System and method for mounting a light emitting diode to a printed circuit board
First Claim
1. An LED assembly, comprising:
- a circuit board having a top surface and a bottom surface, said top surface having at least one mounting area for retaining at least one light emitting diode, wherein said circuit board defines a plurality of holes that extend through said circuit board in each said mounting area; and
a light emitting diode mounted to said top surface of said circuit board in each said mounting area, wherein said light emitting diode covers each of said holes disposed in said mounting area.
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Accused Products
Abstract
A light emitting diode (LED) array that is configured to minimize heat damage to the LEDs during both the manufacturing of the array and the use of the array. The LED array utilizes a circuit board. The top surface of the circuit board contains a mounting area for retaining a light emitting diode. A plurality of separate thermal conduits extend through the circuit board within the mounting area. A light emitting diode is mounted to the top surface of the circuit board within the mounting area. The light emitting diode is contacted by the plurality of thermal conduits. The thermal conduits conduct heat away from the LEDs as the LEDS are in operation. Furthermore, the plurality of thermal conduits can be created with little or no thermal shock to the LEDS.
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Citations
16 Claims
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1. An LED assembly, comprising:
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a circuit board having a top surface and a bottom surface, said top surface having at least one mounting area for retaining at least one light emitting diode, wherein said circuit board defines a plurality of holes that extend through said circuit board in each said mounting area; and
a light emitting diode mounted to said top surface of said circuit board in each said mounting area, wherein said light emitting diode covers each of said holes disposed in said mounting area. - View Dependent Claims (2, 3, 4, 5)
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6. A method of fabricating an LED assembly, said method comprising the steps of:
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providing a circuit board having a top surface, a bottom surface and a mounting area on said top surface for receiving a light emitting diode, wherein a plurality of holes are disposed in said circuit board between said top surface and said bottom surface within said mounting area; and
mounting a light emitting diode to said circuit board in said mounting area, wherein said light emitting diode covers said plurality of holes. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A heat dissipating illumination assembly, comprising:
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a circuit board having a top surface and a bottom surface, said top surface having a mounting area for retaining a light emitting diode;
a plurality of separate thermal conduits extending through said circuit board from said top surface to said bottom surface within said mounting area; and
a light emitting diode mounted to said top surface of said circuit board in said mounting area, wherein said light emitting diode is contacted by said plurality of separate thermal conduits. - View Dependent Claims (14, 15, 16)
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Specification