Power circuit package and fabrication method
First Claim
1. A power circuit package comprising:
- a base comprising a substrate, a plurality of interconnect circuit layers over the substrate with each comprising a substrate insulating layer patterned with substrate electrical interconnects, and via connections, extending from a top surface of the substrate to at least one of the substrate electrical interconnects; and
a power semiconductor module comprising power semiconductor devices each comprising device pads on a top surface of the respective power semiconductor device and backside contacts on a bottom surface of the respective power semiconductor device, the power semiconductor devices being coupled to a membrane structure, the membrane structure comprising a membrane insulating layer and membrane electrical interconnects over the membrane insulating layer and selectively extending to the device pads, wherein the backside contacts are coupled to selected substrate electrical interconnects or via connections.
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Accused Products
Abstract
A power circuit package includes a base including a substrate, a plurality of interconnect circuit layers over the substrate with each including a substrate insulating layer patterned with substrate electrical interconnects, and via connections extending from a top surface of the substrate to at least one of the substrate electrical interconnects; and a power semiconductor module including power semiconductor devices each including device pads on a top surface of the respective power semiconductor device and backside contacts on a bottom surface of the respective power semiconductor device, the power semiconductor devices being coupled to a membrane structure, the membrane structure including a membrane insulating layer and membrane electrical interconnects over the membrane insulating layer and selectively extending to the device pads, wherein the backside contacts are coupled to selected substrate electrical interconnects or via connections.
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Citations
22 Claims
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1. A power circuit package comprising:
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a base comprising a substrate, a plurality of interconnect circuit layers over the substrate with each comprising a substrate insulating layer patterned with substrate electrical interconnects, and via connections, extending from a top surface of the substrate to at least one of the substrate electrical interconnects; and
a power semiconductor module comprising power semiconductor devices each comprising device pads on a top surface of the respective power semiconductor device and backside contacts on a bottom surface of the respective power semiconductor device, the power semiconductor devices being coupled to a membrane structure, the membrane structure comprising a membrane insulating layer and membrane electrical interconnects over the membrane insulating layer and selectively extending to the device pads, wherein the backside contacts are coupled to selected substrate electrical interconnects or via connections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for fabricating a power circuit package comprising:
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providing a base comprising a substrate, a plurality of interconnect circuit layers over the substrate with each comprising a substrate insulating layer patterned with substrate electrical interconnects, and via connections extending from a top surface of the substrate to at least one of the electrical interconnects;
providing a power semiconductor module comprising power semiconductor devices each comprising device pads on a top surface and backside contacts on a bottom surface, the power semiconductor devices being coupled to a membrane structure, the membrane structure comprising a membrane insulating layer and membrane electrical interconnects over the membrane insulating layer and selectively extending to the device pads;
mounting the power semiconductor module to selected electrical interconnects or via connections of the base. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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Specification