Light emitting diode package

• US 20070085096A1
• Filed: 10/12/2006
• Published: 04/19/2007
• Est. Priority Date: 10/13/2005
• Status: Abandoned Application

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Park, Bo
• Application Number:
  US11/546,322
• Publication Number:
  US 20070085096A1
• Time in Patent Office: Days
• US Class Current: 257/94
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED package is provided. The LED package includes: at least one device having at least one LED; at least one resistor having a resistance component; a plurality of bonding pads formed spaced apart from each other on one side of the resistor and changing resistance of the resistor according to a wire bonding position; a conductive part having a current flowing path to electrically connect the device and the resistor; and a substrate having the device, the resistor, and the conductive part.

Claims

1. An LED (light emitting diode) package comprising:

at least one device having at least one LED;

at least one resistor having a resistance component;

a plurality of bonding pads spaced apart from each other on one side of the resistor and changing resistance of the resistor according to a wire bonding position;

a conductive part having a current flowing path to electrically connect the device to the resistor; and

a substrate on which the device, the resistor, and the conductive part are formed.

2. The LED package according to claim 1, wherein the LED comprises at least one of a red LED, a green LED, and a blue LED.

3. The LED package according to claim 1, wherein the resistor is in a line form.

4. The LED package according to claim 1, wherein the resistor is in a band form in one of a straight line form, a jig-jag form, and a ring form, and is formed adjacent to the device.

5. The LED package according to claim 1, wherein the bonding pad comprises gold.

6. The LED package according to claim 1, wherein the device and the resistor are connected in a parallel circuit or a serial circuit using the conductive part.

7. The LED package according to claim 1, wherein the substrate is a MCPCB (metal core printed circuit board).

8. The LED package according to claim 1, wherein the resistor comprises one of an oxide resistance and a dielectric resistance.

9. An LED (light emitting diode) package comprising:

a substrate;

a conductive part formed on the substrate;

at least device emitting light using a voltage supplied from the conductive part;

at least one LED provided to the device;

at least one resistor electrically connected to the device;

a plurality of bonding pads spaced apart from each other and provided to the resistor; and

a wire bonding part connecting the bonding pads to each other to control resistance of the resistor.

10. The LED package according to claim 9, wherein the resistor is in a line form.

11. The LED package according to claim 9, wherein the controlling of the resistance of the resistor using the wire bonding part comprises one of cutting the already-connected wire bonding part, connecting the adjacent bonding pads with the wire bonding part, and directly connecting the respectively spaced bonding pads.

12. The LED package according to claim 9, wherein the resistor is adjacent to the device.

13. The LED package according to claim 9, wherein the resistor is mounted on the surface of the substrate.

14. The LED package according to claim 9, wherein at least one end in both ends of the resistor is permanently connected to the conductive part.

15. The LED package according to claim 9, wherein the device and the resistor are connected in series or in parallel.

16. The LED package according to claim 9, wherein one bonding pad of the resistor and one end of the conductive part are connected by the wire bonding part.

17. The LED package according to claim 9, wherein a red LED, a green LED, and a blue LED are mounted on the device.

18. An LED (light emitting diode) package comprising:

a substrate;

a conductive part formed on the substrate;

at least one device emitting light using a voltage supplied from the conductive part;

at least one LED provided to the device;

at least one resistor disposed in a line form and electrically connected to the device;

a plurality of bonding pads provided to the resistor; and

a wire bonding part connecting the bonding pads to each other and controlling a length of the resistor serving as an actual resistance.

19. The LED package according to claim 18, wherein the resistor is formed of a non-conductive material for heat.

20. The LED package according to claim 18, wherein the boding pad is provided on the resistor and spaced a predetermined distance apart from each other.