Method and apparatus for enhancing the integrity of an implantable sensor device
First Claim
1. An implantable sensing apparatus comprising:
- a sensor module having internal elements, a portion of said sensor module having an outer dimension;
an outer tubing surrounding said sensor module, said outer tubing having an inner dimension, said inner dimension of said outer tubing and said outer dimension of said portion of said sensor module being substantially the same, but defining at least one void between said inner dimension of said outer tubing and said outer dimension of said portion of said sensor module due to inherent manufacturing tolerances; and
back-fill material disposed in said at least one void.
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Abstract
A method and apparatus for enhancing the integrity of an implantable sensor. Voids formed between an outer tubing and a sensor substrate or spacing element may be back-filled with a curable, implantable material, minimizing the extent to which unwanted fluids diffuse within the sensor. An enzyme or protein matrix pellet below the sensor window may be pre-treated with a reducing agent to enhance its bond stability, and to reduce undesired swelling that may cause the sensor window to detach or leak. The bonding between the enzyme pellet and a hydrogel layer may be reinforced by application of an intervening bonding layer of a protein material, such as human serum albumin (HSA). The size of the window may be minimized by minimizing the size of an underlying electrode, providing reduced flux and lengthening sensor. A coating may be deposited on the surface of the sensor leads, providing stiffening and lubrication.
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Citations
23 Claims
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1. An implantable sensing apparatus comprising:
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a sensor module having internal elements, a portion of said sensor module having an outer dimension;
an outer tubing surrounding said sensor module, said outer tubing having an inner dimension, said inner dimension of said outer tubing and said outer dimension of said portion of said sensor module being substantially the same, but defining at least one void between said inner dimension of said outer tubing and said outer dimension of said portion of said sensor module due to inherent manufacturing tolerances; and
back-fill material disposed in said at least one void. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification