Power module with a magnetic device having a conductive clip

• US 20070075816A1
• Filed: 10/05/2005
• Published: 04/05/2007
• Est. Priority Date: 10/05/2005
• Status: Active Grant

• Current Assignee: Altera Corporation (Intel Corporation)
• Original Assignee: Enpirion, Inc. (MediaTek, Inc.)
• Inventors: Wilkowski, Mathew, Weld, John, Lotfi, Ashraf, Liakopoulos, Trifon
• Granted Patent: US 8,139,362 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2027/2814 with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/40245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H02M 3/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: Y10T 29/49076 From comminuted material

Abstract

A power module located on a conductive substrate including power conversion circuitry. The power conversion circuitry includes a magnetic device and at least one switch. The magnetic device includes a magnetic core having a surface facing the conductive substrate and a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The power module also includes an encapsulant about the power conversion circuitry.

Claims

1. A power module located on a conductive substrate, comprising:

power conversion circuitry, including;

a magnetic device having a magnetic core having a surface facing said conductive substrate and a conductive clip facing a surface of said magnetic core with ends of said conductive clip electrically coupled to said conductive substrate to cooperatively form a winding therewith about said magnetic core, and

at least one switch; and

an encapsulant about said power conversion circuitry.

2. The power module as recited in claim 1 wherein a lower surface of said magnetic core faces said conductive substrate.

3. The power module as recited in claim 1 wherein an upper surface of said magnetic core faces said conductive clip.

4. The power module as recited in claim 1 wherein said conductive substrate is a leadframe.

5. The power module as recited in claim 1 wherein said magnetic core is adhered to said conductive substrate.

6. The power module as recited in claim 1 wherein said ends of said conductive clip are bent toward said conductive substrate about ends of said magnetic core.

7. The power module as recited in claim 1 wherein said conductive clip is soldered to said conductive substrate.

8. The power module as recited in claim 1 further comprising a gap between said conductive clip and said magnetic core.

9. The power module as recited in claim 1 further comprising terminals protruding from and substantially coplanar with sides and a lower surface of said power module.

10. The power module as recited in claim 1 wherein portions of said power module are formed from integrated circuits or surface mount components.

11. A power module located on a patterned, conductive leadframe, comprising:

power conversion circuitry, including;

a magnetic device having a magnetic core formed from a bar of magnetic material adhered to said conductive leadframe and at least one conductive clip placed above said magnetic core with ends of said at least one conductive clip soldered to said conductive leadframe to cooperatively form a winding therewith about said magnetic core, and

at least one switch; and

an encapsulant about said power conversion circuitry.

12. The power module as recited in claim 11 wherein said bar of magnetic material is formed from manganese zinc ferrite.

13. The power module as recited in claim 11 wherein said conductive leadframe includes leadframe fingers that form terminals that protrude from sides and a lower surface of said power module.

14. The power module as recited in claim 11 wherein at least one wire bond electrically couples portions of said conductive leadframe.

15. The power module as recited in claim 11 wherein said ends of said at least one conductive clip are bent toward said conductive leadframe about ends of said magnetic core.

16. The power module as recited in claim 11 further comprising a gap between said magnetic core and said at least one conductive clip.

17. The power module as recited in claim 11 further comprising a gap substantially filled with said encapsulant between said magnetic core and said at least one conductive clip.

18. The power module as recited in claim 11 wherein said encapsulant is an epoxy encapsulant.

19. The power module as recited in claim 11 further comprising a controller and a driver.

20. The power module as recited in claim 11 wherein portions of said power module are formed from integrated circuits or surface mount components.