CMOS devices with a single work function gate electrode and method of fabrication
First Claim
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1. An device comprising:
- a first transistor of a first type and a second transistor of a type complementary to said first transistor on a substrate, wherein a channel region of said first transistor has a band gap that is different than that of an adjacent semiconductor region and wherein a gate electrode of said first transistor has substantially the same work function as a gate electrode of said second transistor.
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Abstract
Described herein are a device utilizing a gate electrode material with a single work function for both the pMOS and nMOS transistors where the magnitude of the transistor threshold voltages is modified by semiconductor band engineering and article made thereby. Further described herein are methods of fabricating a device formed of complementary (pMOS and nMOS) transistors having semiconductor channel regions which have been band gap engineered to achieve a low threshold voltage.
411 Citations
20 Claims
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1. An device comprising:
a first transistor of a first type and a second transistor of a type complementary to said first transistor on a substrate, wherein a channel region of said first transistor has a band gap that is different than that of an adjacent semiconductor region and wherein a gate electrode of said first transistor has substantially the same work function as a gate electrode of said second transistor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An device, comprising:
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a pMOS transistor and an nMOS transistor on a substrate, wherein said pMOS transistor and said nMOS transistor each further comprise;
a non-planar silicon body having a top surface and a pair of laterally opposite sidewalls;
a channel region, wherein said channel region of said pMOS transistor comprises a silicon-germanium cladding layer adjacent to said non-planar silicon body;
a gate insulator adjacent to said channel region, wherein said gate insulator has a dielectric constant above about 8;
a gate electrode adjacent to said gate insulator, wherein said gate electrode of said pMOS transistor and said gate electrode of said nMOS transistor have the same work function; and
a source region and a drain region on opposite sides of said gate electrode. - View Dependent Claims (11)
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12. A method, comprising:
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forming a first transistor and a second transistor on a substrate, wherein forming each of said first transistor and said second transistor further comprises;
forming a channel region, wherein said channel region of said first transistor has a band gap different than that of an adjacent semiconductor region;
forming a gate insulator adjacent to said channel region;
forming a gate electrode adjacent said gate insulator, wherein said gate electrode of said first transistor and said gate electrode of said second transistor have the same mid-gap work function; and
forming a source region and a drain region on opposite sides of said gate electrode. - View Dependent Claims (13, 14, 15, 16)
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17. A method, comprising:
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forming a first transistor and a second transistor on a substrate, wherein forming each of said first transistor and said second transistor further comprises;
forming a non-planar silicon body;
forming a channel region on said non-planar silicon body, wherein said channel region of said first transistor is comprised of silicon-germanium;
forming a high-k gate insulator adjacent to said channel region;
forming a gate electrode adjacent said gate insulator, wherein said gate electrode of said first transistor and said gate electrode of said second transistor have the same mid-gap work function; and
forming a source region and a drain region on opposite sides of said gate electrode. - View Dependent Claims (18, 19, 20)
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Specification