Integrated circuit package resistance measurement

• US 20070080696A1
• Filed: 10/11/2005
• Published: 04/12/2007
• Est. Priority Date: 10/11/2005
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Kumar, Arvind, Munshi, Kambiz
• Granted Patent: US 7,327,150 B2
• Time in Patent Office: Days
• US Class Current: 324/691
• CPC Class Codes: G01R 27/00 Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/2896 Testing of IC packages; Test features related to IC packages containers per se H01L23/02, encapsulations per se H01L23/28
• CPC Class Codes: G01R 31/3004 Current or voltage test

Abstract

For one embodiment, an integrated circuit includes a node to couple one or more components to the integrated circuit to carry current through a package for the integrated circuit. The integrated circuit also includes a monitor to measure a resistance of the package based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package. For another embodiment, current through one or more components that are to carry current through a package for an integrated circuit is controlled. A resistance of the package is measured based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package.

Claims

1. An integrated circuit comprising:

a node to couple one or more components to the integrated circuit to carry current through a package for the integrated circuit; and

a monitor to measure a resistance of the package based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package.

2. The integrated circuit of claim 1, wherein the monitor is to measure a resistance of the package at a first temperature, and

wherein the reference resistance of the package is based on a measured resistance of the package at a second temperature.

3. The integrated circuit of claim 1, wherein the monitor is to measure a characteristic based at least in part on a resistance of one or more components that are to carry current through the package to help measure a resistance of the package.

4. The integrated circuit of claim 1, wherein the monitor is to measure a ratio between a resistance of one or more components that are to carry current through the package and a resistance of one or more components to help measure a resistance of the package.

5. The integrated circuit of claim 1, wherein the monitor is to measure power supplied to the integrated circuit based at least in part on the measured resistance.

6. The integrated circuit of claim 1, comprising a controller to control power based at least in part on the measured resistance.

7. The integrated circuit of claim 1, in combination with a substrate having one or more components to carry current through the package,

wherein the integrated circuit is positioned over the substrate and the substrate has one or more components to carry current on more than one side of the integrated circuit.

8. The integrated circuit of claim 1, wherein the integrated circuit forms at least a portion of a processor and wherein the processor may perform instructions as the monitor controls current through one or more components to help measure a resistance of the package.

9. An apparatus comprising:

a first programmable current source to draw a first current through one or more first components that are to carry current through a package for an integrated circuit;

a second programmable current source to draw a second current through one or more second components; and

a controller to control the first and second programmable current sources to measure a resistance of the package based at least in part on a reference resistance of the package, the amount of the first current, and the amount of the second current.

10. The apparatus of claim 9, wherein the controller is to control the first programmable current source to generate a first voltage across one or more first components and is to control the second programmable current source to generate a second voltage across one or more second components, wherein the first voltage is to satisfy one or more predetermined relationships with the second voltage.

11. The apparatus of claim 10, wherein the first voltage is substantially equal to the second voltage.

12. The apparatus of claim 9, wherein the first programmable current source comprises a first digital-to-analog converter coupled to a reference current generator,

wherein the second programmable current source comprises a second digital-to-analog converter coupled to the reference current generator, and

wherein the controller is to generate a first control bits setting to control the first digital-to-analog converter and a second control bits setting to control the second digital-to-analog converter.

13. The apparatus of claim 9, wherein the controller is to measure a characteristic based at least in part on the amount of the first and second currents to help measure a resistance of the package.

14. The apparatus of claim 9, wherein the controller is to measure a ratio between a resistance of one or more first components and a resistance of one or more second components based at least in part on the amount of the first and second currents to help measure a resistance of the package.

15. The apparatus of claim 9, wherein the controller is to measure a resistance of the package at a first temperature, and

wherein the reference resistance of the package is based on a measured resistance of the package at a second temperature.

16. The apparatus of claim 9, wherein the controller is to measure power supplied to the integrated circuit based at least in part on the measured resistance.

17. The apparatus of claim 9, comprising another controller to control power based at least in part on the measured resistance.

18. The apparatus of claim 9, comprising a substrate having one or more first components,

wherein the integrated circuit is positioned over the substrate and the substrate has one or more first components to carry current on more than one side of the integrated circuit.

19. The apparatus of claim 9, wherein one or more first components are dedicated for use to carry current through the package to help measure a resistance of the package.

20. A medium having instructions which, when performed by an integrated circuit, cause the integrated circuit to:

control current through one or more components that are to carry current through a package for an integrated circuit; and

measure a resistance of the package based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package.

21. The medium of claim 20, wherein the instructions cause the integrated circuit to generate digital-to-analog converter control bits to control current through one or more components that are to carry current through the package.

22. The medium of claim 20, wherein the instructions cause the integrated circuit to measure a resistance of the package at a first temperature, and

wherein the reference resistance of the package is based on a measured resistance of the package at a second temperature.

23. The medium of claim 20, wherein the instructions cause the integrated circuit to measure a characteristic based at least in part on a resistance of one or more components that are to carry current through the package to help measure a resistance of the package.

24. The medium of claim 20, wherein the instructions cause the integrated circuit to measure a ratio between a resistance of one or more first components that are to carry current through the package and a resistance of one or more second components to help measure a resistance of the package.

25. The medium of claim 20, wherein the instructions cause the integrated circuit to measure power supplied to the integrated circuit based at least in part on the measured resistance.

26. The medium of claim 20, wherein the instructions cause the integrated circuit to control power based at least in part on the measured resistance.

27. A method comprising:

controlling current through one or more components that are to carry current through a package for an integrated circuit; and

measuring a resistance of the package based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package.

28. The method of claim 27, wherein controlling current through one or more components comprises generating digital-to-analog converter control bits to control current through one or more components that are to carry current through the package.

29. The method of claim 27, wherein measuring a resistance of the package comprises measuring a resistance of the package at a first temperature, and

wherein the reference resistance of the package is based on a measured resistance of the package at a second temperature.

30. The method of claim 27, wherein measuring a resistance of the package comprises measuring a characteristic based at least in part on a resistance of one or more components that are to carry current through the package.

31. The method of claim 27, wherein measuring a resistance of the package comprises measuring a ratio between a resistance of one or more first components that are to carry current through the package and a resistance of one or more second components.

32. The method of claim 27, comprising:

measuring power supplied to the integrated circuit based at least in part on the measured resistance.

33. The method of claim 27, comprising:

controlling power based at least in part on the measured resistance.

34. A system comprising:

a battery; and

a packaged integrated circuit coupled to receive power from the battery, the packaged integrated circuit comprising one or more components that are to carry current through a package of the packaged integrated circuit and a monitor to measure a resistance of the package based at least in part on a reference resistance of the package and a resistance of one or more components that are to carry current through the package.

35. The system of claim 34, wherein the monitor is to measure a resistance of the package at a first temperature, and

wherein the reference resistance of the package is based on a measured resistance of the package at a second temperature.

36. The system of claim 34, comprising a controller to control power based at least in part on the measured resistance.

37. The system of claim 34, wherein the packaged integrated circuit forms at least a portion of a processor and wherein the processor may perform instructions as the monitor controls current through one or more components to help measure a resistance of the package.