METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARDS

• US 20070077688A1
• Filed: 08/01/2006
• Published: 04/05/2007
• Est. Priority Date: 09/16/2005
• Status: Active Grant

• Current Assignee: Zhen Ding Technology Co. Ltd
• Original Assignee: Foxconn Advanced Technology Inc.
• Inventors: WANG, CHAO-CHING, HSU, CHIA-SHUO, HUANG, FU-SING
• Granted Patent: US 7,452,754 B2
• Time in Patent Office: Days
• US Class Current: 438/118
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2203/0191 Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0064 onto a polymeric substrate
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence

Abstract

A method for manufacturing of flexible printed circuit boards is provided. The method includes the steps of: providing a tape substrate having an electrically insulating layer and an electrically conducting layer; forming a wiring pattern at the electrically conducting layer; attaching a back film on a surface of the tape substrate; and cutting the tape substrate to get a number of flexible printed circuit boards attached on the back film.

Claims

1. A method for manufacturing flexible printed circuit boards, said method comprising:

providing a tape substrate having an electrically insulating layer and an electrically conducting layer;

forming a wiring pattern at the electrically conducting layer;

attaching a back film on a surface of the tape substrate; and

cutting the tape substrate to achieve a plurality of flexible printed circuit boards attached on the back film.

2. The method as claimed in claim 1, wherein the back film is pressed on the surface of the electrically insulating layer.

3. The method as claimed in claim 1, wherein the back film is pressed on a surface of the tape substrate on which the wiring pattern is formed.

4. The method as claimed in claim 1, wherein the electrically insulating layer is made of polyimide, polyethylene terephalate, liquid crystal polymer or Teflon.

5. The method as claimed in claim 1, wherein a thickness of the electrically insulating layer is in the range from 10 micrometers to 75 micrometers.

6. The method as claimed in claim 1, wherein the electrically conducting layer is made of copper, gold or an electrically conductive alloy.

7. The method as claimed in claim 1, wherein a thickness of the electrically conducting layer is in the range from 5 micrometers to 50 micrometers.

8. The method as claimed in claim 1, wherein the back film is made of polyimide, polyethylene terephalate, liquid crystal polymer or Teflon.

9. The method as claimed in claim 1, wherein a thickness of the back film is 75 micrometers.

10. The method as claimed in claim 1, wherein the back film is attached on the electrically insulating layer of the tape substrate.

11. The method as claimed in claim 1, wherein the back film is attached on the electrically conducting layer with the wiring pattern formed thereat.

12. The method as claimed in claim 11, wherein the tape substrate further comprises another electrically conducting layer cooperating with said electrically conducting layer to sandwich the electrically insulating layer therebetween, and wherein the method further comprises a steps of:

forming another wiring pattern at the another electrically conducting layer.

13. The method as claimed in claim 12, further comprising the following steps:

attaching another back film on the another electrically conducting layer before forming said wiring pattern at said electrically conducting layer; and

removing the another back film and before forming the another wiring pattern at the another electrically conducting layer.

14. A method for manufacturing flexible printed circuit boards, said method comprising the following steps:

providing a substrate comprising an electrically insulating layer and an electrically conducting layer;

transferring the substrate between a pair of reels and attaching a continuous back film on the substrate when the substrate is transferred;

transferring the substrate with the continuous back film attached thereon between another pair of reels and forming a wiring pattern at the electrically conducting layer when the substrate is transferred; and

cutting the substrate to obtain the flexible printed circuit boards attached on the continuous back film.

15. The method as claimed in claim 14, wherein the substrate is cut via a die.

16. The method as claimed in claim 14, wherein leavings formed in the cutting process are adhered to the back film.

17. The method as claimed in claim 16, further comprising a step of removing the leavings from the back film.

18. The method as claimed in claim 14, wherein the back film is pressed to the substrate via another pair of rolls which presses the back film to the substrate when the back film and the substrate pass through a clearance formed therebetween.

19. The method as claimed in claim 18, wherein the back film and the substrate are wrapped around two different reels before pressed together and wrapped around one reel after pressed together.

20. A method for manufacturing flexible printed circuit boards, said method comprising the following steps:

providing a substrate comprising an electrically insulating layer and an electrically conducting layer;

transferring the substrate between a pair of reels and forming a wiring pattern at the electrically conducting layer when the substrate is transferred;

transferring the substrate having the wiring pattern between another pair of reels and attaching a continuous back film on the electrically insulating layer of the substrate when the substrate is transferred; and

cutting the substrate to obtain the flexible printed circuit boards attached on the continuous back film.