DENSITY-AWARE DYNAMIC LEVELING IN SCANNING EXPOSURE SYSTEMS

• US 20070085991A1
• Filed: 10/18/2005
• Published: 04/19/2007
• Est. Priority Date: 10/18/2005
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Holmes, Steven, Brodsky, Colin, Liegl, Bernhard, Bukofsky, Scott
• Granted Patent: US 7,239,371 B2
• Time in Patent Office: Days
• US Class Current: 355/55
• CPC Class Codes: G03F 9/7026 Focusing
• CPC Class Codes: G03F 9/7034 Leveling

Abstract

A method and apparatus are provided for improving the leveling and, consequently, the focusing of a substrate such as a wafer during the photolithography imaging procedure of a semiconductor manufacturing process. The invention performs a pre-scan of the wafer'"'"'s topography and assigns importance values to different regions of the wafer surface. Exposure focus instructions are calculated based on the topography and importance values of the different regions and the wafer is then scanned and imaged based on the calculated exposure focus instructions.

Claims

1. A method for making an integrated circuit device such as a wafer wherein one or more steps of the method requires a photolithography step which includes leveling of the wafer comprising the steps of:

loading a wafer into a wafer imaging photolithography exposure system;

pre-scanning the wafer to determine data on the topography of the wafer over different regions of the wafer;

assigning focus importance values to the different regions of the wafer;

calculating exposure focus instructions for the photolithography step based on the pre-scanned topography data and region focus importance values;

scanning and exposing the wafer based on the calculated exposure focus instructions; and

releasing the wafer and unloading the wafer from the exposure system.

2. The method of claim 1 wherein the photolithography exposure system is a step-and-scan system.

3. The method of claim 1 wherein the photolithography exposure system is a step-and-repeat system.

4. The method of claim 1 wherein an imaging slit containing a plurality of leveling spots is used to pre-scan the wafer in order to calculate the exposure focus instructions.

5. An apparatus for making an integrated circuit device such as a wafer wherein photolithography means are used to image the wafer during the making of the wafer comprising:

means for loading a wafer into a wafer imaging photolithography exposure system;

a photolithography exposure system including means to pre-scan the wafer to determine data on the topography of the wafer over different regions of the wafer;

means to assign focus importance values to the different regions of the wafer;

means to calculate exposure focus instructions for the photolithography step based on the pre-scanned topography data and region focus important values;

means for imaging the wafer; and

means for releasing a wafer and unloading the wafer from the exposure system;

wherein during the photolithography imaging step of the process the wafer is exposed based on the calculated exposure focus instructions during which the wafer is positioned in the system based on the calculated exposure focus instructions.

6. The apparatus of claim 5 wherein the photolithography exposure system is a step-and-scan system.

7. The apparatus of claim 5 wherein the photolithography exposure system is a step-an-repeat system.

8. The apparatus of claim 5 wherein the photolithography exposure system uses an imaging slit containing a plurality of leveling spots to pre-scan the wafer to determine the data and the leveling spots are adjusted in any combination during the exposure based on the calculated exposure focus instructions.

9. The apparatus of claim 5 wherein focus importance values are determined based on knowledge of the location of product chip versus supporting kerf.

10. The apparatus of claim 5 wherein focus importance values are determined based on expected revenue per wafer area.

11. The apparatus of claim 5 wherein focus importance values are determined based on yield limiting aspects known prior to processing the wafer.

12. The apparatus of claim 5 wherein the pre-scanning data are selectively filtered based on user input not limited to design density yield data or revenue requirements of shared-customer reticles.

13. The apparatus of claim 5 where exposure focus instructions are performed only when leveling errors exceed a user-defined threshold.