Housing for an electromagnetic radiation emitting optoelectronic component, component and method of making a housing or a component

• US 20070086148A1
• Filed: 09/25/2006
• Published: 04/19/2007
• Est. Priority Date: 09/30/2005
• Status: Active Grant

• Current Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG), Hella KGaA Hueck & Company
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG), Hella KGaA Hueck & Company
• Inventors: Reill, Joachim, Engl, Moritz, Schwenkschuster, Lukas, Wuller, Martin
• Granted Patent: US 7,679,100 B2
• Time in Patent Office: Days
• US Class Current: 361/600
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21S 41/151 arranged in one or more lines
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A housing for an electromagnetic radiation emitting optoelectronic component is specified. The housing comprises a housing base body provided with a recess in which at least one chip mounting surface is disposed. At least one outer surface of the housing base body, disposed on an emission side of the housing and adjoining the recess, is provided with a baffle layer suitable for screening an electromagnetic radiation. An electromagnetic radiation emitting component provided with such a housing and a method of making a corresponding housing or component are also specified.

Claims

1. A housing for an electromagnetic radiation emitting optoelectronic component, comprising:

a housing base body provided with a recess in which at least one chip mounting surface is disposed,

wherein an outer surface of said housing base body, disposed on an emission side of the housing and adjoining said recess, is provided at least in part with a baffle layer suitable for screening electromagnetic radiation.

2. The housing as in claim 1,

characterized in that said outer surface comprises a region extending perpendicularly to an optical axis of said housing and/or parallel to said chip mounting surface.

3. The housing as in claim 1,

characterized in that said housing base body comprises a carrier element on which said chip mounting surface is disposed and, disposed on said carrier element, a frame element that defines a cavity.

4. The housing as in claim 1,

characterized in that said outer surface adjoins an inner wall of said recess that is configured as a light stop wall and is suitable for suppressing radiation emission from the housing within an undesired spatial region.

5. The housing as in claim 4,

characterized in that said light stop wall extends substantially at an angle greater than or equal to 80°

and smaller than or equal to 100°

with respect to a principal plane of extension of said chip mounting surface.

6. The housing as in claim 1,

characterized in that said baffle layer comprises a material reflective of said electromagnetic radiation.

7. The housing as in claim 1,

characterized in that said baffle layer comprises a material absorptive of said electromagnetic radiation.

8. The housing as in claim 7,

characterized in that said baffle layer comprises a black material.

9. The housing as in claim 1,

characterized in that said baffle layer comprises a lacquer.

10. The housing as in claim 1,

characterized in that said housing base body comprises ceramic material in a region covered by said baffle layer.

11. The housing as in claim 1,

characterized in that said housing base body comprises plastic in a region covered by said baffle layer.

12. The housing as in claim 1,

characterized in that at least one outer side surface of said housing base body that adjoins said outer surface is additionally provided with a baffle layer.

13. The housing as in claim 12,

characterized in that said outer side surface is at least partly inclined with respect to a plane extending perpendicularly to a mounting plane of said housing.

14. The housing as in claim 13,

characterized in that said outer side surface is at least partly inclined with respect to said plane at an angle of 30°

to 60°

, inclusively.

15. The housing as in claim 1,

characterized in that said baffle layer comprises or is made of plastic.

16. An electromagnetic radiation emitting component provided with at least one luminescent diode,

characterized in that it comprises a housing as in claim 1.

17. The component as in claim 16,

characterized in that it is configured as a light module for vehicle headlights.

18. A method of making a housing for an electromagnetic radiation emitting optoelectronic component or an electromagnetic radiation emitting component provided with such a housing,

characterized by the following method steps:

preparing a housing comprising a housing base body provided with a recess,

applying a baffle layer to at least one outer surface disposed on an emission side of the housing and adjoining the recess, said baffle layer being suitable for screening an electromagnetic radiation.

19. The method as in claim 18,

characterized in that the application of said baffle layer includes the use of pad printing.

20. The method as in claim 18,

characterized in that the application of said baffle layer includes the use of screen printing.

21. The method as in claim 18,

characterized in that the application of said baffle layer includes the use of inkjet printing.

22. The method as in claim 18,

characterized in that the application of said baffle layer includes the use of plastic coating.

23. The method as in claim 18,

characterized in that the application of said baffle layer includes the use of powder coating.

24. The method as in claim 18,

characterized in that the application of said baffle layer includes the application of a paste and/or sputtering.

25. The method as in claim 24,

characterized in that the application of said baffle layer includes the application of a metal-containing material by the application of a paste and/or sputtering.