Common mode choke coil and method of manufacturing the same
First Claim
1. A common mode choke coil comprising:
- a first helical coil unit having a plurality of elongate first conductive layers arranged in parallel on a bottom insulation layer, second conductive layers formed on both ends of the first conductive layers; and
a third conductive layer formed on the second conductive layers, which is electrically connected to the second conductive layer at one end thereof and which is electrically connected, at another end thereof, to the second conductive layer formed on the first conductive layer adjacent to the first conductive layer directly under the second conductive layer, one turn of the coil being formed by the first conductive layer, the second conductive layer, the third conductive layer and the another second conductive layer; and
a second helical coil unit having a configuration similar to that of the first helical coil unit.
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Accused Products
Abstract
The invention relates to a common mode choke coil and a method of manufacturing the same and provides a compact, low-profile, and low-cost common mode choke coil and a method of manufacturing the same. A common mode choke coil has a general outline in the form of a rectangular parallelepiped provided by forming an insulation layer, a first helical coil unit, a second helical coil unit, and a closed magnetic path on a silicon substrate made of a single-crystal using thin film forming techniques. The first and second helical coil units are formed such that their axes of spiral extend substantially parallel to a substrate surface of the silicon substrate.
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Citations
16 Claims
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1. A common mode choke coil comprising:
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a first helical coil unit having a plurality of elongate first conductive layers arranged in parallel on a bottom insulation layer, second conductive layers formed on both ends of the first conductive layers; and
a third conductive layer formed on the second conductive layers, which is electrically connected to the second conductive layer at one end thereof and which is electrically connected, at another end thereof, to the second conductive layer formed on the first conductive layer adjacent to the first conductive layer directly under the second conductive layer, one turn of the coil being formed by the first conductive layer, the second conductive layer, the third conductive layer and the another second conductive layer; and
a second helical coil unit having a configuration similar to that of the first helical coil unit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of manufacturing a common mode choke coil, comprising the steps of:
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forming a first electrode film on a substrate;
forming a first resist layer on the first electrode film;
forming a plurality of elongate first openings in parallel in the first resist layer to expose the first electrode film;
forming each of first conductive layers electrically connected to the first electrode film through the first openings using a plating process;
forming a second resist layer on the entire surface after removing the first resist layer;
forming a plurality of second openings for exposing both ends of the first conductive layers in the second resist layer;
forming each of second conductive layers electrically connected to the first conductive layers through the second openings using a plating process;
removing the second resist layer and the first electrode film under the second resist layer;
forming a first insulation layer on which the tops of the second conductive layers are exposed;
forming a second electrode film electrically connected to the second conductive layers on the first insulation layer;
forming a third resist layer on the second electrode film;
forming the third resist layer with a plurality of elongate third openings arranged in parallel to expose the second electrode film in positions where the openings overlap the second conductive layers at one end thereof and overlap, at another end thereof, the second conductive layers formed on the first conductive layer adjacent to the first conductive layer directly under the second conductive layer when the substrate surface is viewed in the normal direction thereof;
forming each of third conductive layers electrically connected to the second electrode film through the third openings using a plating process;
removing the third resist layer and the second electrode film under the third resist layer;
forming a first helical coil unit one turn of which is formed by the first, second, third, and second conductive layers; and
similarly forming a second helical coil unit simultaneously with the first helical coil unit. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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Specification