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Method of forming a device package having edge interconnect pad

  • US 20070087462A1
  • Filed: 10/14/2005
  • Published: 04/19/2007
  • Est. Priority Date: 10/14/2005
  • Status: Active Grant
First Claim
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1. A method for forming an edge interconnect pad to a MEMS device package, comprising:

  • forming an array of MEMS devices overlaying at least one conductive via that electrically connects to an underlying layer;

    depositing, by way of a damascene process, a conductive material on a substrate that is coplanar with the array of MEMS devices, the conductive material coupling to the at least one conductive via; and

    covering the array of MEMS devices and the conductive material with a passivation layer.

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