DIELECTRIC COMPOSITE MATERIAL

• US 20070085212A1
• Filed: 11/09/2006
• Published: 04/19/2007
• Est. Priority Date: 06/19/2003
• Status: Abandoned Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Mao, Guoping, Clough, Robert, Li, Fuming, Qu, Shichun, O'Bryan, Nelson
• Application Number:
  US11/558,163
• Publication Number:
  US 20070085212A1
• Time in Patent Office: Days
• US Class Current: 257/758
• CPC Class Codes: C08L 65/00 Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain C08L7/00 - C08L57/00, C08L61/00 take precedence; Compositions of derivatives of such polymers
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49894 Materials of the insulating layers or coatings
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0239 Coupling agent for particles using a coupling agent to improve the adhesion between an insulating substrate and a metal H05K3/389
• CPC Class Codes: H05K 3/4626 characterised by the insulating layers or materials H05K3/4688 takes precedence

Abstract

A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

Claims

1. A substrate structure comprising a conductive layer coated with at least one layer of dielectric composite material, said dielectric composite material having a dielectric constant less than about 3.5, a dielectric loss of less than about 0.004, including a toughened benzocyclobutene resin, and from about 50% to about 75% by weight of at least one inorganic particulate filler, the resin and the filler being compatibilized by means of a silane coupling agent.

2. A substrate structure according to claim 1 wherein said conductive layer is a copper layer.

3. A substrate structure according to claim 1 wherein said conductive layer is formed from a laminated low profile copper, or plated copper, or sputtered aluminum, having a thickness of less than about 15 μ

m.

4. A substrate structure according to claim 1 wherein said at least one inorganic particulate filler is a particulate silica having an average particle size less than or equal to ten percent of the thickness of a layer of the dielectric composite material.

5. A substrate structure according to claim 1 wherein said silane coupling agent is selected from the group consisting of vinyltriethoxysilane, vinyltriacetoxysilane, 7-octenyltrimethoxysilane, and mixtures thereof.

6. A substrate structure according to claim 1 wherein said structure further includes a primer on said copper surface, said primer being selected from the group consisting of vinyltriacetoxysilane, aminosilane, and aminopropylsilane.