil connector, then at least one coil assembly which encloses two mold insert heating surfaces having face to face to each other is formed, moreover, ends of the coil assembly are connected to high frequency power supply system, high frequency current is added to the coil through high frequency power supply system to heat mold insert heating surface, then adjust the power output and frequency to control the heating speed and temperature of mold insert heating surface.

2. The method of claim 1 wherein coil is electrical conducting material, either solid or hollow wire, moreover, and coated or supported by insulated material.

3. The method of claim 1 wherein the connection method of coil connector is discrete type or flexible or sliding type.

4. The method of claim 1 wherein coil assembly is connected to high frequency power supply system in series or in parallel.

5. The method of claim 1 wherein cooling liquid is introduced in the space between coil guide hole and coil so as to control the temperature of coil.

6. The method of claim 1 wherein cooling liquid is introduced inside the hollow wire to control the temperature of wire.

7. The method of claim 1 wherein at least more than one cooling hole is installed on each mold, then connected to cooling liquid supply system through guide pipe, thus the flow rate and temperature of gas or liquid flow inside are adjusted to control the mold temperature.

8. The method of claim 7 wherein the cooling liquid is low temperature air, low temperature liquid or any structure which uses fluid for the cooling, for example, using heat pipe to control the temperature.

9. The method of claim 1 wherein at least more than one heat isolation block is installed in between each mold insert and mold base so that the temperature change is limited to within the mold insert.

10. The method of claim 9 wherein the heat isolation block is material of low thermal conduction coefficient, high mechanical strength and small thermal expansion coefficient.

11. The method of claim 1 wherein heating two mold inserts facing each other would be a method for heating one surface of a mold insert through high frequency current having steps of:

at least more than one coil guide hole within a mold insert approaching heating surface, let coil penetrate coil guide hole, the penetrated coil is then connected to at least more than one coil external to the mold insert through a conducting connector, then at least one coil assembly which encloses mold insert heating surface is formed, moreover, end of coil assembly is connected to high frequency power supply system, through the high frequency current sent out by high frequency power supply system, mold insert heating surface is heated, then adjust output power and frequency to control the heating speed and temperature of mold insert heating surface.

12. An apparatus using high frequency coil for the heating of mold insert surface, having the following features:

at least more than one mold insert having one heating surface on it, and at least more than one coil guide hole is penetrated through both sides of heating surface;

at least more than one coil wherein the coil is penetrated into the coil guide hole of the mold insert;

at least more than one coil connector wherein the coil connector connects the coil end that penetrates through two adjacent mold inserts into a coil assembly;

moreover, the end of coil assembly is connected to high frequency power supply system.

13. The apparatus of claim 12 wherein coil guide hole is introduced with cooling liquid.

14. The apparatus of claim 12 wherein coil is electrical conducting material, either solid or hollow wire, moreover, coated or supported by insulated material.

15. The apparatus of claim 12 wherein the connection method of coil connector is discrete type or flexible or sliding type.

16. The apparatus of claim 12 wherein coil assembly is connected to high frequency power supply system in series or in parallel.

17. The apparatus of claim 12 wherein coils are connected by coil connector into one body so that two heating surfaces are enclosed the zone enclosed by the coil assembly.

18. The apparatus of claim 12 wherein coils are connected by coil connector into one body, so that both ends of coil will form current input (output) end and current output (input) end.

19. The apparatus of claim 12 wherein cooling liquid is introduced in the space between coil guide hole and coil so as to control the coil temperature.

20. The apparatus of claim 12 wherein cooling liquid is introduced into the hollow wire so as to control the coil temperature.