×

Method and apparatus for enhancing the integrity of an implantable sensor device

  • US 20070078319A1
  • Filed: 11/30/2006
  • Published: 04/05/2007
  • Est. Priority Date: 09/27/2002
  • Status: Active Grant
First Claim
Patent Images

1. An implantable sensing apparatus comprising:

  • a sensor module having internal elements, a portion of said sensor module having an outer dimension;

    an outer tubing surrounding said sensor module, said outer tubing having an inner dimension, said inner dimension of said outer tubing and said outer dimension of said portion of said sensor module being substantially the same, but defining at least one void between said inner dimension of said outer tubing and said outer dimension of said portion of said sensor module due to inherent manufacturing tolerances; and

    back-fill material disposed in said at least one void.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×