Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs
First Claim
1. An integrated circuit manufacturing process using data related to manufacturing procedures used previously that a plurality of integrated circuits of Dynamic Random Access Memory (DRAM) semiconductor devices have undergone for selecting manufacturing procedures the plurality of integrated circuits of the Dynamic Random Access Memory (DRAM) semiconductor devices are to undergo, each Dynamic Random Access Memory (DRAM) semiconductor device having integrated circuits and having a substantially unique identification code, the manufacturing process comprising:
- storing data in association with the identification code of each Dynamic Random Access Memory (DRAM) semiconductor device of the plurality identifying manufacturing procedures each Dynamic Random Access Memory (DRAM) semiconductor device has undergone, the storing data comprising storing data that identifies spare rows and columns used in repairing each DRAM semiconductor device;
automatically reading the identification code of each Dynamic Random Access Memory (DRAM) semiconductor device; and
accessing the data stored in association with the identification code of each Dynamic Random Access Memory (DRAM) semiconductor device.
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Accused Products
Abstract
An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on ICs at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the ICs. The ID codes of the ICs are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the ICs is then accessed, and additional repair procedures the ICs may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.
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Citations
24 Claims
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1. An integrated circuit manufacturing process using data related to manufacturing procedures used previously that a plurality of integrated circuits of Dynamic Random Access Memory (DRAM) semiconductor devices have undergone for selecting manufacturing procedures the plurality of integrated circuits of the Dynamic Random Access Memory (DRAM) semiconductor devices are to undergo, each Dynamic Random Access Memory (DRAM) semiconductor device having integrated circuits and having a substantially unique identification code, the manufacturing process comprising:
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storing data in association with the identification code of each Dynamic Random Access Memory (DRAM) semiconductor device of the plurality identifying manufacturing procedures each Dynamic Random Access Memory (DRAM) semiconductor device has undergone, the storing data comprising storing data that identifies spare rows and columns used in repairing each DRAM semiconductor device;
automatically reading the identification code of each Dynamic Random Access Memory (DRAM) semiconductor device; and
accessing the data stored in association with the identification code of each Dynamic Random Access Memory (DRAM) semiconductor device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of manufacturing integrated circuit Dynamic Random Access Memory (DRAM) semiconductor devices from semiconductor wafers, the method comprising:
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providing a plurality of semiconductor wafers;
fabricating a plurality of Dynamic Random Access Memory (DRAM) semiconductor devices on each of the semiconductor wafers of the plurality of semiconductor wafers;
causing each Dynamic Random Access Memory (DRAM) semiconductor device of the plurality on each of the semiconductor wafers of the plurality of semiconductor wafers to store a substantially unique identification code;
storing data in association with the identification code of each Dynamic Random Access Memory (DRAM) semiconductor device of the plurality that identifies manufacturing procedures each Dynamic Random Access Memory (DRAM) semiconductor device of the plurality has undergone, the storing data comprising storing data that identifies spare rows and columns used in repairing each DRAM semiconductor device of the plurality;
separating each Dynamic Random Access Memory (DRAM) semiconductor device of the plurality on each of the semiconductor wafers of the plurality of semiconductor wafers from its wafer to form one Dynamic Random Access Memory (DRAM) semiconductor device of a plurality of Dynamic Random Access Memory (DRAM) semiconductor devices;
assembling each Dynamic Random Access Memory (DRAM) semiconductor device of the plurality into a Dynamic Random Access Memory (DRAM) semiconductor device assembly;
automatically reading the identification code associated with each Dynamic Random Access Memory (DRAM) semiconductor device of the plurality; and
accessing the data stored in association with the identification code associated with each Dynamic Random Access Memory (DRAM) semiconductor device of the plurality. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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23. A method of manufacturing Multi-Chip Modules (MCMs) from semiconductor wafers, the MCMs selected from a group of Single In-Line Memory Modules (SIMMs) and Dual In-line Memory Modules (DIMMs), Rambus In-Line Memory Modules (RIMMs), Small Outline Rambus In-Line Memory Modules (SO-RIMMs), Personal Computer Memory Format (PCMCIA), and Board-Over-Chip type substrates, the method comprising:
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providing a plurality of semiconductor wafers;
fabricating a plurality of semiconductor devices on each of the semiconductor wafers of the plurality of semiconductor wafers;
causing each semiconductor device of the plurality of semiconductor devices on each of the semiconductor wafers of the plurality of semiconductor wafers to store a substantially unique identification code;
storing data in association with the identification code of each semiconductor device of the semiconductor devices that identifies manufacturing procedures each semiconductor device of the plurality of semiconductor devices has undergone, the storing data including storing data that identifies rows and columns used in repairing a semiconductor device;
separating each semiconductor device of the plurality of semiconductor devices on each semiconductor wafer of the plurality of semiconductor wafers from its wafer to form one semiconductor device of a plurality of semiconductor devices;
assembling one or more of the semiconductor devices of the plurality into each of a plurality of MCMs;
automatically reading the identification code of each semiconductor device of the plurality of semiconductor devices in each MCM of the plurality of MCMs; and
accessing the data stored in association with the identification code of each semiconductor device of the plurality of semiconductor devices in each MCM of the plurality of MCMs. - View Dependent Claims (24)
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Specification