Controlling bond fronts in wafer-scale packaging

• US 20070090479A1
• Filed: 10/20/2005
• Published: 04/26/2007
• Est. Priority Date: 10/20/2005
• Status: Abandoned Application

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Sand, Kirby, Chen, Chien-Hua, John, Bradley
• Application Number:
  US11/254,875
• Publication Number:
  US 20070090479A1
• Time in Patent Office: Days
• US Class Current: 257/433
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 2224/75305 comprising protrusions
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

A system for controlling bond front propagation in wafer-scale packaging includes a first substrate, a second substrate, and a bonder pressure plate having protruded structures thereon to selectively establish at least one point of contact between the first and second substrates to initiate a bond front therebetween. The protruded structures are selectively configured to control the propagation of the bond front.

Claims

1. A system for controlling bond front propagation in wafer-scale packaging, comprising:

a first substrate;

a second substrate; and

a bonder pressure plate having protruded structures thereon to selectively establish at least one point of contact between said first and second substrates to initiate a bond front therebetween;

wherein said protruded structures are selectively configured to control the propagation of said bond front.

2. The system of claim 1, wherein said first substrate is a pre-trenched glass substrate.

3. The system of claim 1, wherein said second substrate is an optical wafer containing microelectromechanical system devices.

4. The system of claim 1, wherein said protruded structures are configured into triangular wedges separated by grooves.

5. The system of claim 1, wherein said protruded structures form a grid-like array of protruded structures on said bonder pressure plate.

6. The system of claim 1, wherein said protruded structures are a plurality of protruded lines.

7. The system of claim 1, wherein said protruded structures are arranged in a line and ring pattern.

8. The system of claim 1, wherein said protruded structures are arranged in a raised ring pattern.

9. A method for controlling bond fronts in wafer-scale packaging, comprising:

providing a first substrate and a second substrate;

initiating a bond front between said first and second substrates by selectively establishing at least one point of contact therebetween; and

establishing said at least one point of contact by applying a bonder pressure plate having protruded structures disposed thereon.

10. A method for controlling bond fronts in wafer-scale packaging, comprising:

providing a first substrate and a second substrate;

establishing at least one point of contact between said first and second substrates by selectively positioning protruded structures on either of said first and second substrates; and

initiating a bond front between said first and second substrates at said at least one point of contact therebetween.

11. An apparatus for initiating bond fronts in wafer-scale packaging, comprising:

a generally planar plate; and

a plurality of protruded structures disposed on said generally planar plate for selectively establishing at least one point of contact between a first and a second substrate.

12. The apparatus of claim 11, wherein said protruded structures are configured into triangular wedges separated by grooves.

13. The apparatus of claim 11, wherein said protruded structures form a grid-like array of protruded structures on said bonder pressure plate.

14. The apparatus of claim 11, wherein said protruded structures are a plurality of protruded lines.

15. The apparatus of claim 11, wherein said protruded structures are arranged in a line and ring pattern.

16. The apparatus of claim 11, wherein said protruded structures are arranged in a raised ring pattern.

17. An apparatus for initiating bond fronts in wafer-scale packaging, comprising:

a generally planar plate; and

a means for initiating and controlling bond front propagation between a first and a second substrate.