×

Methods of Forming Embedded Thermoelectric Coolers With Adjacent Thermally Conductive Fields and Related Structures

  • US 20070089773A1
  • Filed: 11/27/2006
  • Published: 04/26/2007
  • Est. Priority Date: 10/22/2004
  • Status: Active Grant
First Claim
Patent Images

1. A method of forming a thermoelectric device, the method comprising:

  • providing a substrate having a surface;

    thermally coupling a thermoelectric p-n couple to a first portion of the surface of a substrate, wherein the thermoelectric p-n couple includes a p-type thermoelectric element and an n-type thermoelectric element; and

    forming a thermally conductive field layer on a second portion of the surface of the substrate adjacent the first portion of the surface of the substrate.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×