Gas supply device and apparatus for processing a substrate

• US 20070087296A1
• Filed: 10/16/2006
• Published: 04/19/2007
• Est. Priority Date: 10/18/2005
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Woo-Seok, Huh, No-Hyun, Hong, Joo-Pyo, Han, Jae-Hyun
• Application Number:
  US11/581,111
• Publication Number:
  US 20070087296A1
• Time in Patent Office: Days
• US Class Current: 431/181
• CPC Class Codes: C23C 16/45508 Radial flow
• CPC Class Codes: C23C 16/4558 Perforated rings

Abstract

A gas supply device may include a first gas supply member that may be disposed in a chamber and around a substrate loaded in the chamber. The first gas supply member may include nozzles for providing a gas onto the substrate. A second gas supply member that may provide the gas supplied from at least one gas supply line to the first gas supply member.

Claims

1. A gas supply device comprising:

a first gas supply member disposed in a chamber and around a substrate loaded in the chamber, the first gas supply member including nozzles for providing a gas onto the substrate; and

a second gas supply member connected to the first gas supply member, the second gas supply member providing the gas supplied from at least one gas supply line to the first gas supply member.

2. The gas supply device of claim 1, wherein the second gas supply member is disposed within the first gas supply member, the second gas supply member having a plurality of openings to connect an inner cavity of the second gas supply member to an inner cavity of the first gas supply member.

3. The gas supply device of claim 2, wherein the plurality of openings and the at least one gas supply line are alternately disposed, and the plurality of openings and the plurality of the nozzles are alternately disposed.

4. The gas supply device of claim 2, wherein the number of the openings is greater than the number of the gas supply lines.

5. The gas supply device of claim 1, wherein the first gas supply member is disposed within and makes contact with the second gas supply member, the second gas supply member having a plurality of openings formed between the first gas supply member and the second gas supply member to connect an inner cavity of the second gas supply member to an inner cavity of the first gas supply member.

6. The gas supply device of claim 5, wherein the plurality of openings and the at least one gas supply line are alternately disposed, and the plurality of openings and the plurality of the nozzles are alternately disposed.

7. The gas supply device of claim 5, wherein the number of the openings is greater than the number of the gas supply lines.

8. The gas supply device of claim 1, wherein the first gas supply member is disposed on the second gas supply member, and wherein a plurality of openings may be formed in the contact portion where the first gas supply member and the second gas supply member make contact, and to connect an inner cavity of the second gas supply member to an inner cavity of the first gas supply member.

9. The gas supply device of claim 8, wherein the plurality of openings and the gas supply lines are alternately disposed, and the plurality of openings and the plurality of the nozzles are alternately disposed.

10. The gas supply device of claim 8, wherein the number of the openings is greater than the number of the gas supply lines.

11. The gas supply device of claim 1, wherein the first gas supply member is spaced apart from the second gas supply member, and wherein the gas supply device includes a plurality of connection lines for connecting an inner cavity of the second gas supply member to an inner cavity of the first gas supply member.

12. The gas supply device of claim 11, wherein the connection lines and the gas supply lines are alternately disposed, and the connection lines and the plurality of the nozzles are alternately disposed.

13. The gas supply device of claim 11, wherein the number of the connection lines is greater than the number of the gas supply lines.

14. The gas supply device of claim 1, wherein the first gas supply member and the second gas supply member are connected to different gas reservoirs.

15. The gas supply device of claim 2, further comprising a sealing member for sealing a connection between the at least one gas supply line and the second gas supply member.

16. The gas supply device of claim 2, further comprising a frame disposed in the first gas member to support the second gas supply member which is separated from the first gas supply member.

17. A substrate processing apparatus comprising:

a chamber for receiving a substrate;

a stage disposed in the chamber to support the substrate;

at least one gas supply device of claim 1;

and

a gas exhausting unit connected to the chamber to exhaust an unreacted gas and reaction by-products from the chamber.

18. The substrate processing apparatus of claim 17, wherein the second gas supply member is disposed within the first gas supply member, and wherein the second gas supply member having a plurality of openings to connect an inner cavity of the second gas supply member to an inner cavity of the first gas supply member.

19. The substrate processing apparatus of claim 18, further comprising:

a sealing member for sealing a connection between the at least one gas supply line and the second gas supply member; and

a frame disposed in the first gas supply member to support the second gas member which is separated from the first gas supply member by a predetermined distance.

20. The substrate processing apparatus of claim 18, wherein the plurality of openings and the at least one gas supply line are alternately disposed, and the plurality of openings and the plurality of the nozzles are alternately disposed.

21. The substrate processing apparatus of claim 18, wherein the number of the openings is greater than the number of the gas supply lines.

22. The substrate processing apparatus of claim 18, wherein the substrate processing apparatus comprises a plurality of gas supply units stacked around the substrate.

23. The substrate processing apparatus of claim 22, wherein the gas supply units each provide different gases onto the substrate.