Single element optical sensor

• US 20070085109A1
• Filed: 10/14/2005
• Published: 04/19/2007
• Est. Priority Date: 10/14/2005
• Status: Abandoned Application

• Current Assignee: Fronted Analog and Digital Technology Corporation
• Original Assignee: Fronted Analog and Digital Technology Corporation
• Inventors: Hsu, Yung-Jane, Jiang, Yeu-Long
• Application Number:
  US11/249,459
• Publication Number:
  US 20070085109A1
• Time in Patent Office: Days
• US Class Current: 257/233
• CPC Class Codes: H01L 27/14645 Colour imagers
• CPC Class Codes: H01L 31/0352 characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
• CPC Class Codes: H01L 31/101 Devices sensitive to infrared, visible or ultraviolet radiation

Abstract

The single element optical sensor of this invention is a two-terminal element and comprises a light absorbing semiconductor layer, potential barrier materials positioned in said light absorbing layer and two electrodes connected to said light absorbing layer. Positions and chemical compositions of the potential barriers are adjusted according to wavebands of interests. Under different bias conditions photoelectric voltages with separated peaks are generated by the invented optical sensor, whereby color elements of an image may be obtained. Distinguish of light waves of selected wavebands may thus be achieved.

Claims

1. A single element optical sensor, comprising:

a light absorbing semiconductor layer, potential barrier region positioned in said light absorbing layer and two electrodes connected to said light absorbing layer.

2. The single element optical sensor according to claim 1, wherein said potential barrier region is positioned at a distance from a light incident surface of said light absorbing layer, such that when different bias is applied to said optical sensor and an incident light is applied to said light incident surface, said optical sensor generates different photo-generated currents in response to different wavelength elements of said incident light.

3. The single element optical sensor according to claim 1, wherein the compositions of material for said potential barrier region and the detecting regions are adjusted such that when different bias is applied to said optical sensor and an incident light is applied to said light incident surface, said optical sensor generates different photo-generated currents in response to different wavelength elements of said incident light.

4. The single element optical sensor according to claim 1, wherein distance between said potential barrier region and a light incident surface of said light absorbing layer and composition of material for said potential barrier region are adjusted such that when different bias is applied to said optical sensor and an incident light is applied to said light incident surface, said optical sensor generates different photo-generated currents in response to different wavelength elements of said incident light.

5. The single element optical sensor according to claim 1, wherein said light absorbing semiconductor layer comprises at least one element selected from Group IV, Groups III-V or Groups II-V or their compounds.

6. The single element optical sensor according to claim 2, wherein said light absorbing semiconductor layer comprises at least one element selected from Group IV, Groups III-V or Groups II-V or their compounds.

7. The single element optical sensor according to claim 3, wherein said light absorbing semiconductor layer comprises at least one element selected from Group IV, Groups III-V or Groups II-V or their compounds.

8. The single element optical sensor according to claim 4, wherein said light absorbing semiconductor layer comprises at least one element selected from Group IV, Groups III-V or Groups II-V or their compounds.

9. The single element optical sensor according to claim 5, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of silicon, silicon-carbon, silicon-germanium and their compositions.

10. The single element optical sensor according to claim 6, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of silicon, silicon-carbon, silicon-germanium and their compositions.

11. The single element optical sensor according to claim 7, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of silicon, silicon-carbon, silicon-germanium and their compositions.

12. The single element optical sensor according to claim 8, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of silicon, silicon-carbon, silicon-germanium and their compositions.

13. The single element optical sensor according to claim 5, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of GaAs, InP, CdTe, HgCdTe, ZnSe and their compositions.

14. The single element optical sensor according to claim 6, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of GaAs, InP, CdTe, HgCdTe, ZnSe and their compositions.

15. The single element optical sensor according to claim 7, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of GaAs, InP, CdTe, HgCdTe, ZnSe and their compositions.

16. The single element optical sensor according to claim 8, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of GaAs, InP, CdTe, HgCdTe, ZnSe and their compositions.

17. The single element optical sensor according to claim 1, comprising at least 2 potential barrier regions.

18. The single element optical sensor according to claim 2, comprising at least 2 potential barrier regions.

19. The single element optical sensor according to claim 3, comprising at least 2 potential barrier regions.

20. The single element optical sensor according to claim 4, comprising at least 2 potential barrier regions.

21. The single element optical sensor according to claim 1, wherein one electrode is transparent and is positioned at a light incident terminal of said light absorbing semiconductor layer.

22. The single element optical sensor according to claim 17, wherein one electrode is transparent and is positioned at a light incident terminal of said light absorbing semiconductor layer.

23. An optical sensing device, comprising:

an optical sensor to detect incident light and to generate photo-generated currents in response to light wave elements in particular wavebands of said incident light;

a variable power source to supply a variable bias to said optical sensor;

a comparator to compare a reference voltage and output of said optical sensor;

a current to voltage converter to convert output current of said optical sensor into voltage; and

a signal processing unit to control output bias of said variable power source and output of said optical sensor;

wherein said optical sensor comprises;

a light absorbing semiconductor layer, potential barrier region positioned in said light absorbing layer and two electrodes connected to said light absorbing layer.

24. The optical sensing device according to claim 23, wherein said potential barrier region is positioned at a distance from a light incident surface of said light absorbing layer, such that when different bias is applied to said optical sensor and an incident light is applied to said light incident surface, said optical sensor generates different photo-generated currents in response to different wavelength elements of said incident light.

25. The optical sensing device according to claim 23, wherein composition of material for said potential barrier region is adjusted such that when different bias is applied to said optical sensor and an incident light is applied to said light incident surface, said optical sensor generates different photo-generated currents in response to different wavelength elements of said incident light.

26. The optical sensing device according to claim 23, wherein distance between said potential barrier region and a light incident surface of said light absorbing layer and composition of material for said potential barrier region are adjusted such that when different bias is applied to said optical sensor and an incident light is applied to said light incident surface, said optical sensor generates different photo-generated currents in response to different wavelength elements of said incident light.

27. The optical sensing device according to claim 23, wherein said light absorbing semiconductor layer comprises at least one element selected from Group IV, Groups III-V or Groups II-V or their compounds.

28. The optical sensing device according to claim 24, wherein said light absorbing semiconductor layer comprises at least one element selected from Group IV, Groups III-V or Groups II-V or their compounds.

29. The optical sensing device according to claim 25, wherein said light absorbing semiconductor layer comprises at least one element selected from Group IV, Groups III-V or Groups II-V or their compounds.

30. The optical sensing device according to claim 26, wherein said light absorbing semiconductor layer comprises at least one element selected from Group IV, Groups III-V or Groups II-V or their compounds.

31. The optical sensing device according to claim 27, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of silicon, silicon-carbon, silicon-germanium and their compositions.

32. The optical sensing device according to claim 28, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of silicon, silicon-carbon, silicon-germanium and their compositions.

33. The optical sensing device according to claim 29, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of silicon, silicon-carbon, silicon-germanium and their compositions.

34. The optical sensing device according to claim 30, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of silicon, silicon-carbon, silicon-germanium and their compositions.

35. The optical sensing device according to claim 27, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of GaAs, InP, CdTe, HgCdTe, ZnSe and their compositions.

36. The optical sensing device according to claim 28, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of GaAs, InP, CdTe, HgCdTe, ZnSe and their compositions.

37. The optical sensing device according to claim 29, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of GaAs, InP, CdTe, HgCdTe, ZnSe and their compositions.

38. The optical sensing device according to claim 30, wherein said light absorbing semiconductor layer comprises at least one element selected from the group consisted of GaAs, InP, CdTe, HgCdTe, ZnSe and their compositions.

39. The optical sensing device according to claim 23, comprising at least 2 potential barrier regions.

40. The optical sensing device according to claim 24, comprising at least 2 potential barrier regions.

41. The optical sensing device according to claim 25, comprising at least 2 potential barrier regions.

42. The optical sensing device according to claim 26, comprising at least 2 potential barrier regions.

43. The optical sensing device according to claim 23, wherein one electrode is transparent and is positioned at a light incident terminal of said light absorbing semiconductor layer.