MEMS SENSOR PACKAGE LEAK TEST

• US 20070084270A1
• Filed: 10/17/2005
• Published: 04/19/2007
• Est. Priority Date: 10/17/2005
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Jarrett, Mark
• Granted Patent: US 7,210,337 B1
• Time in Patent Office: Days
• US Class Current: 73/49.200
• CPC Class Codes: G01M 3/3281 removably mounted in a test cell

Abstract

Methods and apparatus are provided for detecting leaks in a MEMS sensor package, and in particular, a MEMS sensor package that includes an oscillating structure or element that has a Quality (Q) value. The method and apparatus may include measuring the Q value of the MEMS sensor at a first time, applying a pressure to the outside of the MEMS sensor package, and measuring the Q value of the MEMS sensor at a second time after pressure has been applied for a period of time. A change in the measured Q values between the first time and the second time may be determined, which may then be correlated to a leak rate for the particular MEMS sensor package. In some cases, a leak rate of 2×10⁻¹³ He atm.cc/s or less may be detected.

Claims

1. A method for detecting a leak in a MEMS sensor package, wherein the MEMS sensor package includes a sensor cavity that encloses a MEMS sensor, wherein the MEMS sensor includes a mechanical oscillating element with a Quality (Q) value, the method comprising:

measuring a first Q value of the MEMS sensor at a first time;

applying a pressure differential between the sensor cavity and the exterior of the MEMS sensor package; and

measuring a second Q value of the MEMS sensor at a second time, wherein the second time is later than the first time.

2. The method of claim 1 wherein the first Q value is measured before the pressure differential is applied.

3. The method of claim 1 wherein the first Q value is measured after the pressure differential is applied.

4. The method of claim 1 wherein the second Q value is measured while the pressure differential is applied.

5. The method of claim 1 further comprising the step of removing the pressure differential between the sensor cavity and the exterior of the MEMS sensor package, and wherein the second Q value is measured after the pressure differential is removed.

6. The method of claim 1 wherein the differential pressure applying step includes the steps of:

inserting the MEMS sensor into a chamber; and

pressurizing the chamber with a gas for a period of time.

7. The method of claim 1 wherein the second Q value is measured after the pressure differential between the sensor cavity and the exterior of the MEMS sensor package has been applied for a period of time.

8. The method of claim 7 wherein the period of time is less than 100 hours.

9. The method of claim 7 wherein the period of time is less than 50 hours.

10. The method of claim 7 wherein the period of time is less than 20 hours.

11. The method of claim 1 wherein the pressure differential applied by the applying step is less than 200 psig.

12. The method of claim 1 wherein the pressure differential applied by the applying step is less than 100 psig.

13. The method of claim 1 wherein the pressure differential applied by the applying step is less than 50 psig.

14. The method of claim 1 wherein the pressure differential applied by the applying step is less than 20 psig.

15. The method of claim 1 further comprising:

determining a delta Q value, which is the difference between the first Q value and the second Q value; and

comparing the delta Q value to a predetermined delta Q value or a predetermined range of delta Q values.

16. The method of claim 15 further comprising:

determining that the MEMS sensor package does not meet a vacuum integrity requirement when the delta Q value is greater than the predetermined delta Q value or the predetermined range of delta Q values.

17. The method of claim 1 wherein the leak detected is less than 5×

10-12 He atm.cc/s.

18. A method for detecting a leak in a MEMS sensor package, wherein the MEMS sensor package includes a sensor cavity that encloses a MEMS sensor, wherein the MEMS sensor includes a mechanical oscillating element with a Quality (Q) value, the method comprising:

waiting for a period of time;

measuring the Q value of the MEMS sensor; and

using the measured Q value to determine if the MEMS sensor package has an unacceptable leak rate.

19. The method of claim 18 wherein the period of time is greater than 10 hours.

20. The method of claim 18 wherein the period of time is greater than 15 hours.

21. The method of claim 18 wherein the period of time is greater than 20 hours.

22. The method of claim 18 further comprising:

measuring the Q value of the MEMS sensor at two or more different times; and

using two or more of the measured Q values to determine if the MEMS sensor package has an unacceptable leak rate.

27. The method of claim 18 further comprising the step of putting the MEMS sensor package into a pressure chamber, and pressurizing the pressure chamber, prior to the waiting step.

28. The method of claim 27 wherein the pressurized chamber is pressurized with an inert gas.

29. The method of claim 27 wherein the pressurized chamber is pressurized to greater than 100 psig.

30. The method of claim 27 wherein the pressurized chamber is pressurized to greater than 100 psig for more than 10 hours.

23-26. -26. (canceled)