Method of manufacturing a sensor dispensing instrument having a modular electronics assembly
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Abstract
A sensor dispensing instrument adapted to handle a sensor pack containing a plurality of sensors and to perform a test using one of the sensors, wherein the sensor dispensing instrument includes an electronics assembly for performing the test and displaying test results. The electronics assembly includes a printed circuit board having electrical components, at least one button, and a liquid crystal display mounted thereon. The electronics assembly is formed and tested prior to assembling the electronics assembly into the outer housing of the sensor dispensing instrument.
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Citations
36 Claims
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1-13. -13. (canceled)
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14. A method of manufacturing a sensor dispensing instrument adapted to handle a sensor pack containing a plurality of sensors, each of said plurality of sensors being disposed in a sensor cavity on said sensor pack and enclosed by a protective covering, said sensor dispensing instrument further adapted to perform a test using one of said plurality of sensors, said method comprising the acts of:
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a) manufacturing an outer housing having a sensor slot through which one of said sensors is disposed to conduct said test;
b) manufacturing a mechanical mechanism comprising an indexing disk for supporting and rotating said sensor pack, an indexing disk drive arm for rotating said indexing disk, a knife blade assembly for puncturing said covering and ejecting one of said sensors from said sensor cavity and through said sensor slot, and a puller handle for moving said indexing disk drive arm and said knife blade assembly;
c) manufacturing an electronics sub-assembly comprising a printed circuit board, electrical components mounted on the printed circuit board for conducting electronic functions in response to electrical signals, at least one button mounted on the printed circuit board for supplying electrical signals to the electrical components, and a liquid crystal display mounted on the printed circuit board for displaying said test results; and
d) assembling said mechanical mechanism and said electronics assembly into said outer housing. - View Dependent Claims (15, 20, 21, 22, 23, 24, 25, 26)
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16. A method of manufacturing a sensor dispensing instrument adapted to handle a sensor pack containing a plurality of sensors, each of said plurality of sensors being disposed in a sensor cavity on said sensor pack and enclosed by a protective covering, said sensor dispensing instrument further adapted to perform a test using one of said plurality of sensors, said sensor dispensing instrument comprising an outer housing having a sensor slot through which one of said sensors is disposed to conduct the test, and said sensor dispensing instrument further, comprising a mechanical mechanism having an indexing disk for supporting and rotating said sensor pack, an indexing disk drive arm for rotating said indexing disk, a knife blade assembly for puncturing said protective covering and ejecting one of said sensors from said sensor cavity and through said sensor slot, and a puller handle for moving said indexing disk drive arm and said knife blade assembly, said method comprising the acts of:
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a) assembling an electronics sub-assembly by performing the acts of;
1. manufacturing a printed circuit board;
2. mounting electrical components on said printed circuit board, said electrical components for conducting electronic functions in response to electrical signals;
3. mounting a plurality of buttons on said printed circuit board, said plurality of buttons for supplying electrical signals to the electrical components;
4. mounting battery terminals on said printed circuit board, said battery terminals adapted to connect to a battery for supplying electrical power to said printed circuit board; and
5. mounting a liquid crystal display on said printed circuit board, said liquid crystal display for displaying said test results;
b) testing said electronics sub-assembly for electrical performance; and
c) assembling said electronics sub-assembly into said outer housing of said sensor dispensing instrument. - View Dependent Claims (17, 27, 28, 29, 30, 31)
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32. A method of manufacturing a sensor dispensing instrument adapted to handle a sensor pack containing a plurality of sensors, said sensor dispensing instrument being adapted to perform a test using one of said plurality of test sensors, the method comprising the acts of:
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manufacturing an outer housing having a sensor slot, said sensor slot being adapted to dispose a sensor therethrough;
manufacturing an electronics sub-assembly comprising a printed circuit board, electrical components mounted on said printed circuit board for conducting electronic functions in response to electrical signals, at least one button mated to said printed circuit board for supplying electrical signals to said electrical components, and a liquid crystal display mounted on said printed circuit board for displaying the test results; and
assembling said electronics sub-assembly into said outer housing. - View Dependent Claims (33, 34, 35, 36)
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Specification