APPARATUS AND METHOD FOR CONTROLLING MICRO-FLUID TEMPERATURE

• US 20070084279A1
• Filed: 12/27/2005
• Published: 04/19/2007
• Est. Priority Date: 10/13/2005
• Status: Abandoned Application

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Huang, Chien-Chih, Liu, Wen-Pin, Wang, Mei-Ya
• Application Number:
  US11/306,383
• Publication Number:
  US 20070084279A1
• Time in Patent Office: Days
• US Class Current: 73/204.260
• CPC Class Codes: G05D 23/1902 characterised by the use of a variable reference value
• CPC Class Codes: G05D 23/24 the sensing element having a resistance varying with temperature, e.g. a thermistor

Abstract

An apparatus for controlling micro-fluid temperature is provided. The apparatus includes a chip, a fixed stand, a heat-absorption block, and an actuator. The chip has a reaction chamber for disposing a micro-fluid, and the temperature of the micro-fluid rises by heating the chip to reach the required reaction temperature. In the cooling-down operation, the heat-absorption block can contact the chip when pushed by the actuator, so as to dissipate the heat from the chip by way of heat conduction. Moreover, in the heating operation, the heat-conductive block is out of contact with the chip such that the micro-fluid in the chip is quickly heated, so as to reach the required reaction temperature of the micro-fluid rapidly.

Claims

1. An apparatus for controlling the micro-fluid temperature, comprising:

a chip, having a reaction chamber for disposing a micro-fluid;

a heat-absorption block, corresponding to the chip;

a fixed stand, for holding the chip or the heat-absorption block; and

an actuator, pushing the chip or the heat-absorption block to make the chip and the heat-absorption block move relative to each other, wherein the actuator is suitable for bringing the heat-absorption block in contact with the chip in a cooling-down operation and bringing the heat-absorption block out of contact with the chip in a heating operation.

2. The apparatus for controlling the micro-fluid temperature as claimed in claim 1, further comprising a switch, wherein when the switch is ON, the actuator pushes the heat-absorption block to contact the chip, and when the switch is OFF, the actuator enables the heat-absorption block to be out of contact with the chip.

3. The apparatus for controlling the micro-fluid temperature as claimed in claim 2, wherein the switch is a relay or a transistor switch.

4. The apparatus for controlling the micro-fluid temperature as claimed in claim 1, wherein the actuator further comprises a push rod for connecting the heat-absorption block.

5. The apparatus for controlling the micro-fluid temperature as claimed in claim 1, wherein the actuator is an electromagnetic actuator, or a shape memory alloy actuator.

6. The apparatus for controlling the micro-fluid temperature as claimed in claim 1, wherein the actuator is a hydraulic actuator, a pneumatic actuator, or an ultrasonic actuator.

7. The apparatus for controlling the micro-fluid temperature as claimed in claim 1, wherein the material of the heat-absorption block comprises copper or aluminum.

8. The apparatus for controlling the micro-fluid temperature as claimed in claim 1, wherein the chip further comprises a heater disposed adjacent to the reaction chamber.

9. The apparatus for controlling the micro-fluid temperature as claimed in claim 7, wherein the heater comprises a resistance wire heater.

10. The apparatus for controlling the micro-fluid temperature as claimed in claim 1, wherein the chip further comprises a temperature sensor disposed adjacent to the reaction chamber.

11. The apparatus for controlling the micro-fluid temperature as claimed in claim 9, wherein the temperature sensor comprises a thermal resistance temperature sensor.

12. A method for controlling the micro-fluid temperature, comprising:

providing a chip with a reaction chamber;

injecting a micro-fluid into the reaction chamber;

heating the chip to a reaction temperature;

bringing a heat-absorption block in contact with the chip in a cooling-down operation; and

bringing the heat-absorption block out of contact with the chip in a heating operation.

13. The method for controlling the micro-fluid temperature as claimed in claim 12, wherein the method of bringing the heat-absorption block in contact with the chip comprises pushing the heat-absorption block or the chip by an actuator to make the heat-absorption block and the chip in contact.

14. The method for controlling the micro-fluid temperature as claimed in claim 12, wherein the method of bringing the heat-absorption block out of contact with the chip comprises moving the heat-absorption block or the chip by an actuator to enable the heat-absorption block to be out of contact with the chip.