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Controlling bond fronts in wafer-scale packaging

  • US 20070090479A1
  • Filed: 10/20/2005
  • Published: 04/26/2007
  • Est. Priority Date: 10/20/2005
  • Status: Abandoned Application
First Claim
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1. A system for controlling bond front propagation in wafer-scale packaging, comprising:

  • a first substrate;

    a second substrate; and

    a bonder pressure plate having protruded structures thereon to selectively establish at least one point of contact between said first and second substrates to initiate a bond front therebetween;

    wherein said protruded structures are selectively configured to control the propagation of said bond front.

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