System and method for mounting a light emitting diode to a printed circuit board

• US 20070081342A1
• Filed: 10/07/2006
• Published: 04/12/2007
• Est. Priority Date: 10/07/2005
• Status: Abandoned Application

• Current Assignee: Oliver Szeto
• Original Assignee: Oliver Szeto
• Inventors: Szeto, Oliver
• Application Number:
  US11/545,002
• Publication Number:
  US 20070081342A1
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence

Abstract

A light emitting diode (LED) array that is configured to minimize heat damage to the LEDs during both the manufacturing of the array and the use of the array. The LED array utilizes a circuit board. The top surface of the circuit board contains a mounting area for retaining a light emitting diode. A plurality of separate thermal conduits extend through the circuit board within the mounting area. A light emitting diode is mounted to the top surface of the circuit board within the mounting area. The light emitting diode is contacted by the plurality of thermal conduits. The thermal conduits conduct heat away from the LEDs as the LEDS are in operation. Furthermore, the plurality of thermal conduits can be created with little or no thermal shock to the LEDS.

Claims

1. An LED assembly, comprising:

a circuit board having a top surface and a bottom surface, said top surface having at least one mounting area for retaining at least one light emitting diode, wherein said circuit board defines a plurality of holes that extend through said circuit board in each said mounting area; and

a light emitting diode mounted to said top surface of said circuit board in each said mounting area, wherein said light emitting diode covers each of said holes disposed in said mounting area.

2. The assembly according to claim 1, wherein said holes are filled with a metal, therein creating a plurality of thermal conduits that extend through said circuit board from said top surface to said bottom surface.

3. The assembly according to claim 2, further including a heat sink coupled to said bottom surface of said circuit board, wherein said heat sink contacts each of said thermal conduits under each said mounting area.

4. The assembly according to claim 3, wherein said light emitting diode has leads that extend through said circuit board.

5. The assembly according to claim 4, further including a thermally conductive and electrically insulating pad disposed between said heat sink and said bottom of said circuit board.

6. A method of fabricating an LED assembly, said method comprising the steps of:

providing a circuit board having a top surface, a bottom surface and a mounting area on said top surface for receiving a light emitting diode, wherein a plurality of holes are disposed in said circuit board between said top surface and said bottom surface within said mounting area; and

mounting a light emitting diode to said circuit board in said mounting area, wherein said light emitting diode covers said plurality of holes.

7. The method according to claim 6, further including the step of filling said plurality of holes with metal, therein forming a plurality of thermally conductive conduits that extend between said top surface and said bottom surface of said circuit board under said light emitting diode.

8. The method according to claim 7, further including the step of providing a heat sink and attaching said heat sink to said bottom surface of said circuit board.

9. The method according to claim 8, wherein said heat sink contacts said thermally conductive conduits.

10. The method according to claim 7, wherein said step of filling a plurality of holes with metal includes passing said circuit board through a wave soldering machine, wherein said plurality of holes fill with molten solder.

11. The method according to claim 6, wherein said step of mounting a light emitting diode to said circuit board includes surface mounting said light emitting diode to said circuit board.

12. The method according to claim 6, wherein said light emitting diode has leads and said step of mounting a light emitting diode to said circuit board includes soldering said leads into soldering holes within said circuit board.

13. A heat dissipating illumination assembly, comprising:

a circuit board having a top surface and a bottom surface, said top surface having a mounting area for retaining a light emitting diode;

a plurality of separate thermal conduits extending through said circuit board from said top surface to said bottom surface within said mounting area; and

a light emitting diode mounted to said top surface of said circuit board in said mounting area, wherein said light emitting diode is contacted by said plurality of separate thermal conduits.

14. The assembly according to claim 13, further including a heat sink coupled to said bottom surface of said circuit board, wherein said heat sink contacts said plurality of separate thermal conduits.

15. The assembly according to claim 13, wherein said thermal conduits are holes in said circuit board that are filled with metal.

16. The assembly according to claim 15, wherein said metal is solder.