METHOD AND APPARATUS FOR INTEGRATED-CIRCUIT BATTERY DEVICES
First Claim
1. An integrated circuit package apparatus, comprising:
- an integrated circuit die;
a lead-frame;
a thin-film battery provided on a substrate;
an electrical connection between said integrated circuit die and said thin-film battery; and
said integrated circuit die, said lead-frame;
said substrate, said thin-film battery and said electrical connection encapsulated together within an encapsulant material.
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Accused Products
Abstract
A combined battery and device apparatus and associated method. This apparatus includes a first conductive layer, a battery comprising a cathode layer; an anode layer, and an electrolyte layer located between and electrically isolating the anode layer from the cathode layer, wherein the anode or the cathode or both include an intercalation material, the battery disposed such that either the cathode layer or the anode layer is in electrical contact with the first conductive layer, and an electrical circuit adjacent face-to-face to and electrically connected to the battery. Some embodiments further include a photovoltaic cell and/or thin-film capacitor. In some embodiments, the substrate includes a polymer having a melting point substantially below 700 degrees centigrade. In some embodiments, the substrate includes a glass. For example, some embodiments include a battery deposited directly on the back of a liquid-crystal display (LCD) device.
169 Citations
16 Claims
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1. An integrated circuit package apparatus, comprising:
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an integrated circuit die;
a lead-frame;
a thin-film battery provided on a substrate;
an electrical connection between said integrated circuit die and said thin-film battery; and
said integrated circuit die, said lead-frame;
said substrate, said thin-film battery and said electrical connection encapsulated together within an encapsulant material. - View Dependent Claims (2, 3, 4, 6, 7, 8, 9, 10, 11, 12, 13)
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5. The apparatus of claim 5, wherein said substrate is an electrically conductive foil substrate.
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14. An integrated circuit package, comprising:
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a thin-film battery having an anode and a cathode;
a lead-frame;
an integrated circuit die; and
an encapsulant material encapsulating the thin-film battery, the lead-frame and the integrated circuit die, wherein the thin-film battery is fabricated on the lead-frame, the lead-frame is electrically coupled to one of the anode and cathode, and the integrated circuit die is electrically coupled to the lead-frame and the other of the anode and cathode.
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15. An integrated circuit package, comprising:
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a thin-film battery having first and second conductive surfaces on opposing sides of the thin-film battery;
a lead-frame electrically coupled to the first conductive surface;
an integrated circuit die electrically coupled to the second conductive surface; and
an encapsulant material encapsulating the thin-film battery, the lead-frame and the integrated circuit die. - View Dependent Claims (16)
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Specification